TSMC 3DFABRIC

Taiwan Semiconductor Manufacturing Co., Ltd.

Application Filed: 2020-05-15
Trademark Application Details
Trademark Logo TSMC 3DFABRIC

Mark For: TSMC 3DFABRIC™ trademark registration is intended to cover the categories of semiconductors; computer memory chips, multiprocessor memory chips, semiconductor memory chips, silicon memory chips; semiconductor wafers, integrated circuit wafers, silicon wafers; integrated circuits. [all]

Status

2021-10-02 UTC
LIVE APPLICATION Under Examination
The trademark application has been accepted by the Office (has met the minimum filing requirements) and that this application has been assigned to an examiner.


Research OneLook Acronym Finder
Serial Number88918333
Mark Literal ElementsTSMC 3DFABRIC
Mark Drawing Type4 - STANDARD CHARACTER MARK
Mark TypeTRADEMARK. SERVICE MARK
RegisterPRINCIPAL
Current LocationINTENT TO USE SECTION 2021-04-06
Basis1(b)
Class StatusACTIVE
Primary US Classes
  • 021: Electrical Apparatus, Machines and Supplies
  • 023: Cutlery, Machinery, Tools and Parts Thereof
  • 026: Measuring and Scientific Appliances
  • 036: Musical Instruments and Supplies
  • 038: Prints and Publications
Primary International Class
  • 009 - Primary Class
  • (Electrical and scientific apparatus) Scientific, nautical, surveying, electric, photographic, cinematographic, optical, weighing, measuring, signaling, checking (supervision), lifesaving and teaching apparatus and instruments; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire-extinguishing apparatus.
Filed UseNo
Current UseNo
Intent To UseYes
Filed ITUYes
44D FiledNo
44E CurrentNo
66A CurrentNo
Current BasisNo
No BasisNo
Domestic RepresentativeNicole K. McLaughlin
Attorney NameNicole K. McLaughlin
Attorney Docket NumberN1085-02325

Timeline

2020-05-15Application Filed
2020-05-19Location: NEW APPLICATION PROCESSING
2020-05-19Status: Live/Pending
2020-05-19Transaction Date
2021-02-09Published
2021-04-06Location: INTENT TO USE SECTION
2021-09-29Status: A first request for extension of time to file a Statement of Use has been granted.

Trademark Parties (Applicants & Owners)

Party: Taiwan Semiconductor Manufacturing Co., Ltd.
AddressHsinchu Science Park No.8, Li-hsin Road 6 Hsinchu TAIWAN 300096
Legal Entity TypeCorporation
Legal Entity StateTAIWAN
Party: Taiwan Semiconductor Manufacturing Co.,Ltd.
AddressHsinchu Science Park No.8, Li-hsin Road 6 Hsinchu TW 300-77,R.
Legal Entity Type
Legal Entity State TW

*multiple parties listed, check assignment documents for ownership information

Documents

ApplicationMULTI2020-05-15
DrawingJPEG2020-05-15
Notation to FileXML2020-06-08
Offc Action OutgoingMULTI2020-06-08
XSearch Search SummaryXML2020-06-08
Response to Office ActionMULTI2020-12-04
Amendment and Mail Process CompleteMULTI2020-12-08
TRAM Snapshot of App at Pub for OppostnMULTI2021-01-05
Notice of PublicationXML2021-01-20
Notification Of Notice of PublicationXML2021-01-20
OG Publication ConfirmationXML2021-02-09
Notice of AllowanceXML2021-04-06
Change Address or Representation FormXML2021-07-14
Extension of Time to File SOUXML2021-09-29
ITU Extension ApprovalXML2021-10-01
ITU Unit ActionMULTI2021-10-01

Attorney of Record

NICOLE K. MCLAUGHLIN
DUANE MORRIS LLP
30 SOUTH 17TH STREET
PHILADELPHIA, PA 19103-4196

Good, Services, and Codes


IC 009. US 021 023 026 036 038. G & S: Semiconductors; computer memory chips, multiprocessor memory chips, semiconductor memory chips, silicon memory chips; semiconductor wafers, integrated circuit wafers, silicon wafers; integrated circuits
IC 040. US 100 103 106. G & S: Custom manufacture of semiconductors, memory chips, wafers and integrated circuits
IC 042. US 100 101. G & S: Product research, custom design and testing for new product development, and technology consultation services regarding electrical and electronic products, semiconductors, semiconductor systems, semiconductor cell libraries, wafer and integrated circuits

International Codes:9
U.S. Codes:021,023,026,036,038
International Codes:40
U.S. Codes:100,103,106
International Codes:42
U.S. Codes:100,101
Type CodeType
GS0091Semiconductors, memory chips, wafers and integrated circuits
GS0401Custom manufacture of semiconductors, memory chips, wafers and integrated circuits

Trademark Filing History

DescriptionDateProceeding Number
NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED2021-10-01
TEAS EXTENSION RECEIVED2021-09-29
EXTENSION 1 GRANTED2021-09-2998765
EXTENSION 1 FILED2021-09-2998765
TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED2021-07-14
TEAS CHANGE OF OWNER ADDRESS RECEIVED2021-07-14
TEAS CHANGE OF DOMESTIC REPRESENTATIVES ADDRESS2021-07-14
TEAS CHANGE OF CORRESPONDENCE RECEIVED2021-07-14
ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED2021-07-14
APPLICANT/CORRESPONDENCE CHANGES (NON-RESPONSIVE) ENTERED2021-07-1488888
NOA E-MAILED - SOU REQUIRED FROM APPLICANT2021-04-06
PUBLISHED FOR OPPOSITION2021-02-09
OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED2021-02-09
NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED2021-01-20
APPROVED FOR PUB - PRINCIPAL REGISTER2021-01-04
TEAS/EMAIL CORRESPONDENCE ENTERED2020-12-0588889
TEAS RESPONSE TO OFFICE ACTION RECEIVED2020-12-04
CORRESPONDENCE RECEIVED IN LAW OFFICE2020-12-0488889
NOTIFICATION OF NON-FINAL ACTION E-MAILED2020-06-086325
NON-FINAL ACTION WRITTEN2020-06-0891175
NON-FINAL ACTION E-MAILED2020-06-086325
ASSIGNED TO EXAMINER2020-06-0891175
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED IN TRAM2020-05-29
NEW APPLICATION ENTERED IN TRAM2020-05-19

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