The mark is presented without any claim as to special form.
Mark For: TMS™ trademark registration is intended to cover the categories of thermally conductive interface materials, gap filling compounds, and molding compounds for use in the electronic industry. [all]
Status
2022-08-23 UTC
DEAD APPLICATION Refused Dismissed or Invalidated
This trademark application was refused, dismissed, or invalidated by the Office and this application is no longer active.
(Chemicals) Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins, unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry.
Filed Use
No
Current Use
No
Intent To Use
Yes
Filed ITU
Yes
44D Filed
No
44E Current
No
66A Current
No
Current Basis
No
No Basis
No
Attorney Name
ROBERT D. FISH
Attorney Docket Number
772.02-US
Law Office Assigned
M60
Employee Name
PRATER, JILL I
Timeline
2001-06-26
Application Filed
2002-03-06
Abandon
2002-05-22
Status: Abandoned because the applicant failed to respond or filed a late response to an Office action. To view all documents in this fi
ROBERT D. FISH FISH & ASSOCIATES, LLP 1440 N. HARBOR BLVD., SUITE 706 FULLERTON, CA 92835
Good, Services, and Codes
(ABANDONED) IC 001. US 001 005 006 010 026 046. G & S: thermally conductive interface materials, gap filling compounds, and molding compounds for use in the electronic industry(ABANDONED) IC 009. US 021 023 026 036 038. G & S: circuit boards(ABANDONED) IC 042. US 100 101. G & S: designing and fabricating thermal interface materials, products to dissipate heat, and circuit boards for others
International Codes:
1
U.S. Codes:
001,005,006,010,026,046
International Codes:
9
U.S. Codes:
021,023,026,036,038
International Codes:
42
U.S. Codes:
100,101
Type Code
Type
DM0000
The mark is presented without any claim as to special form.
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Future Thermal Materials Corporation
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