Mark For: STAYCHIP® trademark registration is intended to cover the categories of underfill and encapsulant materials, namely thermoplastic or thermoset polymeric materials used in assembly of printed circuit boards or semiconductor packaging. [all]
Status
2022-10-14 UTC
DEAD REGISTRATION Cancelled Invalidated
The trademark application was registered, but subsequently it was cancelled or invalidated and removed from the registry.
035:
Belting, Hose, Machinery Packing and Non-Metallic Tires
050:
Merchandise Not Otherwise Classified
Primary International Class
017 - Primary Class
(Rubber goods) Rubber, gutta-percha, gum, asbestos, mica and goods made from these materials and not included in other classes; plastics in extruded form for use in manufacture; packing, stopping and insulating materials; flexible pipes, not of metal.
Filed Use
Yes
Current Use
Yes
Intent To Use
No
Filed ITU
No
44D Filed
No
44E Current
No
66A Current
No
Current Basis
No
No Basis
No
Cancellation Code
2
Attorney Name
William M. Borchard
Attorney Docket Number
13130-01
Law Office Assigned
M20
Employee Name
BELLO, ZACHARY R
Timeline
1999-06-00
Date of First Use
1999-06-01
Date of First Use
1999-06-01
Date of Use In Commerce
2000-06-09
Application Filed
2003-04-08
Published
2003-04-08
Published for Opposition
2003-07-01
Trademark Registered
2008-01-02
Location: SCANNING ON DEMAND
2010-02-06
Cancelled
2010-02-06
Status: Dead/Cancelled
2010-02-06
Status: Registration cancelled because registrant did not file an acceptable declaration under Section 8. To view all documents in this
WILLIAM M. BORCHARD COWAN, LIEBOWITZ & LATMAN, P.C. 1133 AVENUE OF THE AMERICAS NEW YORK, NY 10036-6799
Good, Services, and Codes
(CANCELLED) IC 017. US 001 005 012 013 035 050. G & S: UNDERFILL AND ENCAPSULANT MATERIALS, NAMELY THERMOPLAST IC OR THERMOSET POLYMER IC MATERIALS USED IN ASSEMBLY OF PRINTED CIRCUIT BOARDS OR SEMICONDUCTOR PACKAGING. FIRST USE: 19990600. FIRST USE IN COMMERCE: 19990600
International Codes:
17
U.S. Codes:
001,005,012,013,035,050
Type Code
Type
GS0171
UNDERFILL AND ENCAPSULANT MATERIALS, NAMELY THERMOPLASTIC OR THERMOSET POLYMERIC MATERIALS USED IN ASSEMBLY OF PRINTED CIRCUIT BOARDS OR SEMICONDUCTOR PACKAGING
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