U.S. patent number RE47,371 [Application Number 14/070,986] was granted by the patent office on 2019-04-30 for liquid crystal display device.
This patent grant is currently assigned to Samsung Display Co., Ltd.. The grantee listed for this patent is SAMSUNG DISPLAY CO., LTD.. Invention is credited to Se-In Chang, Jin-Ho Ha.
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United States Patent |
RE47,371 |
Ha , et al. |
April 30, 2019 |
Liquid crystal display device
Abstract
Disclosed are a liquid crystal display (LCD) device and a method
for assembling the LCD device. The LCD device has a display section
for displaying images, a receiving container for receiving the
display section, a power supplying section for supplying a power
source to the display section, a signal converting section for
converting signals from the display section and a securing section
for securing the power supplying section and the signal converting
section to the receiving container. The power supplying section and
the signal converting section are disposed between the display
section and the securing section that is directly facing to a rear
surface of the receiving container. Accordingly, a total thickness
and weight of the LCD device can be minimized and an assembly
facility of the LCD device can be improved.
Inventors: |
Ha; Jin-Ho (Suwon-si,
KR), Chang; Se-In (Suwon-si, KR) |
Applicant: |
Name |
City |
State |
Country |
Type |
SAMSUNG DISPLAY CO., LTD. |
Yongin, Gyeonggi-Do |
N/A |
KR |
|
|
Assignee: |
Samsung Display Co., Ltd.
(KR)
|
Family
ID: |
1000001823594 |
Appl.
No.: |
14/070,986 |
Filed: |
November 4, 2013 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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12509354 |
Jul 24, 2009 |
RE44574 |
|
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11028758 |
Aug 29, 2006 |
7098984 |
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10190561 |
May 17, 2005 |
6894757 |
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Reissue of: |
11434984 |
May 15, 2006 |
7248327 |
Jul 24, 2007 |
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Reissue of: |
11434984 |
May 15, 2006 |
7248327 |
Jul 24, 2007 |
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Foreign Application Priority Data
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Jul 10, 2001 [KR] |
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10-2001-0041036 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G02F
1/133308 (20130101); G06F 1/1601 (20130101); G02F
1/133615 (20130101); G02F 1/13452 (20130101); G02F
1/133612 (20210101); G02F 1/133314 (20210101); G02F
1/133334 (20210101); G06F 2200/1612 (20130101); G02F
1/133608 (20130101); G02F 1/133512 (20130101) |
Current International
Class: |
G02F
1/1345 (20060101) |
Field of
Search: |
;349/58,110,111,149 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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1153913 |
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Jul 1997 |
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CN |
|
1153913 |
|
Jul 1997 |
|
CN |
|
1198540 |
|
Nov 1998 |
|
CN |
|
1198540 |
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Nov 1998 |
|
CN |
|
1272634 |
|
Nov 2000 |
|
CN |
|
1272634 |
|
Nov 2000 |
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CN |
|
3050957 |
|
Jan 1998 |
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JP |
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3050957 |
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May 1998 |
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JP |
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2000-333100 |
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Nov 2000 |
|
JP |
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2000-340991 |
|
Dec 2000 |
|
JP |
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2001-117094 |
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Apr 2001 |
|
JP |
|
2001-183627 |
|
Jul 2001 |
|
JP |
|
Other References
Japanese Patent Publication No. 3050957, May 20, 1998, 1 p. cited
by applicant .
Japanese Patent Publication No. 2000-333100, Nov. 30, 2000, 1 p.
cited by applicant .
Japanese Patent Publication No. 2000-340991, Dec. 8, 2000, 1 p.
cited by applicant .
Japanese Patent Publication No. 2001-117094, Apr. 27, 2001, 1 p.
cited by applicant .
Japanese Patent Publication No. 2001-183627, Jul. 6, 2001, 1 p.
cited by applicant.
|
Primary Examiner: Tran; Henry N
Attorney, Agent or Firm: Innovation Counsel LLP
Parent Case Text
CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a .Iadd.continuation of reissue application
U.S. patent application Ser. No. 12/509,354 filed on Jul. 24, 2009,
and is a reissue application of U.S. patent application Ser. No.
11/434,984 filed on May 15, 2006 and issued as U.S. Pat. No.
7,248,327, which is a .Iaddend.continuation of U.S. patent
application Ser. No. 11,028,758 filed Jan. 5, 2005 now U.S. Pat.
No. 7,098,984 by Jin-Ho Ha and Se-In Chang entitled "LIQUID CRYSTAL
DISPLAY DEVICE," which is a continuation of U.S. patent application
Ser. No. 10/190,561 filed Jul. 9, 2002, now U.S. Pat. No. .[.6,894
757.]. .Iadd.6,894,757 .Iaddend.which claims priority of Korean
Patent Application No. .[.10-2001-41036.]. .Iadd.10-2001-0041036
.Iaddend.filed Jul. 10, 2001. .Iadd.Notice: More than one reissue
application has been filed for the reissue of U.S. Pat. No.
7,248,327. The reissue applications are application Ser. No.
14/070,986 (the present application), filed on Nov. 4, 2013; and
Ser. No. 12/509,345, filed on Jul. 24, 2009, now U.S. Pat. No.
RE44574..Iaddend.
Claims
What is claimed is:
1. A liquid crystal display (LCD) device, comprising: a display
unit; a receiving unit receiving the display unit; an integrated
printed circuit board (PCB) mounted on a back surface of the
receiving unit .Iadd.and comprising a power supply unit configured
to supply electric power for the display unit, a signal converting
unit configured to convert image signals, a display driving unit
configured to drive the display unit based on the converted image
signals.Iaddend.; a power supply line fixed to the back surface of
the receiving unit, the power supply line comprising at least one
of a first power supply line configured to supply electric power to
the display unit and a second power supply line configured to
supply electric power to the integrated PCB; and a shielding unit
mounted on the back surface of the receiving unit and covering the
integrated PCB to shield electromagnetic waves therefrom, wherein
the shielding unit is mounted on .[.a center portion of.]. the back
surface of the receiving unit .Iadd.to cover at least one of the
power supply unit, the signal converting unit and the display
driving unit .Iaddend.such that .[.at least two opposite edges of
the back surface of the receiving unit are exposed at predetermined
widths.]. .Iadd.a majority of the back surface of the receiving
unit is exposed.Iaddend..
.[.2. The LCD device of claim 1, further comprising: a power supply
unit mounted on the back surface of the receiving unit and
electrically connected to the power supply line; and a signal
converting unit mounted on the back surface of the receiving unit,
wherein the shielding unit covers the power supply unit and the
signal converting unit to shield electromagnetic waves
therefrom..].
.[.3. The LCD device of claim 2, wherein the shielding unit
comprises a connection portion, and the first power supply line and
the second power supply line are connected to the power supply unit
through the connection portion..].
.[.4. The LCD device of claim 3, wherein the connection portion is
an opening formed at a sidewall of the shielding unit..].
.[.5. The LCD device of claim 2, further comprising a connecting
line connected between the power supply unit and the signal
converting unit..].
.[.6. The LCD device of claim 5, wherein the shielding unit further
comprises a window for checking a connection with the connecting
line..].
.[.7. The LCD device of claim 2, further comprising a data signal
line transmitting an externally provided data signal to the signal
converting unit..].
8. A liquid crystal display (LCD) device, comprising: a display
unit; a receiving unit having a bottom chassis receiving the
display unit; a printed circuit board (PCB) mounted on a back
surface of the receiving unit .Iadd.and comprising a power supply
unit configured to supply electric power for the display unit, a
signal converting unit configured to convert image signals, a
display driving unit configured to drive the display unit based on
the converted image signals.Iaddend.; a first power supply line
transmitting electric power to a .[.lamp.]. .Iadd.backlight
.Iaddend.of the display unit; a second power supply line
transmitting electric power to the PCB, .Iadd.wherein .Iaddend.the
first and second power supply lines being fixed to the back surface
of the receiving unit;.[.and.]. a shielding unit mounted on the
back surface of the receiving unit and covering the PCB to shield
electromagnetic waves therefrom; .Iadd.and.Iaddend. wherein the
shielding unit .[.comprises a connection portion, and the PCB is
connected to an external power line via the connection portion.].
.Iadd.is mounted on the back surface of the receiving unit to cover
at least one of the power supply unit, the signal converting unit
and the display driving unit such that a majority of the back
surface of the receiving unit is exposed.Iaddend..
.[.9. The LCD device of claim 8, wherein the shielding unit is
mounted on a center portion of the back surface of the receiving
unit such that at least two opposite edges of the receiving unit
are exposed at predetermined widths..].
.[.10. The LCD device of claim 8, further comprising a securing
member securing the first power supply line and the second power
supply line to the back surface of the receiving unit, the securing
member including: a belt type securing band having a first
through-hole and a second through-hole arranged at both ends of the
securing band, respectively, and being bent such that the first
through-hole and the second through-hole are arranged adjacent to
each other to receive the first power supply line and the second
power supply line; and a first locking screw that extends through
the first through-hole and the second through-hole of the securing
band to secure the securing band to the bottom chassis..].
.[.11. The LCD device of claim 8, wherein the PCB comprises a
signal converting unit mounted on the back surface of the receiving
unit..].
.[.12. The LCD device of claim 11, wherein the PCB further
comprises an integrated PCB coupled between the signal converting
unit and the displaying unit to control the display unit..].
.[.13. The LCD device of claim 8, wherein the PCB comprises a power
supply unit mounted on the back surface of the receiving
unit..].
.[.14. The LCD device of claim 8, wherein the receiving unit
comprises a mold frame and a bottom chassis..].
.Iadd.15. The LCD device of claim 1, wherein the shielding unit is
mounted on a center portion of the back surface of the receiving
unit such that at least two opposite edges of the back surface of
the receiving unit are exposed at predetermined
widths..Iaddend.
.Iadd.16. The LCD device of claim 1, wherein the shielding unit
comprises a connection portion, and the first power supply line and
the second power supply line are connected to the power supply unit
through the connection portion..Iaddend.
.Iadd.17. The LCD device of claim 16, wherein the connection
portion is an opening formed at a sidewall of the shielding
unit..Iaddend.
.Iadd.18. The LCD device of claim 1, further comprising a
connecting line connected between the power supply unit and the
signal converting unit..Iaddend.
.Iadd.19. The LCD device of claim 18, wherein the shielding unit
further comprises a window for checking a connection with the
connecting line..Iaddend.
.Iadd.20. The LCD device of claim 1, further comprising a data
signal line transmitting an externally provided data signal to the
signal converting unit..Iaddend.
.Iadd.21. The LCD device of claim 8, wherein the shielding unit is
mounted on a center portion of the back surface of the receiving
unit such that at least two opposite edges of the receiving unit
are exposed at predetermined widths..Iaddend.
.Iadd.22. The LCD device of claim 8, wherein the shielding unit
comprises a connection portion, and the PCB is connected to an
external power line via the connection portion..Iaddend.
.Iadd.23. The LCD device of claim 8, wherein the receiving unit
comprises a mold frame..Iaddend.
Description
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a liquid crystal display device
(LCD), and more particularly, to a LCD device of which a size and a
weight are reduced.
2. Description of the Related Art
In recent times, information processing devices continue to rapidly
develop with various architectures, functions and faster
information processing speed. Information processed in these
information processing devices has an electrical signal format. In
order to visually confirm information processed in the information
processing device, a display as an interface should be
provided.
Recently, a LCD device that is lighter, and smaller than a CRT type
display device has been developed. The LCD device has a full color
displaying function and a high resolution. As a result, the LCD
device is widely used as a monitor of a computer, a television, and
another display device.
The LCD device applies a voltage to a predetermined molecular
arrangement of a liquid crystal to convert the molecular
arrangement to another molecular arrangement. The LCD device
converts the changes of optical properties to visional changes and
uses the modulation of a light by using a liquid crystal cell.
LCD devices are divided into to a TN (Twisted Nematic) type and a
STN (Super-Twisted Nematic) type, and are also divided into an
active matrix display type that uses a switching device and a TN
liquid crystal and a passive matrix display type that uses a STN
liquid crystal according to the driving type.
The active matrix display type is used in a TFT-LCD and drives an
LCD by using a thin film transistor (TFT) as a switch. The passive
matrix display type does not use any transistor and does not need a
complex circuit.
Further, LCD devices are divided into a transparent LCD device that
uses a backlight and a reflective LCD device that uses an exterior
light source according to a method for using a light source.
The transparent LCD device that uses the back light as a light
source has a heavy weight and a large volume due to the existence
of the back light, but is widely used since it independently
displays an image without using an exterior light source.
FIG. 1 is an exploded perspective view schematically showing a
conventional LCD device 100. FIG. 2 is a sectional view showing a
combination construction of the LCD device 100 shown in FIG. 1.
Referring to FIG. 1, the LCD device 100 has a LCD module 130 for
displaying an image when an image signal is applied thereto and
front and rear cases 110 and 120 for receiving the LCD module 130.
The LCD module 130 includes a display unit 170 having a LCD panel
for displaying the image and a backlight assembly 150 for supplying
light to the display unit 170.
The display unit 170 includes a LCD panel 171, a data side printed
circuit board 176, a gate side printed circuit board 175, a data
side tape carrier package 178 and a gate side tape carrier package
174.
The LCD panel 171 has a TFT substrate 172, a color filter substrate
173 and liquid crystal (not shown).
The TFT substrate 172 is a transparent glass board on which the
TFTs are formed in a matrix type. Data lines are respectively
connected to source terminals of the TFTs and gate lines connected
with gate terminals of the TFTs. Furthermore, pixel electrodes are
respectively formed at drain terminals of the TFTs, which are
comprised of a transparent conductive material such as Indium Tin
Oxide (ITO).
The color filter substrate 173 faces to the TFT substrate 172. RGB
pixels are formed on the color filter substrate 173 via a thin film
process, which gives a predetermined color while the light passes
through the color filter substrate 173. Common electrodes made of
ITO are coated on the front surface of the color filter substrate
173.
When the TFTs of the TFT substrate 172 are turned on by applying
electric power to the gate terminals and to the source terminals of
the TFTs, an electric field is formed between the pixel electrodes
of the TFT substrate 172 and the common electrodes of the color
filter substrate 173. The electric field forces the liquid crystal,
which is injected between the TFT substrate 172 and the color
filter substrate 173, to change the array angle thereof, resulting
in that the transmission of the light is changed. As a result, the
desired pixels are obtained.
Meanwhile, a driving signal and a timing signal are applied to the
gate lines and data lines of the TFT to control the array angle of
the liquid crystal and the time of arraying the liquid crystal in
the LCD panel 171. As shown in FIG. 1, the data side tape carrier
package 178 that is comprised of flexible circuit boards, is
attached to the source portion of the LCD panel 171 to decide a
time of applying a data driving signal. On the other hand, the gate
side tape carrier package 174 is attached to the gate portion of
the LCD panel 171 to decide an application time of a gate driving
signal.
The data side printed circuit board 176 and the gate side printed
circuit board 175, which respectively apply the driving signal to
the gate line and to the data line as soon as receiving image
signals input from outside of the LCD panel 171, make contact with
the data side tape carrier package 178 for the data line and the
gate side tape carrier package 174 for the gate line in the LCD
panel 171, respectively. A source portion is formed on the data
side printed circuit board 176 to receive the image signals from an
information process device (not shown) such as a computer, etc. and
then to provide the gate driving signal for the gate line of the
LCD panel 171 and a gate portion is formed on the gate side printed
circuit board 175 to provide the gate driving signal to the gate
lines of the LCD panel 171. That is, the data side printed circuit
boards 176 and the gate side printed circuit board 175 generate and
apply the gate driving signal and the data signal for driving the
LCD device and a plurality of timing signals for applying the gate
driving signal and the data signal to the gate lines and the data
lines of the LCD panel 171, so as to provide the gate driving
signal through the gate side tape carrier package 174 to the gate
lines of the LCD panel 171 and to supply the data signal through
the data side tape carrier package 178 to the data lines of the LCD
panel 171.
The backlight assembly 150 is provided under the display unit 170
to uniformly supply the light to the display unit 170. The
backlight assembly 150 includes lamp units 161 and 162, which are
disposed at both ends of a LCD module 130, for generating the
light, a light guide plate 152 for guiding the light emitted by the
lamp units 161 and 162 toward the display unit 170 by changing a
pathway of the light, a plurality of optical sheets 153 for
uniformly making a brightness of the light which is transmitted
from the light guide plate 152 and a light reflecting plate 154,
which is provided under the light guide plate 152, for reflecting a
leaked light to the light guide plate 152 so as to improve the
efficiency of the light.
The display unit 171 and the backlight assembly 150 are
successively received in a mold frame 132 used as a receiving
container. The mold frame 132 is provided with a top chassis 140,
which faces and is combined with the mold frame 132, for preventing
the display unit 171 from departing from the mold frame 132.
Meanwhile, the LCD device further includes a power supply printed
circuit board 135, which has an inverter circuit, for supplying the
power source to the lamps of the lamp units 161 and 162 and a
signal conversion printed circuit board 134 for converting and
providing outer data signals to the data side printed circuit board
176.
The power supply printed circuit board 135 and the signal
conversion printed circuit board 134 are fixed to a rear surface of
the bottom chassis 131 by means of a bracket 133, as shown in FIGS.
1 and 2. Particularly, when the top chassis 140 is assembled with
the mold frame 132 to form the LCD module 130, the LCD module 130
is received in the front case 110. The power supply printed circuit
board 135 and the signal conversion printed circuit board 134 are
combined to the rear surface of the bracket 133 by means of the
screws 134c, 134d and 135b so that supports 134a, 134b and 135a are
disposed between the rear surface of the bracket 133 and the power
supply printed circuit boards 135 and the signal conversion printed
circuit board 134. The bracket 133 is combined with the front case
110 by means of screws 133a and 133b.
Then, a shield case 136 is disposed at the rear surface of the
bracket 133 to enclose the power supply printed circuit board 135
and the signal conversion printed circuit board 134. The shield
case 136 insulates an electromagnetic wave generated form the LCD
module 130 including the power supply printed circuit board 135 and
the signal conversion printed circuit board 134.
As described above, when the bracket 133 and the shield case 136
are combined to the rear surface of the LCD module 130, the rear
case 120 is coupled to the front case 110 and supported by the
support 180 to complete the LCD monitor device (see FIG. 3).
As shown in FIG. 2, the power supply printed circuit board 135 and
the signal conversion printed circuit board 134 are mounted on the
rear surface of the LCD module 130 by the combination with the
bracket 133 having a predetermined height. Further, the shield case
136 is coupled to the rear surface of the bracket 133 by means of
the screws 136a and 136b.
In the conventional LCD device, there are many problems as
follows.
Firstly, with reference to FIG. 2, the thickness t1 of the LCD
device increases to the extent of the heights of the bracket 133
and the shield case 136 and the heights of the supports 134a, 134b
and 134a for fixing the power supply printed circuit board 135 and
the signal conversion printed circuit board 134 to the bracket 133.
Particularly, a thickness t2 of a rear surface of the LCD device
greatly increases due to the bracket 133 and the shield case 136 as
shown in FIG. 4.
Secondly, since the power supply printed circuit board 135 and the
signal conversion printed circuit board 134 are installed to be
adjacent to both ends of the bracket 133, an area of the shield
case 136 is excessively wide for covering them. Thus, the end
portion of the LCD device is as thick as the center portion of the
LCD device.
Thirdly, since the power supply printed circuit board 135 and the
signal conversion printed circuit board 134 are placed at a
position far away from the lamp units 161 and 162 and from the data
side printed circuit board 176, as not shown in detail in drawings,
there is a problem in that a line for supplying the power and a
line for transferring the signals are longer. Furthermore, when the
line for supplying the power and the line for transferring the
signals are longer, it becomes difficult to include and to fix the
lines to the LCD module 130 in a stable fashion.
SUMMARY OF THE INVENTION
The present invention has been made to solve the aforementioned
problem, and accordingly it is an object of the present invention
to provide a LCD device in which a total size and a weight can be
reduced.
It is another object of the present invention to provide a LCD
device in which a size can be minimized by using a support for
rigidly making an installation of the LCD device.
To achieve objects of the present invention, a LCD device according
to an embodiment of the present invention includes displaying means
for displaying image; receiving means for receiving the displaying
means; a printed circuit board mounted on a back surface of the
receiving means, for controlling an operation of the displaying
means; and shielding means mounted on the back surface of the
receiving means for shielding electromagnetic waves from the
printed circuit board. The shielding means is mounted on a center
portion of the back surface of the receiving means while enclosing
the printed circuit board so that edges of the receiving means are
exposed at a predetermined width.
The receiving means includes a bottom chassis for receiving the
displaying means and a mold frame having a bottom surface opened so
that a back surface of the bottom chassis in which the printed
circuit board is mounted is exposed, for receiving the bottom
chassis. The printed circuit board may be a power supplying means
mounted on the back surface of the receiving means, for supplying
the power to the displaying means, and a signal converting means
mounted on the back surface of the receiving means, for converting
signals supplied to the displaying means.
Furthermore, the displaying means includes an integrated and
printed circuit board electrically connected to the signal
converting means and a flexible printed circuit board, for
controlling the operation and an operating time of the displaying
means in response to the signals from the power supplying means and
from the signal converting means.
The LCD device further includes a power supplying line for
supplying the power from the power supplying means to a lamp of the
displaying means and a securing member for securing the power
supplying line for the lamp to the back surface of the receiving
means.
The securing member includes a belt type securing band, having
first and second through-holes at each end thereof and bent so that
the first and second through-holes are opposite to each other to
receive the line for supplying the power to the lamp and a first
locking screw that extends through the first and second
through-holes of the securing band bent to receive the line for
supplying the power to the lamp, for securing the securing band to
the bottom chassis.
In order to achieve another object of the present invention, a LCD
device according to the other embodiment of the present invention
includes a displaying device; a front case for receiving the
displaying device in front of the displaying device; and a rear
case combined with the front case in back of the displaying device,
wherein the rear case has a region projecting at a predetermined
height to receive the shielding means.
The displaying device has displaying means for displaying the
image, receiving means for receiving the image displaying means, a
printed circuit board mounted on a back surface of the receiving
means, for controlling an operation of the displaying means, and
shielding means mounted at a center portion of the back surface of
the receiving means, for shielding electromagnetic waves from the
printed circuit board; a front case for receiving the displaying
device in front of the displaying device; and a rear case combined
with the front case in back of the displaying device, wherein the
rear case has a region projecting at a predetermined height to
receive the shielding means.
The LCD device may further include an abutment combined with the
projected region in a back surface of the rear case, for supporting
the displaying device.
In the LCD device according to the present invention, an inverter
board and an analog/digital board are combined with the bottom
chassis to be in close contact to the back surface of the bottom
chassis. The shield case for shielding the electromagnetic waves
from the analog/digital board and from the inverter board only
covers the analog/digital board and the inverter board so that the
edges of the bottom chassis and the mold frame are exposed.
Accordingly, it is possible to manufacture the LCD device in which
the edge except for a region, in which the analog/digital board and
the inverter board are mounted, has the same thickness as the LCD
module. By minimizing a total thickness of the LCD device, the
thinner and lighter LCD device can be obtained.
BRIEF DESCRIPTION OF THE DRAWINGS
The above and other objects and advantages of the present invention
will become more apparent by describing in detail the preferred
embodiments thereof with reference to the accompanying drawings, in
which:
FIG. 1 is an exploded perspective view schematically showing a
conventional LCD device;
FIG. 2 is a sectional view showing a combination construction of
the LCD device shown in FIG. 1;
FIGS. 3 and 4 are perspective views showing an exterior of a LCD
device shown in FIG. 1;
FIG. 5 is an exploded sectional view showing a LCD device according
to a preferred embodiment of the present invention;
FIG. 6 is a sectional view showing a combination construction of
the LCD device shown in FIG. 5;
FIG. 7 is a sectional view showing a back surface of a bottom
chassis and a mold frame of the LCD device shown in FIG. 6;
FIG. 8 is a view showing a construction of an inverter board and an
analog/digital board combined with the bottom chassis shown in FIG.
7;
FIG. 9 is a view showing the LCD device, in which the integrated
printed circuit board is combined with a back surface of the LCD
device shown in FIG. 8;
FIGS. 10 and 11 are views showing states in that a power supply
line for a lamp shown in FIG. 8 is connected to a back surface of
the LCD device by means of a fixing member according to an
embodiment of the present invention;
FIGS. 12 and 13 are views showing states in that a power supply
line for a lamp shown in FIG. 8 is connected to a back surface of
the LCD device by means of a securing member according to another
embodiment of the present invention;
FIG. 14 is a plan view showing a construction of a shield case
shown in. FIG. 5;
FIG. 15 is a view showing a state in that a shield case is combined
with the back surface of the LCD device shown in FIG. 9; and
FIGS. 16 and 17 are perspective views showing an exterior of the
LCD device shown in FIG. 5.
DESCRIPTION OF THE PREFERRED EMBODIMENT
Hereinafter, LCD devices according to the preferred embodiments of
the present invention will be described in detail with reference to
the accompanying drawings.
FIG. 5 is an exploded perspective view schematically showing a LCD
device according to a preferred embodiment of the present
invention.
Referring to FIG. 5, the LCD device 200 includes a LCD module 230
for displaying an image when an image signal is applied thereto and
a case that has front and rear cases 210 and 220, for receiving the
LCD module 230.
The LCD module 230 can be generally and functionally divided into a
section for displaying the image, a receiving container for
receiving the displaying section and a section for controlling an
operation of the displaying section.
Particularly, the displaying section has a display unit 270
including a LCD panel 271 and a backlight assembly 250 for
supplying a light to the display unit 270. The receiving container
has a bottom chassis 300 for receiving the display unit 270 and the
backlight assembly 250 and a mold frame 600 for receiving and
supporting the bottom chassis 300, of which a bottom surface is
opened to expose a rear surface of the bottom chassis 300.
Furthermore, the section for controlling the operation of the
display section has a printed circuit board 500 (hereinafter,
referred to as an inverter board 500, or power supply unit 500) for
supplying the power to the displaying section and a printed circuit
board 400 (hereinafter, referred to as an A/D board 400, or signal
converting unit 400) for converting a signal provided to the
displaying section. A shield case 700, or shielding unit 700, is
disposed between the receiving container and the rear case 220 to
shield an electromagnetic wave discharged from the inverter board
500 and the A/D board 400.
Hereinafter, a construction of the LCD device as described above
will be explained in detail.
The display unit 270 has the LCD panel 271, a panel-driving printed
circuit board 276 (hereinafter, referred to as an integrated PCB
276) for operating the LCD panel 271, a data side tape carrier
package 278 and a gate side tape carrier package 274.
Here, the integrated PCB 276 contains a gate line driving circuit
connected to the gate side tape carrier package 274 to drive a gate
line of the LCD panel 271 and a data line driving circuit connected
to the data side tape carrier package 278 to drive a data line of
the LCD panel 271.
That is, the gate side tape carrier package 274 contains a wiring
pattern for providing signals driving the gate line to the LCD
panel 271 and a connector for electrically connecting the gate side
tape carrier package 274 to the integrated PCB 276. The integrated
PCB 276 is combined through the data side tape carrier package 278
with a side of the LCD panel 271. A detail of a pathway through
which the driving signals for driving the gate line and the data
line are transmitted will be described below.
Meanwhile, since the integrated PCB 276 is constructed of the
driving circuits of the gate printed circuit board and the data
printed circuit board that are respectively made are integrated in
one piece, high-density packaging techniques are required for
packaging the integrated PCB 276. In the present invention, by
applying a method of a chip on glass, parts of the gate driving
circuit and the data driving circuit may be installed on the board
not in a package but in a chip or a part by wire bonding and
bumping.
The LCD panel 271 comprises a TFT substrate 272, a color filter
substrate 273 and a liquid crystal (not shown).
The TFT substrate 272 is a transparent glass substrate on which
TFTs in a matrix type are formed. A data line is connected with
source terminals of the TFTs and a gate line is connected with gate
terminals of the TFTs. Furthermore, pixel electrodes made of ITO,
which is a transparent and conductive material, are formed at drain
terminals of the TFTs.
When electric signals are applied to the data line and to the gate
line, the electric signals are input into the source terminals and
the gate terminals of the respective TFT. As the electric signals
are input into the TFTs, the TFTs are respectively turned-on or
turned-off, resulting in outputting the electric signals, which are
required to form pixels, to the drain terminals.
The color filter substrate 273 is provided to face to the TFT
substrate 272. The color filter substrate 273 has RGB pixels, which
are formed by a thin film process to give desired colors while the
light passes through the color filter substrate 273. A surface of
the color filter substrate 273 is coated with common electrodes
made of ITO.
When the electric power is applied to the gate and source terminals
of the transistors on the TFT substrate 272 to turn on the TFTs, an
electric field is formed between the pixel electrodes and common
electrodes of the color filter substrate 273. This electric field
changes an array angle of the liquid crystal injected between the
TFT substrate 272 and the color filter substrate 273, resulting in
that a light transmissivity depending on the changed array angle
also is changed so as to produce the desired pixels.
A driving signal and a timing signal are applied to the gate line
and to the data line of the TFTs to control the array angle of the
liquid crystal and the time at which the liquid crystal is arranged
in the LCD panel 271.
As shown in FIG. 5, the data side tape carrier package 278, which
is comprised of flexible circuit boards, is attached to the source
portion of the LCD panel 271 to decide a time at which a data
driving signal is applied to the LCD panel 271. On the other hand,
the gate tape carrier package 274 is attached to the gate portion
of the LCD panel 271 to decide a time at which a gate driving
signal is applied to the LCD panel 271.
The integrated PCB 276, which applies the driving signal to the
gate line and to the data line as soon as receiving image signals
input from outside of the LCD panel 271, makes contact with the
data side tape carrier package 278 for the data line in the LCD
panel 271. A source portion and a gate portion are formed on the
integrated PCB 276. The source portion receives the image signals
from an information processing device (not shown) such as a
computer, etc. and then provides the data driving signal for the
data line of the LCD panel 271. The gate portion provides the gate
driving signal for the gate line of the LCD panel 271.
That is, the integrated PCB 276 generates the gate driving signal
and the data signal for driving the LCD device and the plural
timing signals for applying the gate driving signal and the data
signal in an acceptable time, so as to apply the gate driving
signal through the gate side tape carrier package 274 to the gate
line of the LCD panel 271 and the data signal through the data side
tape carrier package 278 to the data line of the LCD panel 271.
However, it can be noted that each of the printed circuit boards
can be respectively substituted for the source portion and for the
gate portion formed on the integrated PCB 276. On the other hand,
it is also noted that a printed circuit board is substituted for
the gate portion of the integrated PCB 276 so as to be connected to
the gate side tape carrier package 274 and only the source portion
can be formed in the integrated PCB 276 to be connected to the data
side tape carrier package 278 as shown in FIG. 5.
A backlight assembly 250 is disposed under the display unit 270 to
supply the light to the display unit 270 uniformly. The backlight
assembly 250 includes first and second lamp units 261 and 262 for
generating the light. The first and second lamp units 261 and 262
respectively have two lamps.
A light guide plate 252 has a size corresponding to that of the LCD
panel 271 of the display unit 270 and is disposed under the LCD
panel 271 so as to guide the light generated from the first and
second lamp units 261 and 262 to the display unit 270 while
changing the pathway of the light.
Meanwhile, a plurality of optical sheets 253 are disposed on the
light guide plate 252 to make uniform the brightness of the light
from the light guide plate 252 to the LCD panel 271. Furthermore, a
reflection plate 254 is provided under the light guide plate 252 to
reflect the light leaked from the light guide plate 252 to the
light guide plate 252, thereby increasing the light efficiency.
The display unit 270 and the backlight assembly 250 are received in
a bottom chassis 300 used as a receiving container, or receiving
unit 300, which is fixedly supported by means of a mold frame 600.
The mold frame 600 has an opening at a bottom surface to expose the
rear surface of the bottom chassis 300. Furthermore, an area of the
mold frame 600 in which the integrated PCB 276 is mounted in a
bending state partially opens so that the mold frame 600 can
receive elements installed on the integrated PCB 276.
An inverter board 500 and an A/D board 400 for converting signals
are mounted on the rear surface of the bottom chassis 300, which is
exposed through the opening in the bottom surface of the mold frame
600. The inverter board 500 transforms the electric power at a
predetermined voltage level before providing the electric power to
the first and second lamp units 261 and 262. The A/D board 400 is
connected to the integrated PCB 276 to convert analog data signals
into digital data signals before supplying the data signals to the
LCD panel 271. The A/D board 400 and the inverter board 500 are
fixed to the bottom chassis 300 by means of a securing member, for
example, brackets. The fixture of the A/D board 400 and the
inverter board 500, will be described below.
Meanwhile, a top chassis 240 is disposed on the display unit 270 to
prevent the display unit 270 from departing from the bottom chassis
300 while it undergoes bending of the integrated PCB 276 to be
outside of the mold frame 600.
FIG. 6 is a view of showing a combination construction of the LCD
monitor device as shown in FIG. 5.
Referring to FIG. 6, the reflection plate 254, the light guide
plate 252, the optical sheet 253 and the display unit 270 are
sequentially received in the bottom chassis 300 that is disposed in
the mold frame 600. The A/D board 400 and the inverter board 500
are fixed on the back surface of the bottom chassis 300. A shield
case 700 is combined to the back surface of the mold frame 600 to
shield an electromagnetic wave discharged from the A/D board 400
and from the inverter board 500 while enclosing the A/D board 400
and the inverter board 500.
Also, the A/D board 400 and the inverter board 500 are
concentrically mounted at a center portion of the back surface of
the bottom chassis 300. Accordingly, the shield case 700 results in
a small size and encloses the A/D board 400 and the inverter board
500.
In other words, the shield case 700 does not cover the back
surfaces of the bottom chassis 300 and the mold frame 600 entirely,
but only covers the bent integrated PCB 276 on the back surfaces of
the A/D board 400, the inverter board 500 and the mold frame 600.
Accordingly, even though the shield case 700 is combined to the
bottom chassis 300, the edges of the bottom chassis 300 and the
mold frame 600 are partially exposed.
Then, the front case 210 and the rear case 220 are respectively
combined with the top chassis 240 and the shield case 700 to cover
the exposed edges of the bottom chassis 300 and the mold frame 600,
thereby completing the assembly of the LCD device.
As shown in FIG. 6, in the LCD device, the thickness t3 of the edge
portion on which the shield case 700 is not covered is thinner than
the thickness t4 of the center portion on which the shield case 700
is covered. The thickness of the LCD device will be described with
reference to the drawings.
FIGS. 7 to 9 are views of showing the constructions of the back
surface of the LCD device as shown in FIG. 6.
Referring to FIG. 7, the mold frame 600 has a plurality of holes
620, 621, 622, 623, 624 and 625 to receive the circuit elements
mounted on the integrated PCB 276. In addition, the mold frame 600
has an opening at the center portion of the bottom surface thereof
so that the back surface of the bottom chassis 300 is exposed.
The reason for forming the opening in the bottom surface of the
mold frame 600 in order to expose the back surface of the bottom
chassis 300 is that the A/D board 400 and the inverter board 500
are faced to and directly fixed to the back surface of the bottom
chassis 300.
If the A/D board 400 and the inverter board 500 are fixed to the
bottom chassis 300 in the state that the mold frame 600 has no the
opening, the A/D board 400 and the inverter board 500 are placed at
a position so that the heights thereof increase as much as the
thickness of the mold frame 600. Therefore, the thickness of the
LCD device cannot be further reduced in order that the LCD device
is made thinner and smaller.
Meanwhile, a first locking hole 313 is formed in the bottom surface
of the bottom chassis 300, in which a securing member (not shown)
is combined so as to secure a first power supply line 261a for
supplying the electric power to a lamp of the first lamp unit 261
to the back surface of the bottom chassis 300. Furthermore, a
second locking hole 315 is formed in the bottom surface of the
bottom chassis 300, in which a securing member (not shown) is
combined so as to secure a second power supply line 262a for
supplying the electric power to a lamp of the second lamp unit 262
to the back surface of the bottom chassis 300. The construction in
that the first and second power supply lines 261a and 262a are
secured to the back surface of the bottom chassis 300 by means of
the securing members will be explained below.
First and second projections 310 and 311 are formed on the back
surface of the bottom chassis 300 to prevent the inverter board 500
from separating from the bottom chassis 300 before the inverter
board 500 is secured to the bottom chassis 300 by means of the
screws. Similarly, third and fourth projections 320 and 321 are
formed on the back surface of the bottom chassis 300 to prevent the
A/D board 400 from separating from the bottom chassis 300 before
the A/D board 400 is secured to the bottom chassis 300 by means of
the screws. In addition, fifth and sixth projections 350 and 351
are formed on the back surface of the bottom chassis 300 at a
predetermined distance from the third and fourth projections 320
and 321 to help the third and fourth projections 320 and 321 to
prevent the A/D board 400 from separating from the bottom chassis
300.
Third and fourth locking holes 340 and 342 are formed at the back
surface of the bottom chassis 300 to combine the integrated PCB 276
with the bottom chassis 300 by means of the screws (not shown). In
addition, fifth and sixth locking hole 276a and 276b are formed at
the integrated PCB 276 to face to the third and fourth locking
holes 340 and 342. At that time, the third and fourth locking holes
340 and 342, which are used for securing the integrated PCB 276 to
the bottom chassis 300, are covered with a skin of the mold frame
600. Accordingly, the mold frame 600, in which the third and fourth
locking holes 340 and 342 are formed, has first and second
through-holes 670 and 672 formed at positions thereof corresponding
to the third and fourth locking holes 340 and 342 to expose the
third and fourth locking holes 340 and 342 to the outside.
The first and second projections 310 and 311 are formed by
partially cutting the bottom chassis 300 to guide the inverter
board 500 to a combination position. Similarly, the third to sixth
projections 320, 321, 350 and 351 guide the A/D board 400 to a
combination position.
As shown in FIG. 8, the inverter board 500 is combined to the
bottom chassis 300 as moved from the first locking hole 313 to the
first and second projections 310 and 311. When the movement of the
inverter board 500 is stopped by means of the first and second
projections 310 and 311 for preventing the inverter board 500 from
being separated from the bottom chassis 300, the inverter board 500
is kept in an initial installation state by means of the first and
second projections 310 and 311 until the shield case 700 is mounted
on and secured to the back surface of the bottom chassis 300 by
means of screws (not shown).
Similarly, the A/D board 400 is combined to the bottom chassis 300
as moved from the fourth locking hole 342 to the third and fourth
projections 320 and 321. When the movement of the A/D board 400 is
stopped by means of the third and fourth projections 320 and 321,
the A/D board 400 is kept in an initial installation state by means
of the third to sixth projections 320, 321, 350 and 351.
As shown in FIG. 8, the A/D board 400 and the inverter board 500
are concentrically mounted at the center portion of the back
surface of the bottom chassis 300 exposed through the opened bottom
surface of the mold frame 600. In FIG. 8, the back surface of the
bottom chassis 300 is considerably exposed out of the A/D board 400
and the inverter board 500.
Referring to FIG. 9, after the A/D board 400 and the inverter board
500 are mounted on the bottom chassis 300, the integrated PCB 276
is bent to the back surface of the mold frame 600 so that a
connector 277a of the integrated PCB 276 is connected to a first
connector 410 of the A/D board 400. At this time, the connector
277a of the integrated PCB 276 is formed in the flexible printed
circuit board 277 having a conductive pattern to transmit the
signals from the A/D board to the integrated PCB 276.
Next, the first and second power supply lines 261a and 262a are
guided to the inverter board 500 along the back surface of the
bottom chassis 300 so as to be connected to fourth, fifth, seventh
and eighth connectors 510a, 510b, 514a and 514b formed in the
inverter board 500, respectively. The A/D board 400 and the
inverter board 500 are connected to each other by means of the
second and ninth connectors 412 and 516.
Hereinafter, a method of securing the first and second power supply
lines 261a and 262a to the back surface of the bottom chassis 300
will be described with reference to FIGS. 10 to 13. Since the
methods of respectively securing the first and second power supply
lines 261a and 262a are the same, the method of securing the second
power supply line 262a to the back surface of the bottom chassis
300 will be explained as an example. In the embodiment of the
present invention, furthermore, the first and second lamp units 261
and 262 respectively have two lamps.
FIGS. 10 to 13 show the state in that the power supply line for a
lamp shown in FIG. 8 is combined to the bottom chassis 300 of the
LCD device by using the first securing member 910 according to an
embodiment of the present invention.
Referring to FIGS. 10 and 11, the second locking hole 315 is formed
on the bottom chassis 300 and an area of the bottom chassis 300
adjacent to the second locking hole 315 is projected at a
predetermined height. But, the second locking hole 315 has a lower
height than the highest part of the parts constructing the A/D
board 400 and the inverter board 500 that are combined to the back
surface of the bottom chassis 300.
As shown in FIG. 11, the second power supply line 262a is enclosed
by means of a flexible securing band 912 in a bundle. The flexible
securing band 912 enclosing the second power supply line 262a has
first and second thru-holes 913 and 914 at both ends thereof.
When enclosing the second power supply line 262a, the flexible
securing band 912 has an adjusted length so that the first and
second thru-holes 913 and 914 face to each other. After the first
and second thru-holes 913 and 914 are corresponding to the second
locking hole 315 of the bottom chassis 300, the flexible securing
band 912 is combined to the second locking hole 315 by using the
first locking screw 914.
As shown in FIG. 10, the first locking screw 914 extends through
the first and second thru-holes 913 and 914 and through the second
locking hole 315 in turn to be combined with the back surface of
the bottom chassis 300. As described above, the area of the bottom
chassis 300 adjacent to the second locking hole 315 is projected at
the predetermined height from the back surface of the bottom
chassis 300 to provide a space in which the first locking screw 914
is combined to the second locking hole 315. The second power supply
line 262a is secured to the bottom chassis 300 by means of the
flexible securing member 912 within a range of the height of the
second locking hole 315.
Meanwhile, FIGS. 12 and 13 show a construction in which the first
and second power supply lines 261a and 262a are secured to the back
surface of the bottom chassis 300 by using a second securing member
920 according to another embodiment of the present invention.
Referring to FIGS. 12 and 13, first and second securing elements
922 and 924 are formed on the back surface of the bottom chassis
300. The first and second securing elements 922 and 924 are formed
by partially cutting the bottom surface portion of the bottom
chassis 300 to provide a space between the first and second
securing elements 922 and 924 and the bottom chassis 300.
Furthermore, the first and second securing elements 922 and 924 are
spaced at a predetermined distance apart from each other. The
second securing element 924 has a third thru-hole 924a formed
therein. The third thin-hole 924a may be formed in the first
securing element 922 or in the respective first and second securing
elements 922 and 924.
The second securing member 920 has a securing segment 926 for
securing the second power supply line 262a received between the
first and second securing elements 922 and 924. The securing
segment 926 has a semi-cylindrical body 926a to provide a space in
which the second power supply line 262a is received between the
securing segment 926 and the bottom chassis 300. First and second
wings 926b and 926c extend outwardly at a predetermined length from
both ends of the body 926a. The second wing 926c has a fourth
thru-hole 926a corresponding to the third thru-hole 924a formed in
the second securing element 924.
As shown, the second power supply line 262a is received in the
semi-cylindrical body 926a. In this state, when the securing
segment 926 is pushed to a side of the first and second securing
elements 922 and 924, the first and second wings 926b and 926c are
respectively inserted into the space between the first and second
securing elements 922 and 924 and the bottom chassis 300 below the
first and second securing elements 922 and 924.
At that time, the securing segment 926 is inserted into the first
and second securing elements 922 and 924 so that the third
thru-hole 924a formed in the second securing elements 924 faces to
the fourth thru-hole 926a formed in the second wing 926c. Next,
when the second locking screw 928 is locked to extend through the
third and fourth thru-holes 924a and 926a, the second power supply
line 262a is secured to the back surface of the bottom chassis 300
as shown in FIG. 12.
If the first and second power supply lines 261a and 262a are not
secured to the back surface of the bottom chassis 300 by using the
first or second securing member 910 and 920, the first and second
power supply lines 261a and 262a extending to the inverter board
500 are separated from the back surface of the bottom chassis 300.
As a result, the first and second power supply lines 261a and 262a
repeatedly collide with other structures on the back surface of the
bottom chassis 300, so that the coating of the first and second
power supply lines 261a and 262a can become damaged.
Accordingly, an exposed electric wire of the first and second power
supply lines 261a and 262a can be caused to short with the other
conductive elements, for example circuit parts of the integrated
PCB 276 and the inverter board 500. If the first and second power
supply lines 261a and 262a are not secured to a certain position on
the bottom chassis 300, furthermore, the first and second power
supply line 261a and 262a interrupt the assembling of another
structure at the next assembly step, resulting in not performing
the process of assembling the LCD device. Similarly, the first
power supply line 261a is also secured to the back surface of the
bottom chassis 300 by means of the same securing member as is the
first or second securing member 910 or 920 for securing the second
power supply line 262a to the bottom chassis 300.
As described above, after the A/D board 400 and the inverter board
500 are combined to the back surface of the bottom chassis 300, and
after the first and second power supply lines 261a and 262a are
connected to the inverter board 500, the shield case 700 is
combined to the back surface of the bottom chassis 300.
FIG. 14 is a plan view showing the construction of the shield case
700 shown in FIG. 5, and FIG. 15 is a view of showing the LCD
monitor of which the shield case 700 shown in FIG. 10 is combined
to the back surface.
Referring to FIG. 14, the shield case 700 protects the A/D board
400 and the inverter board 500 mounted on the bottom chassis 300
while isolating the electromagnetic waves from the A/D board 400
and the inverter board 500.
Ninth, tenth, eleventh and twelfth locking holes 340a, 342a, 346a
and 347a are formed in a bottom surface of the shield case 700 to
be corresponding to third, fourth, seventh and eighth locking holes
340, 342, 346 and 347 formed in the bottom chassis 300.
On the other hand, first and second openings 710 and 720 are formed
in a region of the shield case 700 that covers the inverter board
500 to facilitate a discharge of heat generated from the inverter
board 500. Particularly, it is preferable that the first and second
openings 710 and 720 are formed in the shield case 700 at a
position adjacent to an element generating a large amount of heat,
such as a transformer (not shown) of the circuit parts constructing
the inverter board 500.
Furthermore, a part of the shield case 700 is cut to form first and
second windows 722 and 724. The worker can identify through the
first and second windows 722 and 724 whether the line 263 for
electrically connecting the inverter board 500 with the A/D board
400 is normally connected with the second and ninth connectors 412
and 516 (not shown in FIGS. 14-15).
If the first and second windows 722 and 724 are not formed in the
shield case 700, the worker or a user must dismantle and combine
the bottom chassis 300 from/with the shield case 700 every time in
order to identify whether the connectors connecting the integrated
PCB 276 with the A/D board 400, or the A/D board 400 with the
inverter board 500, are normally connected with each other.
Furthermore, the shield case 700 has first and second connection
segments 730 and 740, or connection portions 730 and 740, formed by
cutting a predetermined portion of a sidewall of the shield case
700. After the shield case 700 is mounted on the back surface of
the bottom chassis 300, the worker can connect the line for
supplying the outer electric power to the inverter board 500 and
the line for providing the outer data signals to the A/D board 400
to the sixth connector 512 and the third connector 414 (not shown
in FIGS. 14-15) through the first and second connection segments
730 and 740, respectively.
However, the sidewall in which the first and second connection
segments 730 and 740 are formed is not completely opened. In other
words, the first and second connection segments 730 and 740 are
formed in an opening closed by the shield case 700. In the
preferred embodiment of the present invention, the first and second
connection segments 730 and 740 are partially connected with each
other at bottom portions thereof by means of first and second
connecting parts 731 and 741. As the first and second connection
segments 730 and 740 are formed in a closed form as described
above, the capability of the shield case 700 for insulating the
electromagnetic wave can be improved.
Meanwhile, the shield case 700 has a relatively narrower width in a
most portion thereof except for the end which protects the
integrated PCB 276. This is because the A/D board 400 and the
inverter board 500 are covered with the shield case 700 to isolate
the electromagnetic waves and are concentrically mounted at the
center portion of the bottom chassis 300.
Referring to FIGS. 8 and 15, particularly, even though the A/D
board 400 and the inverter 500 are combined to the back surface of
the bottom chassis 300, most of the back surface of the bottom
chassis 300 and the mold frame 600 is exposed, except for a region,
in which the integrated PCB 276, the A/D board 400 and the inverter
board 500 are mounted. In addition, the shield case 700 is a member
for isolating the electromagnetic waves generated from the
integrated PCB 276, the A/D board 400 and the inverter board 500.
Even if the shield case 700 is combined to the back surface of the
bottom chassis 300, accordingly, most of the edge of the bottom
chassis 300 and of the mold frame 600 is exposed as shown in FIG.
15.
When the front case 210 is faced and combined to the rear case 220
after the shield case 700 is mounted on the back surface of the
bottom chassis 300 as described above, the assembly of the LCD
monitor is completed as shown in FIGS. 16 and 17.
FIGS. 16 and 17 are perspective views showing an exterior of the
LCD monitor device shown in FIG. 5.
Referring to FIGS. 16 and 17, the thickness t3 of the edge of the
LCD device, to which the front and rear cases 210 and 220 are
combined, is smaller than the thickness t4 of the center portion of
the bottom chassis 300 on which the A/D board 400 and the inverter
board 500 are mounted. As described already, this is because the
shield case 700 covers only the region in which the integrated PCB
276, the A/D board 400 and the inverter board 500 are mounted.
In order to use the LCD device, a support 800 for supporting the
LCD device has to be connected to the rear case 220.
As shown in FIGS. 16 and 17, the support 800 includes a cover 810
having a recess for receiving the projected center portion of the
rear case 220 and abutments 820 and 830, which are combined to the
cover 810, for providing a supporting force to the cover 810.
In FIGS. 16 and 17, in the state that the rear case 220 covers the
shield case 700, the cover 810 of the support 800 receives the
projected center portion of the rear case 220. However, the rear
case 220 may be partially cut so that the shield case 700 is
exposed outside. In other words, after a region of the rear case
220 corresponding to the shield case 700 is opened, the shield case
700 that is exposed out of the rear case 220 is covered with the
cover 810 of the support 800. In this case, the total thickness t5
of the LCD device, including the thickness of the cover 810 of the
support 800, becomes thinner. As a result, the thin and lighter LCD
monitor can be obtained.
According to the LCD device as described above, the inverter board
500 for supplying the electric power to the lamp unit and the A/D
board 400, for converting and providing the outer data signals to
the integrated PCB are in direct and close contact to and combined
with the back surface of the bottom chassis 300.
Furthermore, the shield case for isolating the electromagnetic
waves generated from the A/D board 400 and the inverter board 500
covers the A/D board 400 and the inverter board 500 so that the
edges of the bottom chassis 300 and the mold frame 600 are
exposed.
Therefore, it is possible to manufacture the LCD device having an
edge in which its thickness is the same as a total thickness of a
LCD module. Accordingly, the total thickness of the LCD device is
minimized, so that the thin and lighter LCD device can be
obtained.
Although the preferred embodiments of the present invention have
been described, it is understood that the present invention should
not be limited to these preferred embodiments but various changes
and modifications can be made by one skilled in the art within the
spirit and scope of the present invention as hereinafter
claimed.
* * * * *