Mark For: MICRED® trademark registration is intended to cover the categories of computer software for use in the design of electronic equipment and systems through thermal simulation, analysis and characterization and predicting heat flow and transfer; and, thermal measurement equipment for use in thermal analysis and characterization of integrated circuit packages, multi-chip packages and printed circuit boards, and thermal, and combined radiometric and photometric analysis and characterization of light emitting diodes, namely, microelectromechanical systems - MEMS - comprised of microchips, multi-chip modules, printed circuit board and system enclosures, namely, computer boxes, computer racks, and computer housings, and combined instruments for the analysis of thermal, radiometric and photometric characteristics of circuit packages, multi-chip packages and printed circuit boards.
Status
2023-12-10 UTC
LIVE REGISTRATION Issued and Active
The trademark application has been registered with the Office.
(Electrical and scientific apparatus) Scientific, nautical, surveying, electric, photographic, cinematographic, optical, weighing, measuring, signaling, checking (supervision), lifesaving and teaching apparatus and instruments; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire-extinguishing apparatus.
Computer software for use in the design of electronic equipment and systems through thermal simulation, analysis and characterization and predicting heat flow and transfer; and, thermal measurement equipment for use in thermal analysis and characterization of integrated circuit packages, multi-chip packages and printed circuit boards, and thermal, and combined radiometric and photometric analysis and characterization of light emitting diodes, namely, microelectromechanical systems - MEMS - comprised of microchips, multi-chip modules, printed circuit board and system enclosures, namely, computer boxes, computer racks, and computer housings, and combined instruments for the analysis of thermal, radiometric and photometric characteristics of circuit packages, multi-chip packages and printed circuit boards
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