NANOSURFACE

Mark For: NANOSURFACE® trademark registration is intended to cover the categories of polishing preparations, namely, polishing slurry, polishing sheets, polishing films, polishing tapes, polishing pads and abrasive coatings for use in the field of surface and edge polishing of semiconductor wafers, and for use in the field of surface polishing, surface texturing, and surface burnishing and cleaning of magnetic disks; and polishing slurry, polishing sheets, polishing films and polishing tapes for use in the field of end polishing of optical fiber devices. [all]

Status

2022-06-08 UTC
⟳ Refresh

DEAD REGISTRATION Cancelled Invalidated

Research	OneLook Acronym Finder
Serial Number	76565240
Registration Number	3256783
Mark Literal Elements	NANOSURFACE
Mark Drawing Type	3 - AN ILLUSTRATION DRAWING WHICH INCLUDES WORD(S)/ LETTER(S)/NUMBER(S)
Mark Type	TRADEMARK
Standard Character Claim	No
Register	PRINCIPAL
Current Location	PUBLICATION AND ISSUE SECTION 2007-05-22
Basis	1(a)
Class Status	SECTION 8 - CANCEL
Primary US Classes	001: Raw or Partly Prepared Materials 004: Abrasives and Polishing Materials 006: Chemicals and Chemical Compositions 050: Merchandise Not Otherwise Classified 051: Cosmetics and Toilet Preparations 052: Detergents and Soaps
Primary International Class	003 - Primary Class (Cosmetics and cleaning preparations) Bleaching preparations and other substances for laundry use; cleaning, polishing, scouring and abrasive preparations; soaps; perfumery, essential oils, cosmetics, hair lotions; dentifrices.
Filed Use	No
Current Use	Yes
Intent To Use	No
Filed ITU	Yes
44D Filed	Yes
44E Current	No
66A Current	No
Current Basis	No
No Basis	No
Cancellation Code	2
Domestic Representative	Michael L. Louie
Attorney Name	James E. Austin
Law Office Assigned	L20
Employee Name	BEYER, ELIZABETH L

Timeline

(CANCELLED)
IC 003. US 001 004 006 050 051 052. G & S: Polishing preparations, namely, polishing slurry, polishing sheets, polishing films, polishing tapes, polishing pads and abrasive coatings for use in the field of surface and edge polishing of semiconductor wafers, and for use in the field of surface polishing, surface texturing, and surface burnishing and cleaning of magnetic disks; and polishing slurry, polishing sheets, polishing films and polishing tapes for use in the field of end polishing of optical fiber devices. FIRST USE: 20020400. FIRST USE IN COMMERCE: 20020400