Research | OneLook Acronym Finder |
Serial Number | 85855636 |
Mark Drawing Code | 4000: Illustration: Drawing with word(s)/letter(s)/number(s) in Block form |
Domestic Representative | Scott S. Havlick |
Attorney Name | Scott S. Havlick |
Attorney Docket Number | 77307.0006 |
Law Office Assigned | M70 |
Employee Name | MARTIN, JENNIFER MCGAR |
2013-02-20 | Application Filed |
2013-12-11 | Abandon |
2014-01-06 | Location: TMO LAW OFFICE 116 - EXAMINING ATTORNEY ASSIGNED |
2014-01-06 | Status: Dead/Abandoned |
2018-07-08 | Transaction Date |
Owner: | Hitachi Chemical Company, Ltd. |
Address | 9-2, Marunouchi 1-chome Chiyoda-ku, Tokyo JP 100-6606 |
Legal Entity Type | Corporation |
Legal Entity State | JP |
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International Codes: | 1 |
U.S. Codes: | 001,005,006,010,026,046 |
International Codes: | 17 |
U.S. Codes: | 001,005,012,013,035,050 |
Type Code | Type |
---|---|
GS0011 | Photosensitive Dry Films (Photoresist films or Photo sensitive films); Photopolymer films used in the manufacture of printed circuit boards; Photosensitive Dry Films used in the manufacture of PDPs (Plasma Display Panels); Photosensitive Dry Films used in the manufacture of touch panel; Photosensitive Dry Films used in the manufacture of LED (Light Emitting Diode) base plates; Photosensitive Dry Films used in the manufacture of metal masks; Photosensitive Dry Films used in the formation of bump in printed wiring boards; Photosensitive Dry Films used in the formation of wiring in printed wiring boards; Photosensitive Dry Films used in the formation of ribs for PDPs (Plasma Display Panels); Photosensitive Dry Films for use as coating resist; Photosensitive Dry Films for use as etching resist; Photosensitive Dry Films for use as resist in sandblasting processes; Photosensitive Dry Films for use as resist in chemical milling; Photosensitive Dry Films for use as photosensitive coverlay film of FPCs (flexible printed wiring boards); Photosensitive Dry Films photosensitive solder resist of printed wiring board; Photo resist liquids; Photo resist pastes; Solder resist; Coverlay |
Description | Date | Event Coding |
---|---|---|
NEW APPLICATION ENTERED IN TRAM | 2013-02-24 | 1 NWAP I:Incoming Correspondence |
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED IN TRAM | 2013-02-27 | 2 NWOS I:Incoming Correspondence |
NOTICE OF PSEUDO MARK E-MAILED | 2013-02-28 | 3 MPMK E:E-Mail |
ASSIGNED TO EXAMINER | 2013-06-03 | 4 DOCK D:Assigned to Examiner |
NON-FINAL ACTION WRITTEN | 2013-06-10 | 5 CNRT R:Renewal |
NON-FINAL ACTION E-MAILED | 2013-06-10 | 6 GNRT F:First Action |
NOTIFICATION OF NON-FINAL ACTION E-MAILED | 2013-06-10 | 7 GNRN O:Outgoing Correspondence |
ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE | 2014-01-06 | 8 ABN2 O:Outgoing Correspondence |
ABANDONMENT NOTICE MAILED - FAILURE TO RESPOND | 2014-01-06 | 9 MAB2 O:Outgoing Correspondence |
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