MICROBOND

Heraeus Deutschland GmbH & Co. KG

Application Filed: 2019-05-14
Trademark Application Details
Trademark Logo MICROBOND

Mark For: MICROBOND® trademark registration is intended to cover the categories of soldering agent preparations; soldering preparations; soldering composition preparations. [all]

Status

2020-05-04 UTC
LIVE APPLICATION Published for Opposition
A pending trademark application has been examined by the Office and has been published in a way that provides an opportunity for the public to oppose its registration.


Research OneLook Acronym Finder
Serial Number88430130
Registration Number6262513
Mark Literal ElementsMICROBOND
Mark Drawing Type4 - STANDARD CHARACTER MARK
Mark TypeTRADEMARK
RegisterPRINCIPAL
Current LocationINTENT TO USE SECTION 2020-04-21
Basis1(b)
Class StatusACTIVE
Primary US Classes
  • 001: Raw or Partly Prepared Materials
  • 005: Adhesives
  • 006: Chemicals and Chemical Compositions
  • 010: Fertilizers
  • 026: Measuring and Scientific Appliances
  • 046: Foods and Ingredients of Foods
Primary International Class
  • 001 - Primary Class
  • (Chemicals) Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins, unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry.
Filed UseNo
Current UseNo
Intent To UseYes
Filed ITUNo
44D FiledYes
44E CurrentNo
66A CurrentNo
Current BasisNo
No BasisNo
Attorney NameNathaniel Kramer
Attorney Docket NumberHERAEUS 1256
Law Office AssignedN60
Employee NameEL-BAYEH, ALEXANDRA E

Timeline

2019-05-14Application Filed
2019-10-25Location: TMEG LAW OFFICE 101
2019-10-25Status: Live/Pending
2019-10-25Transaction Date
2020-02-25Published
2020-04-21Location: INTENT TO USE SECTION
2020-04-21Status: Notice of Allowance (NOA) sent (issued) to the applicant. Applicant must file a Statement of Use or Extension Request within six
2021-02-02Trademark Registered

Trademark Parties (Applicants & Owners)

Party: Heraeus Deutschland GmbH & Co. KG
AddressHeraeusstrasse 12-14 Hanau GERMANY 63450
Legal Entity TypeLimited Liability Company
Legal Entity StateGERMANY
Party: Heraeus Deutschland GmbH & Co. KG
AddressHeraeusstrasse 12-14 Hanau DE 63450
Legal Entity TypeLimited Liability Company
Legal Entity State DE

*multiple parties listed, check assignment documents for ownership information

Documents

ApplicationMULTI2019-05-14
DrawingJPEG2019-05-14
Offc Action OutgoingXML2019-07-20
XSearch Search SummaryXML2019-07-20
Paper Correspondence IncomingMULTI2019-08-15
Amendment and Mail Process CompleteMULTI2019-08-30
Suspension LetterXML2019-08-30
TEAS Rev, App and/or COA of Atty/Dom.RepXML2019-10-16
TEAS Rev, App and/or COA of Atty/Dom.RepAPPLICATION/XML2019-10-18
Paper Correspondence IncomingJPEG2019-10-24
Amendment and Mail Process CompleteAPPLICATION/XML,IMAGE/JPEG2019-10-26
Offc Action OutgoingXML2019-11-15
Response to Office ActionMULTI2020-01-15
Amendment and Mail Process CompleteMULTI2020-01-17
TRAM Snapshot of App at Pub for OppostnAPPLICATION/XML,IMAGE/JPEG2020-01-23
Notice of PublicationXML2020-02-05
Notification Of Notice of PublicationXML2020-02-05
OG Publication ConfirmationXML2020-02-25
Notice of AllowanceXML2020-04-21

Attorney of Record

Nathaniel Kramer
KIRSCHSTEIN, ISRAEL, SCHIFFMILLER & PIER
5TH FLOOR
425 FIFTH AVENUE
NEW YORK NY 10016

Good, Services, and Codes


IC 001. US 001 005 006 010 026 046. G & S: Soldering agent preparations; soldering preparations; soldering composition preparations
IC 006. US 002 012 013 014 023 025 050. G & S: Hard solder; soft solder; lead-free solder being solder wires; soldering metals, namely, soldering metals in bar form; soldering alloys, namely, soldering metal alloy rods and wire; solder rods of metal; solder wires; solder wires with built-in flux; common metals in powder form; hard solder powder; solder balls; soldering pastes; soldering creams
IC 009. US 021 023 026 036 038. G & S: lead-free solder in the electronics industry

International Codes:1
U.S. Codes:001,005,006,010,026,046
International Codes:6
U.S. Codes:002,012,013,014,023,025,050
International Codes:9
U.S. Codes:021,023,026,036,038
Type CodeType
GS0011Soldering agent preparations; soldering preparations; soldering composition preparations
GS0011Soldering agent preparations; soldering preparations; soldering composition preparations

Trademark Filing History

DescriptionDateProceeding Number
NOA E-MAILED - SOU REQUIRED FROM APPLICANT2020-04-21
PUBLISHED FOR OPPOSITION2020-02-25
OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED2020-02-25
NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED2020-02-05
APPROVED FOR PUB - PRINCIPAL REGISTER2020-01-22
TEAS/EMAIL CORRESPONDENCE ENTERED2020-01-1670884
CORRESPONDENCE RECEIVED IN LAW OFFICE2020-01-1670884
TEAS RESPONSE TO OFFICE ACTION RECEIVED2020-01-15
NOTIFICATION OF NON-FINAL ACTION E-MAILED2019-11-156325
NON-FINAL ACTION WRITTEN2019-11-1593926
NON-FINAL ACTION E-MAILED2019-11-156325
CORRESPONDENCE RECEIVED IN LAW OFFICE2019-10-2570884
ASSIGNED TO LIE2019-10-2570884
AMENDMENT FROM APPLICANT ENTERED2019-10-2570884
PAPER RECEIVED2019-10-24
TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED2019-10-18
ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED2019-10-18
TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED2019-10-16
ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED2019-10-16
SUSPENSION LETTER WRITTEN2019-08-3093926
NOTIFICATION OF LETTER OF SUSPENSION E-MAILED2019-08-306332
LETTER OF SUSPENSION E-MAILED2019-08-306332
CORRESPONDENCE RECEIVED IN LAW OFFICE2019-08-2976568
AMENDMENT FROM APPLICANT ENTERED2019-08-2976568
ASSIGNED TO LIE2019-08-2476568
PAPER RECEIVED2019-08-15
NOTIFICATION OF NON-FINAL ACTION E-MAILED2019-07-206325
NON-FINAL ACTION WRITTEN2019-07-2093926
NON-FINAL ACTION E-MAILED2019-07-206325
ASSIGNED TO EXAMINER2019-07-2093926
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED IN TRAM2019-05-30
NEW APPLICATION ENTERED IN TRAM2019-05-17

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