KRONOS

Mark For: KRONOS® trademark registration is intended to cover the categories of machines for the manufacture of semiconductor substrates, silicon disks, wafers, liquid crystal display substrates, liquid crystal displays, semiconductor chips and/or solar cells; machines for drying, cleaning and/or etching silicon wafers for use in the manufacture of semiconductor chips; wet processing machines for use in the manufacture of semiconductor chips and wet processing machines for oxidation of ozonized water or ozone by diluted hydrofluoric and hydrochloric acid and for particle removal in an ammonia and hydrogen peroxide acid bath, all for use on semiconductor substrates and wafers, silicon wafers, liquid crystal display substrates, liquid crystal displays, solar cells; and drying units using nitrogen, alcohol vapors and/or mixtures thereof for use on semiconductor substrates and wafers, silicon wafers, liquid crystal display substrates, liquid crystal display, solar cells, as machine parts. [all]

Status

2022-09-04 UTC
⟳ Refresh

DEAD REGISTRATION Cancelled Invalidated

Research	OneLook Acronym Finder
Serial Number	76236977
Registration Number	2558579
Mark Literal Elements	KRONOS
Mark Drawing Type	1 - TYPESET WORD(S) /LETTER(S) /NUMBER(S)
Mark Type	TRADEMARK. SERVICE MARK
Standard Character Claim	No
Register	PRINCIPAL
Current Location	SCANNING ON DEMAND 2007-05-21
Basis	44(e)
Class Status	SECTION 8 - CANCEL
Primary US Classes	013: Hardware, Plumbing and Steamfitting Supplies 019: Vehicles 021: Electrical Apparatus, Machines and Supplies 023: Cutlery, Machinery, Tools and Parts Thereof 031: Filters and Refrigerators 034: Heating, Lighting and Ventilating Apparatus 035: Belting, Hose, Machinery Packing and Non-Metallic Tires
Primary International Class	007 - Primary Class (Machinery) Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs.
Filed Use	No
Current Use	No
Intent To Use	No
Filed ITU	No
44D Filed	Yes
44E Current	Yes
66A Current	No
Current Basis	No
No Basis	No
Cancellation Code	2
Domestic Representative	Robert W. Becker
Attorney Name	Robert W. Becker
Law Office Assigned	L40
Employee Name	FRYE, KIMBERLY

Timeline

(CANCELLED)
IC 007. US 013 019 021 023 031 034 035. G & S: Machines for the manufacture of semiconductor substrates, silicon disks, wafers, liquid crystal display substrates, liquid crystal displays, semiconductor chips and/or solar cells; machines for drying, cleaning and/or etching silicon wafers for use in the manufacture of semiconductor chips; wet processing machines for use in the manufacture of semiconductor chips and wet processing machines for oxidation of ozonized water or ozone by diluted hydrofluoric and hydrochloric acid and for particle removal in an ammonia and hydrogen peroxide acid bath, all for use on semiconductor substrates and wafers, silicon wafers, liquid crystal display substrates, liquid crystal displays, solar cells; and drying units using nitrogen, alcohol vapors and/or mixtures thereof for use on semiconductor substrates and wafers, silicon wafers, liquid crystal display substrates, liquid crystal display, solar cells, as machine parts(CANCELLED)
IC 011. US 013 021 023 031 034. G & S: Drying and wet processing units for the treatment of semiconductor substrates, silicon chips, wafers, liquid crystal substrates, liquid crystal displays, semiconductor wafers and solar cells as well as their surfaces(CANCELLED)
IC 037. US 100 103 106. G & S: Installation and servicing of the following machines and units; machines for manufacturing semiconductor substrates, silicon chips, wafers, liquid crystal display substrates, liquid crystal displays, semiconductor chips and/or solar cells; machines for drying, cleaning and/or etching silicon wafers for use in the manufacture of semiconductor chips; wet processing machines for use in the manufacture of semiconductor chips and wet processing machines for oxidation by diluted hydrofluoric and hydrochloric acid and for particle removal in an ammonia and hydrogen peroxide acid bath, all for use on semiconductor substrates and wafers, silicon wafers, liquid crystal display substrates, liquid crystal displays, solar cells; and drying units using nitrogen, alcohol vapors and/or mixtures thereof for use on semiconductor substrates and wafers, silicon wafers, liquid crystal display substrates, liquid crystal displays, solar cells, as machine parts; drying and wet processing units for the treatment of semiconductor substrates, silicon chips, wafers, liquid crystal substrates, liquid crystal displays, semiconductor wafers and solar cells as well as their surfaces