DEXTER
Dexter Corporation
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Acronym Finder
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| Serial Number | 75433269 |
| Mark Drawing Code | 3S11: Illustration: Drawing or design which also includes word(s)/ letter(s)/number(s) |
| Attorney Name | JAMES E ALIX |
| Attorney Docket Number | DC/T83/1/US |
| Law Office Assigned | L50 |
| Employee Name | WARD CLARKE, JOYCE ANN |
Timeline
| 1998-02-12 | Application Filed |
| 2000-12-26 | Published for Opposition |
| 2001-09-21 | Abandon |
| 2001-09-21 | Status: Dead/Abandoned |
| 2002-07-26 | Location: FILE REPOSITORY (FRANCONIA) |
| 2018-07-08 | Transaction Date |
Trademark Applicants & Owners
| Owner: |  DEXTER CORPORATION |
| Name Change Details | NC20000001BY CHANGE OF NAME|NC99990001BY CHANGE OF NAME |
| Address | ONE ELM STREET WINDSOR LOCKS CT 06096 |
| Legal Entity Type | Corporation |
| Legal Entity State | CT |
Documents
Click the blue "Refresh" button to load certificates, specimines, application, and other documents.
Design Search Codes
| 010106 | Stars with rays or radiating lines |
Attorney of Record
Good, Services, and Codes
| International Codes: | 1 |
| U.S. Codes: | 001,005,006,010,026,046 |
| International Codes: | 2 |
| U.S. Codes: | 006,011,016 |
| International Codes: | 6 |
| U.S. Codes: | 002,012,013,014,023,025,050 |
| International Codes: | 7 |
| U.S. Codes: | 013,019,021,023,031,034,035 |
| International Codes: | 9 |
| U.S. Codes: | 021,023,026,036,038 |
| International Codes: | 16 |
| U.S. Codes: | 002,005,022,023,029,037,038,050 |
| International Codes: | 17 |
| U.S. Codes: | 001,005,012,013,035,050 |
| International Codes: | 24 |
| U.S. Codes: | 042,050 |
| Type Code | Type |
|---|---|
| GS0011 | Epoxy adhesive systems comprised of adhesives for use in applying wall coverings and epoxy glue for general bonding and repairs; epoxy adhesive patch kits consisting primarily of epoxy glue and adhesives for use in general bonding and repair in the aerospace industry; paste and film adhesives for use in the manufacture of aerospace trustees and for general industrial use in the aerospace industry; mold release compounds for use in the manufacture of rubber and composite moldings; hot melt adhesives for general industrial use; methyl methacrylate adhesive preparations for use in the aerospace, transportation and electronics industries; liquid and powder encapsulating coating compounds for use in the microelectronic and electronics industries and for use in the manufacture of electrical components; polymeric soldering chemicals for use in the manufacture of electronics and computer circuit boards; and epoxy, bismalemide and silver glass dye chemical preparations for use in attaching materials for electronic assembly for use in the electronics industry |
Trademark Filing History
| Description | Date | Event Coding |
|---|---|---|
| ASSIGNED TO EXAMINER | 1998-09-24 | 1 DOCK D:Assigned to Examiner |
| NON-FINAL ACTION MAILED | 1998-10-13 | 2 CNRT F:First Action |
| CORRESPONDENCE RECEIVED IN LAW OFFICE | 1999-04-12 | 3 CRFA I:Incoming Correspondence |
| FINAL REFUSAL MAILED | 1999-12-09 | 4 CNFR O:Outgoing Correspondence |
| CORRESPONDENCE RECEIVED IN LAW OFFICE | 2000-03-16 | 5 CRFA I:Incoming Correspondence |
| APPROVED FOR PUB - PRINCIPAL REGISTER | 2000-08-14 | 6 CNSA P: |
| NOTICE OF PUBLICATION | 2000-11-24 | 7 NPUB O:Outgoing Correspondence |
| PUBLISHED FOR OPPOSITION | 2000-12-26 | 8 PUBO A:Allowance for Publication |
| NOA MAILED - SOU REQUIRED FROM APPLICANT | 2001-03-20 | 9 NOAM O:Outgoing Correspondence |
| ABANDONMENT - NO USE STATEMENT FILED | 2002-01-16 | 10 ABN6 S: |
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