U.S. patent number RE42,074 [Application Number 10/321,516] was granted by the patent office on 2011-01-25 for manufacturing method of light emitting device.
This patent grant is currently assigned to Sanyo Electric Co., Ltd.. Invention is credited to Takashi Kano, Tatsuya Kunisato, Yasuhiko Matsushita, Yasuhiro Ueda, Katsumi Yagi.
United States Patent |
RE42,074 |
Kunisato , et al. |
January 25, 2011 |
Manufacturing method of light emitting device
Abstract
A method of manufacturing a light emitting device, including the
steps of: forming an active layer composed of a compound
semiconductor containing indium by a vapor phase growth method; and
forming a cap layer composed of a compound semiconductor on said
active layer by a vapor phase growth method at a growth temperature
approximately equal to or lower than a growth temperature for said
active layer.
Inventors: |
Kunisato; Tatsuya (Takatsuki,
JP), Kano; Takashi (Ohtsu, JP), Ueda;
Yasuhiro (Hirakata, JP), Matsushita; Yasuhiko
(Osaka, JP), Yagi; Katsumi (Suita, JP) |
Assignee: |
Sanyo Electric Co., Ltd.
(Moriguchi-shi, JP)
|
Family
ID: |
26396092 |
Appl.
No.: |
10/321,516 |
Filed: |
December 18, 2002 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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08847471 |
Apr 25, 1997 |
5990496 |
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Reissue of: |
09427694 |
Oct 27, 1999 |
06162656 |
Dec 19, 2000 |
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Foreign Application Priority Data
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Apr 26, 1996 [JP] |
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8-107833 |
Mar 10, 1997 [JP] |
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9-055221 |
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Current U.S.
Class: |
438/46; 438/45;
438/22 |
Current CPC
Class: |
H01L
33/32 (20130101); H01L 33/02 (20130101); H01L
33/007 (20130101); H01S 5/221 (20130101); H01S
5/2231 (20130101); H01S 5/0213 (20130101); H01S
2304/04 (20130101); H01S 2301/173 (20130101); H01S
5/32341 (20130101) |
Current International
Class: |
H01L
21/00 (20060101) |
Field of
Search: |
;438/46,22,45 |
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WO |
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WO 97/26680 |
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Jul 1997 |
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WO |
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|
Primary Examiner: Pham; Long
Attorney, Agent or Firm: Westerman, Hattori, Daniels &
Adrian, LLP
Parent Case Text
This application is a divisional of prior application Ser. No.
08/847,471, filed Apr. 25, 1997 now U.S. Pat. No. 5,990,496.
Claims
What is claimed is:
.[.1. A method of manufacturing a light emitting device, comprising
the steps of: forming an active layer composed of a nitride system
semiconductor by a vapor phase growth method; forming a cap layer
composed of a nitride system semiconductor on said active layer by
a vapor phase growth method at a growth temperature approximately
equal to or lower than a growth temperature for said active layer;
and forming a cladding layer composed of a nitride system
semiconductor of one conductivity type on said cap layer by a vapor
phase growth method; wherein said cap layer has a lower impurity
concentration than said cladding layer..].
.[.2. The method of manufacturing a light emitting device according
to claim 1, wherein said active layer is composed of a III-V group
nitride system semiconductor, said cap layer is composed of a III-V
group nitride system semiconductor, and said cladding layer is
composed of a III-V group nitride system semiconductor..].
.[.3. The method of manufacturing a light emitting device according
to claim 2, wherein said step of forming a cladding layer includes
forming said cladding layer at a growth temperature higher than the
temperature allowing crystal growth of said active layer..].
.[.4. The method of manufacturing a light emitting device according
to claim 3, wherein said cap layer is composed of
Al.sub.uGa.sub.1-uN, said cladding layer is composed of
Al.sub.zGa.sub.1-zN of one conductivity type, and the Al
composition ratio u of said cap layer is smaller than the Al
composition ratio z of said cladding layer..].
.[.5. The method of manufacturing a light emitting device according
to claim 4, wherein the Al composition ratio u of said cap layer is
approximately equal to or smaller than 0.1..].
.[.6. The method of manufacturing a light emitting device according
to claim 1, wherein said cap layer is an undoped layer..].
.[.7. The method of manufacturing a light emitting device according
to claim 1, wherein said cap layer has a thickness of approximately
not smaller than 200 .ANG. nor larger than 400 .ANG...].
.[.8. The method of manufacturing a light emitting device according
to claim 1, wherein the step of forming said cap layer includes
forming said cap layer at a growth temperature of not lower than
700.degree. C. nor higher than 950.degree. C..].
.[.9. The method of manufacturing a light emitting device according
to claim 1, wherein said step of forming said cap layer includes
forming said cap layer at a growth temperature approximately equal
to the growth temperature for said active layer..].
.[.10. The method of manufacturing a light emitting device
according to claim 1, wherein said active layer is composed of
InGaN..].
.[.11. The method of manufacturing a light emitting device
according to claim 1, wherein said active layer has a quantum well
structure including an InGaN quantum well layer and a GaN quantum
barrier layer, and the step of forming said active layer includes
forming said GaN quantum barrier layer at a growth temperature of
not lower than 700.degree. C. nor higher than 950.degree. C..].
.Iadd.12. A method of manufacturing a light emitting device,
comprising, in the following order, the steps of: forming a buffer
layer composed of a nitride based compound semiconductor on a
substrate; forming an underlayer composed of a nitride based
compound semiconductor; forming a first cladding layer composed of
a nitride based compound semiconductor of a first conductivity
type; forming an active layer composed of a nitride based compound
semiconductor containing indium; forming a cap layer composed of
AlGaN; forming a second cladding layer composed of a nitride based
compound semiconductor of a second conductivity type at a growth
temperature higher than that of said active layer, wherein said
step of forming the active layer includes forming a quantum well
structure including a quantum well layer and quantum barrier
layer..Iaddend.
.Iadd.13. The method according to claim 12, further comprising the
step of forming a contact layer of the first conductivity type on
said underlayer..Iaddend.
.Iadd.14. The method according to claim 13, wherein said step of
forming the contact layer of the first conductivity type includes
forming said contact layer of the first conductivity type at a
growth temperature of not lower than 1000.degree. C. nor higher
than 1200.degree. C..Iaddend.
.Iadd.15. The method according to claim 12, further comprising the
step of forming a contact layer of the second conductivity type on
said second cladding layer..Iaddend.
.Iadd.16. The method according to claim 15, wherein said step of
forming the contact layer of the second conductivity type includes
forming a contact layer of the second conductivity type composed of
GaN..Iaddend.
.Iadd.17. The method according to claim 12, wherein said step of
forming said quantum well structure includes forming a quantum well
layer composed of In.sub.sGa.sub.1-sN wherein
1>s>0..Iaddend.
.Iadd.18. The method according to claim 12, wherein said step of
forming the quantum well structure includes forming a quantum well
layer composed of In.sub.sGa.sub.1-sN wherein 1>s>0, and a
quantum barrier layer composed of In.sub.rGa.sub.1-rN wherein
1>s>r.gtoreq.0..Iaddend.
.Iadd.19. The method according to claim 12, wherein said step of
forming the cap layer includes forming a cap layer having an Al
composition ratio of at most 0.1..Iaddend.
.Iadd.20. A method of manufacturing a light emitting device,
comprising, in the following order, the steps of: forming a buffer
layer composed of a nitride based compound semiconductor on a
substrate; forming an underlayer composed of a nitride based
compound semiconductor; forming a first cladding layer composed of
a nitride based compound semiconductor of a first conductivity
type; forming an active layer composed of a nitride based compound
semiconductor containing indium; forming a cap layer composed of
AlGaN; forming a second cladding layer composed of a nitride based
compound semiconductor of a second conductivity type at a growth
temperature higher than that of said active layer, wherein said
step of forming the cap layer includes forming a cap layer having a
bandgap between those of said active layer and said second cladding
layer..Iaddend.
.Iadd.21. A method of manufacturing a light emitting device,
comprising, in the following order, the steps of: forming a buffer
layer composed of a nitride based compound semiconductor on a
substrate; forming an underlayer composed of a nitride based
compound semiconductor; forming a first cladding layer composed of
a nitride based compound semiconductor of a first conductivity
type; forming an active layer composed of a nitride based compound
semiconductor containing indium; forming a cap layer composed of
AlGaN; forming a second cladding layer composed of a nitride based
compound semiconductor of a second conductivity type at a growth
temperature higher than that of said active layer, wherein said
step of forming the cap layer includes forming a cap layer having
an impurity concentration lower than that of said second cladding
layer..Iaddend.
.Iadd.22. The method according to claim 12, wherein said step of
forming the cap layer includes forming an undoped cap
layer..Iaddend.
.Iadd.23. The method according to claim 12, wherein said step of
forming the cap layer includes forming a cap layer having a
thickness of not smaller than 200 .ANG. nor larger than 400
.ANG...Iaddend.
.Iadd.24. The method according to claim 12, wherein said step of
forming the second cladding layer includes forming a second
cladding layer composed of AlGaN..Iaddend.
.Iadd.25. The method according to claim 24, wherein said step of
forming the cap layer includes forming a cap layer having an Al
composition ratio smaller than that of said second cladding
layer..Iaddend.
.Iadd.26. The method according to claim 12, wherein said step of
forming the cap layer includes forming as said cap layer a layer
suppressing elimination of the indium from said active
layer..Iaddend.
.Iadd.27. The method according to claim 12, wherein said step of
forming the underlayer includes forming an underlayer composed of
Al.sub.yGa.sub.1-yN, and the Al composition ratio y of said
underlayer is at least 0 and smaller than 1..Iaddend.
.Iadd.28. The method according to claim 12, wherein said step of
forming the buffer layer includes forming a buffer layer composed
of Al.sub.xGa.sub.1-xN, and the Al composition ratio x of said
buffer layer is larger than 0 and at most 1..Iaddend.
.Iadd.29. The method according to claim 28, wherein said step of
forming the buffer layer includes forming a buffer layer having an
Al composition ratio x of not smaller than 0.4 nor larger than
0.6..Iaddend.
.Iadd.30. The method according to claim 12, wherein said step of
forming the active layer includes forming an active layer composed
of InGaN..Iaddend.
.Iadd.31. The method according to claim 12, wherein said step of
forming the active layer includes forming said active layer at a
growth temperature of not lower than 700.degree. C. nor higher than
950.degree. C..Iaddend.
.Iadd.32. The method according to claim 12, wherein said step of
forming the second cladding layer includes forming said second
cladding layer at a growth temperature of not lower than
1000.degree. C. nor higher than 1200.degree. C..Iaddend.
.Iadd.33. The method according to claim 12, wherein said step of
forming the first cladding layer includes forming a first cladding
layer composed of AlGaN..Iaddend.
.Iadd.34. The method according to claim 12, wherein said step of
forming the cap layer includes forming said cap layer at a growth
temperature substantially equal to or lower than that of said
active layer..Iaddend.
.Iadd.35. The method according to claim 12, wherein said step of
forming the cap layer includes forming said cap layer at a growth
temperature of not lower than 700.degree. C. nor higher than
950.degree. C..Iaddend.
.Iadd.36. A method of manufacturing a light emitting device,
comprising, in the following order, the steps of: forming a buffer
layer composed of a nitride based compound semiconductor on a
substrate; forming an underlayer composed of a nitride based
compound semiconductor; forming a first cladding layer composed of
a nitride based compound semiconductor of a first conductivity
type; forming an active layer composed of a nitride based compound
semiconductor containing indium; forming a cap layer composed of
AlGaN; forming a second cladding layer composed of a nitride based
compound semiconductor of a second conductivity type at a growth
temperature higher than that of said active layer, wherein said
step of forming the underlayer includes forming an undoped
underlayer..Iaddend.
.Iadd.37. The method according to claim 12, wherein said step of
forming the buffer layer includes forming a non-single crystalline
buffer layer..Iaddend.
.Iadd.38. The method according to claim 12, wherein said step of
forming the underlayer includes forming a single crystalline
underlayer..Iaddend.
.Iadd.39. The method according to claim 12, wherein said step of
forming the cap layer includes forming the cap layer containing
Al..Iaddend.
.Iadd.40. The method according to claim 12, wherein said step of
forming the cap layer includes forming a cap layer having a band
gap larger than that of said active layer..Iaddend.
.Iadd.41. A method of manufacturing a light emitting device,
comprising, in the following order, the steps of: forming a buffer
layer composed of a nitride based compound semiconductor; forming
an underlayer composed of a nitride based compound semiconductor;
forming a contact layer composed of a first conductivity type;
forming a first cladding layer composed of a nitride based compound
semiconductor of the first conductivity type; forming an active
layer having a quantum well structure including a quantum well
layer and a quantum barrier layer and composed of a nitride based
compound semiconductor containing indium; forming a cap layer
composed of a nitride based compound semiconductor; forming a
second cladding layer composed of a nitride based compound
semiconductor of a second conductivity type at a growth temperature
higher than that of said active layer..Iaddend.
.Iadd.42. The method according to claim 41, wherein said step of
forming the contact layer of the first conductivity type includes
forming said contact layer of the first conductivity type at a
growth temperature of not lower than 1000.degree. C. nor higher
than 1200.degree. C..Iaddend.
.Iadd.43. The method according to claim 41, further comprising the
step of forming a contact layer of the second conductivity type on
said second cladding layer..Iaddend.
.Iadd.44. The method according to claim 41, wherein said step of
forming the contact layer of the second conductivity type includes
forming a contact layer of the second conductivity type composed of
GaN..Iaddend.
.Iadd.45. The method according to claim 41, wherein said step of
forming the active layer includes forming a quantum well layer
composed of In.sub.sGa.sub.1-sN wherein 1>s>0..Iaddend.
.Iadd.46. The method according to claim 41, wherein said step of
forming the active layer includes forming a quantum well layer
composed of In.sub.sGa.sub.1-sN wherein 1>s>0, and a quantum
barrier layer composed of In.sub.rGa.sub.1-rN wherein
1>s>r.gtoreq.0..Iaddend.
.Iadd.47. The method according to claim 41, wherein said step of
forming the cap layer includes forming a cap layer having an Al
composition ratio of at most 0.1..Iaddend.
.Iadd.48. The method according to claim 41, wherein said step of
forming the cap layer includes forming a cap layer having a bandgap
between those of said active layer and said second cladding
layer..Iaddend.
.Iadd.49. The method according to claim 41, wherein said step of
forming the cap layer includes forming a cap layer having an
impurity concentration lower than that of said second cladding
layer..Iaddend.
.Iadd.50. The method according to claim 41, wherein said step of
forming the cap layer includes forming an undoped cap
layer..Iaddend.
.Iadd.51. The method according to claim 41, wherein said step of
forming the cap layer includes forming a cap layer having a
thickness of not smaller than 200 .ANG. nor larger than 400
.ANG...Iaddend.
.Iadd.52. The method according to claim 41, wherein said step of
forming the second cladding layer includes forming a second
cladding layer composed of AlGaN..Iaddend.
.Iadd.53. The method according to claim 52, wherein said step of
forming the cap layer includes forming a cap layer having an Al
composition ratio smaller than that of said second cladding
layer..Iaddend.
.Iadd.54. The method according to claim 41, wherein said step of
forming the cap layer includes forming as said cap layer a layer
suppressing elimination of the indium from said active
layer..Iaddend.
.Iadd.55. The method according to claim 41, wherein said step of
forming the underlayer includes forming an underlayer composed of
Al.sub.yGa.sub.1-yN, and the Al composition ratio y of said
underlayer is at least 0 and smaller than 1..Iaddend.
.Iadd.56. The method according to claim 41, wherein said step of
forming the buffer layer includes forming a buffer layer composed
of Al.sub.xGa.sub.1-xN, and the Al composition ratio x of said
buffer layer is larger than 0 and at most 1..Iaddend.
.Iadd.57. The method according to claim 108, wherein said step of
forming the buffer layer includes forming a buffer layer having an
Al composition ratio x of not smaller than 0.4 nor larger than
0.6..Iaddend.
.Iadd.58. The method according to claim 41, wherein said step of
forming the active layer includes forming an active layer composed
of InGaN..Iaddend.
.Iadd.59. The method according to claim 41, wherein said step of
forming the active layer includes forming said active layer at a
growth temperature of not lower than 700.degree. C. nor higher than
950.degree. C..Iaddend.
.Iadd.60. The method according to claim 41, wherein said step of
forming the second cladding layer includes forming said second
cladding layer at a growth temperature of not lower than
1000.degree. C. nor higher than 1200.degree. C..Iaddend.
.Iadd.61. The method according to claim 41, wherein said step of
forming the first cladding layer includes forming a first cladding
layer composed of AlGaN..Iaddend.
.Iadd.62. The method according to claim 41, wherein said step of
forming the cap layer includes forming said cap layer at a growth
temperature substantially equal to or lower than that of said
active layer..Iaddend.
.Iadd.63. The method according to claim 41, wherein said step of
forming the cap layer includes forming said cap layer at a growth
temperature not lower than 700.degree. C. nor higher than
950.degree. C..Iaddend.
.Iadd.64. The method according to claim 41, wherein said step of
forming the underlayer includes forming an undoped
underlayer..Iaddend.
.Iadd.65. The method according to claim 41, wherein said step of
forming the buffer layer includes forming a non-single crystalline
buffer layer..Iaddend.
.Iadd.66. The method according to claim 41, wherein said step of
forming the underlayer includes forming a single crystalline
underlayer..Iaddend.
.Iadd.67. The method according to claim 41, wherein said step of
forming the cap layer includes forming a cap layer composed of
AlGaN..Iaddend.
.Iadd.68. The method according to claim 67, wherein said step of
forming the cap layer includes forming the cap layer containing
Al..Iaddend.
.Iadd.69. The method according to claim 41, wherein said step of
forming the cap layer includes forming a cap layer having a band
gap larger than that of said active layer..Iaddend.
.Iadd.70. A method of manufacturing a light emitting device,
comprising, in the following order, the steps of: forming a buffer
layer composed of a nitride based compound semiconductor on a
substrate; forming an underlayer composed of a nitride based
compound semiconductor; forming a contact layer composed of a first
conductivity type; forming a first cladding layer composed of a
nitride based compound semiconductor of the first conductivity
type; forming an active layer having a quantum well structure
including a quantum well layer and a quantum barrier layer and
composed of a nitride based compound semiconductor containing
indium; and forming a second cladding layer composed of a nitride
based compound semiconductor of a second conductivity type at a
growth temperature higher than that of said active
layer..Iaddend.
.Iadd.71. The method according to claim 70, wherein said step of
forming the contact layer of the first conductivity type includes
forming said contact layer of the first conductivity type at a
growth temperature of not lower than 1000.degree. C. nor higher
than 1200.degree. C..Iaddend.
.Iadd.72. The method according to claim 70, further comprising the
step of forming a contact layer of the second conductivity type on
said second cladding layer..Iaddend.
.Iadd.73. The method according to claim 70, wherein said step of
forming the contact layer of the second conductivity type includes
forming a contact layer of the second conductivity type composed of
GaN..Iaddend.
.Iadd.74. The method according to claim 70, wherein said step of
forming the active layer includes forming a quantum well layer
composed of In.sub.sGa.sub.1-sN wherein 1>s>0..Iaddend.
.Iadd.75. The method according to claim 70, wherein said step of
forming the active layer includes forming a quantum well layer
composed of In.sub.sGa.sub.1-sN wherein 1>s>0, and a quantum
barrier layer composed of In.sub.rGa.sub.1-rN wherein
1>s>r.gtoreq.0..Iaddend.
.Iadd.76. The method according to claim 70, wherein said step of
forming the second cladding layer includes forming a second
cladding layer composed of AlGaN..Iaddend.
.Iadd.77. The method according to claim 70, wherein said step of
forming the underlayer includes forming an underlayer composed of
Al.sub.yGa.sub.1-yN, and the Al composition ratio y of said
underlayer is at least 0 and smaller than 1..Iaddend.
.Iadd.78. The method according to claim 70, wherein said step of
forming the buffer layer includes forming a buffer layer composed
of Al.sub.xGa.sub.1-xN, and the Al composition ratio x of said
buffer layer is larger than 0 and at most 1..Iaddend.
.Iadd.79. The method according to claim 70, wherein said step of
forming the buffer layer includes forming a buffer layer having an
Al composition ratio x of not smaller than 0.4 nor larger than
0.6..Iaddend.
.Iadd.80. The method according to claim 70, wherein said step of
forming the active layer includes forming an active layer composed
of InGaN..Iaddend.
.Iadd.81. The method according to claim 70, wherein said step of
forming the active layer includes forming said active layer at a
growth temperature of not lower than 700.degree. C. nor higher than
950.degree. C..Iaddend.
.Iadd.82. The method according to claim 70, wherein said step of
forming the second cladding layer includes forming said second
cladding layer at a growth temperature of not lower than
1000.degree. C. nor higher than 1200.degree. C..Iaddend.
.Iadd.83. The method according to claim 70, wherein said step of
forming the first cladding layer includes forming a first cladding
layer composed of AlGaN..Iaddend.
.Iadd.84. The method according to claim 70, wherein said step of
forming the underlayer includes forming an undoped
underlayer..Iaddend.
.Iadd.85. The method according to claim 70, wherein said step of
forming the buffer layer includes forming a non-single crystalline
buffer layer..Iaddend.
.Iadd.86. The method according to claim 70, wherein said step of
forming the underlayer includes forming a single crystalline
underlayer..Iaddend.
Description
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a light emitting device and a
manufacturing method thereof.
2. Description of the Background Art
Light emitting devices such as light emitting diodes and
semiconductor laser devices which are formed of III-V group nitride
system semiconductors such as GaN, AlGaN, InGaN and InAlGaN are
receiving a great deal of attention because they are capable of, by
direct transition, light emission in the yellow to ultraviolet
region, especially in the blue region, with large luminous
intensity.
FIG. 8 is a schematic cross-sectional view showing a conventional
light emitting diode composed of III-V group nitride system
semiconductors.
In FIG. 8, formed in order on a sapphire substrate 101 are a GaN
buffer layer 102, an n-type GaN contact layer 103 also serving as
an n-type cladding layer, an InGaN active layer 104, a p-type AlGaN
cladding layer 105, and a p-type GaN contact layer 106. A p
electrode 107 is formed on the p-type GaN contact layer 106 and an
n electrode 108 is formed on the n-type GaN contact layer 103.
The individual layers of this light emitting diode are grown by
metal organic chemical vapor deposition (MOCVD) at the growth
temperatures shown in Table 1, for example.
TABLE-US-00001 TABLE 1 Name of layer Growth temperature (.degree.
C.) Buffer layer 102 600 N-type contact layer 103 1150 Active layer
104 860 P-type cladding layer 105 1150 P-type contact layer 106
1150
When manufacturing this light emitting diode, the p-type AlGaN
cladding layer 105 is formed on the InGaN active layer 104 at a
growth temperature higher than that for the InGaN active layer 104
to achieve good crystallinity. The growth of the p-type AlGaN
cladding layer 105 at such a high temperature causes elimination of
constituent elements such as In from the InGaN active layer 104.
The crystallinity of the InGaN active layer 104 is thus
deteriorated when crystal-growing the p-type AlGaN cladding layer
105. This causes difficulty in achieving larger luminous intensity
with the light emitting diode.
SUMMARY OF THE INVENTION
An object of the present invention is to provide a light emitting
device having high luminous intensity and its manufacturing
method.
A light emitting device according to the present invention
includes, in this order, a first cladding layer composed of a
compound semiconductor of a first conductivity type, an active
layer composed of a compound semiconductor containing indium, a cap
layer composed of a compound semiconductor, and a second cladding
layer composed of a compound semiconductor of a second conductivity
type.
In the light emitting device of the invention, formation of the cap
layer on the active layer suppresses elimination of constituent
elements such as indium from the active layer. This provides
increased luminous intensity.
The first cladding layer is composed of a nitride system
semiconductor of the first conductivity type, the active layer is
composed of a nitride system semiconductor, the cap layer is
composed of a nitride system semiconductor, and the second cladding
layer is composed of a nitride system semiconductor of the second
conductivity type.
The first cladding layer may be composed of a III-V group nitride
system semiconductor of the first conductivity type, the active
layer of a III-V group nitride system semiconductor, the cap layer
of a III-V group nitride system semiconductor, and the second
cladding layer of a III-V group nitride system semiconductor of the
second conductivity type. It is preferable to form the cap layer on
the entire surface of the active layer in close contact.
The active layer may be composed of an InGaN layer. This provides
remarkable effect since indium is susceptible to elimination. The
cap layer may be formed of an AlGaN layer, and is preferably formed
of a GaN layer.
The cap layer of Al.sub.uGa.sub.1-.mu.N, and the second cladding
layer of Al.sub.zGa.sub.1-zN of the second conductivity type,
wherein the Al composition ratio u of the cap layer is preferably
smaller than the Al composition ratio z of the second cladding
layer. It is preferable from the point of view of manufacturing
yield that the first cladding layer is formed of GaN.
Particularly, it is more preferable that the Al composition ratio u
of the cap layer is approximately 0.1 or smaller. It is more
preferable that the cap layer is formed of GaN. In this case, the
cap layer formed of a GaN layer suppresses elimination of
constituent elements such as indium from the active layer. This
provides significantly larger luminous intensity.
The cap layer preferably has a larger bandgap than the active
layer. This prevents the cap layer from serving as a light emitting
region.
It is preferable that the cap layer has a bandgap intermediate
between those of the active layer and the second cladding layer.
This allows reduction of the operating voltage.
It is preferable that the cap layer has impurity concentration
lower than that of the second cladding layer. This reduces the
possibility of undesirable impurity diffusion from the cap layer
side into the active layer, thus suppressing deterioration of
luminous intensity due to undesirable impurity diffusion.
Particularly, it is more preferable that the cap layer is an
undoped layer. This allows almost no undesirable impurity diffusion
from the cap layer side into the active layer. This sufficiently
suppresses luminous intensity deterioration due to undesirable
impurity diffusion.
It is preferable that the cap layer has a thickness of
approximately not less than 200 .ANG. and approximately not more
than 400 .ANG.. This provides significantly increased luminous
intensity.
The first cladding layer may be formed on a substrate composed of a
semiconductor or an insulator with a buffer layer composed of
Al.sub.xGa.sub.1-xN interposed therebetween, and the Al composition
ratio x of the buffer layer is preferably larger than 0 and not
larger than 1. This improves the manufacturing yield.
Particularly, it is more preferable that the Al composition ratio x
of the buffer layer is 0.4 or larger, and smaller than 1. This
further improves the manufacturing yield. It is still more
preferable that the Al composition ratio x of the buffer layer is
not less than 0.4, and not more than 0.6. This still further
improves the manufacturing yield.
The light emitting device may further include an under-layer
composed of Al.sub.yGa.sub.1-yN between the buffer layer and the
first cladding layer, wherein the Al composition ratio y of the
underlayer is preferably 0 or larger, and smaller than 1. This
improves the manufacturing yield.
A method of manufacturing a light emitting device according to
another aspect of the present invention includes the steps of
forming an active layer composed of a compound semiconductor
containing indium by a vapor phase growth method and forming a cap
layer composed of a compound semiconductor on the active layer by a
vapor phase growth method at a temperature approximately equal to
or lower than a growth temperature for the active layer.
According to the manufacturing method of the invention, formation
of the cap layer on the active layer at a growth temperature
approximately equal to or lower than the growth temperature for the
active layer suppresses elimination of constituent elements such as
indium from the active layer. This provides larger luminous
intensity.
The manufacturing method of the present invention may further
include the step of forming a cladding layer composed of a compound
semiconductor on the cap layer by a vapor phase growth method at a
growth temperature higher than the growth temperature allowing
crystal growth of the active layer.
The active layer may be composed of a nitride system semiconductor
and the cap layer of a nitride system semiconductor. The cladding
layer may be formed of a nitride system semiconductor of one
conductivity type.
The active layer may be composed of a III-V group nitride system
semiconductor and the cap layer of a III-V group nitride system
semiconductor. The cladding layer may be formed of a III-V group
nitride system semiconductor of one conductivity type.
Particularly, the active layer may be formed of an InGaN layer. In
this case, a remarkable effect is obtained since indium is
susceptible to elimination.
It is preferable that the cap layer is composed of
Al.sub.uGa.sub.1-uN, the cladding layer is composed of
Al.sub.zGa.sub.1-zN of one conductivity type, and that the Al
composition ratio u of the cap layer is smaller than the Al
composition ratio z of the cladding layer.
Particularly, it is preferable that the Al composition ratio u of
the cap layer is approximately 0.1 or smaller. It is more
preferable that the cap layer is composed of GaN. In this case,
since the cap layer is formed of a GaN layer, elimination of
constituent elements such as indium from the active layer is
suppressed, thus providing significantly larger luminous
intensity.
Particularly, it is preferable that the cap layer is an undoped
layer. In this case, there is almost no possibility a of diffusion
of undesirable impurities from the cap layer side to the active
layer side. This sufficiently suppresses deterioration of luminous
intensity due to undesirable impurity diffusion.
It is preferred that the cap layer has a thickness of approximately
not smaller than 200 .ANG. and approximately not larger than 400
.ANG.. This enables remarkable improvement of the luminous
intensity.
It is preferable to form the cap layer at a growth temperature
approximately equal to that for the active layer. This allows the
cap layer to be continuously formed without a time interval after
formation of the active layer, which considerably prevents
elimination of constituent elements from the active layer.
The growth temperature for the cap layer is preferably set to a
temperature which allows crystal growth of the active layer. The
active layer is preferably formed at a growth temperature not lower
than 700.degree. C. and not higher than 950.degree. C. The cap
layer is preferably formed at a growth temperature not lower than
700.degree. C. and not higher than 950.degree. C. The formation of
the cap layer on the active layer at a low growth temperature
suppresses elimination of constituent elements such as indium from
the active layer.
It is preferable that the active layer has a quantum well structure
including an InGaN quantum well layer and a GaN quantum barrier
layer and the GaN quantum barrier layer is formed by a vapor phase
growth method at a growth temperature not lower than 700.degree. C.
and not higher than 950.degree.. In this case, elimination of
constituent elements such as indium from the InGaN quantum well
layer is suppressed, thus enabling larger luminous intensity. An
InGaN having an In composition ratio lower than that of the quantum
well layer may be used as the quantum barrier layer.
A method of manufacturing a light emitting device according to
still another aspect of the present invention includes the steps of
forming a first cladding layer composed of a compound semiconductor
of a first conductivity type by a vapor phase growth method,
forming an active layer composed of a compound semiconductor
containing indium by a vapor phase growth method on the first
cladding layer, forming a cap layer composed of a compound
semiconductor on the active layer by a vapor phase growth method at
a growth temperature approximately equal to or lower than a
temperature allowing vapor phase growth of the active layer, and
forming a second cladding layer composed of a compound
semiconductor of a second conductivity type on the cap layer by a
vapor phase growth method at a temperature higher than the
temperature allowing vapor phase growth of the active layer.
The first cladding layer may be composed of a nitride system
semiconductor of the first conductivity type, the active layer of a
nitride system semiconductor, the cap layer of a nitride system
semiconductor, and the second cladding layer of a nitride system
semiconductor of the second conductivity type.
The first cladding layer may be formed of a III-V group nitride
system-semiconductor of the first conductivity type, the active
layer of a III-V group nitride system semiconductor, the cap layer
of a III-V group nitride system semiconductor, and the second
cladding layer of a III-V group nitride system semiconductor of the
second conductivity type.
It is preferable to form a buffer layer composed of a
non-single-crystal III-V group nitride system semiconductor and a
single-crystal underlayer composed of an undoped III-V group
nitride system semiconductor in this order on a substrate and then
perform crystal growth for the first cladding layer, the active
layer, the cap layer and the second cladding layer. It is
preferable that the buffer layer is formed of AlGaN. The buffer
layer may be formed of AlN. The underlayer is preferably formed of
GaN and the underlayer may be formed of AlGaN.
These and other objects, features, aspects and advantages of the
present invention will become more apparent from the following
detailed description of the present invention when taken in
conjunction with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a schematic cross-sectional diagram of a light emitting
diode according to a first embodiment of the present invention.
FIG. 2 is a schematic cross-sectional diagram of a light emitting
diode according to a third embodiment of the present invention.
FIG. 3 is a schematic cross-sectional diagram of a semiconductor
laser device according to a fourth embodiment of the present
invention.
FIG. 4 is a schematic cross-sectional diagram of a semiconductor
laser device according to a fifth embodiment of the present
invention.
FIG. 5 is a schematic cross-sectional diagram of a semiconductor
laser device according to a sixth embodiment of the present
invention.
FIG. 6 is a schematic cross-sectional diagram showing an example of
a structure to which the present invention can be applied.
FIG. 7 is a schematic cross-sectional diagram showing another
example of a structure to which the present invention is
applicable.
FIG. 8 is a schematic cross-sectional diagram of a conventional
light emitting diode.
DESCRIPTION OF THE PREFERRED EMBODIMENT
A light emitting diode composed of III-V group nitride system
semiconductors according to a first embodiment of the present
invention will now be described in detail referring to FIG. 1.
In FIG. 1, formed in order on a sapphire insulating substrate 1 are
a 110-.ANG.-thick undoped Al.sub.xGa.sub.1-xN (x=0.5) buffer layer
2, a 0.2-.mu.m-thick undoped GaN underlayer 3, a 4-.mu.m-thick
Si-doped n-type GaN contact layer 4 also serving as an n-type
cladding layer, and a 0.2-.mu.m-thick Zn- and Si-doped
In.sub.qGa.sub.1-qN (q=0.05) active layer 5. Formed in order on the
InGaN active layer 5 are a 200-.ANG.-thick undoped GaN cap layer 6
for preventing crystal deterioration of the active layer 5, a
0.15-.mu.m-thick Mg-doped p-type Al.sub.zGa.sub.1-zN (z=0.2)
cladding layer 7, and a 0.3-.mu.m-thick Mg-doped p-type GaN contact
layer 8.
The part from the p-type GaN contact layer 8 to a certain position
in the n-type GaN contact layer 4 is removed, so that the n-type
GaN contact layer 4 is exposed. A p electrode 9 composed of Au is
formed on the upper surface of the p-type GaN contact layer 8 and
an n electrode 10 composed of Al is formed on the n electrode
formation region where the n-type GaN contact layer 4 is
exposed.
A method of manufacturing the above-described light emitting diode
will be explained. In this embodiment, the individual layers are
formed by metal organic chemical vapor deposition (MOCVD).
First, the substrate 1 is placed in a metal organic chemical vapor
deposition apparatus. Then, with the substrate 1 held at a
non-single crystal growth temperature, e.g., a growth temperature
(a substrate temperature) of 600.degree. C., the non-single-crystal
undoped AlGaN buffer layer 2 is grown on the substrate 1 by using
H.sub.2 and N.sub.2 as carrier gas and ammonia, trimethylgallium
(TMG) and trimethylaluminum (TMA) as material gas.
Subsequently, with the substrate 1 held at a single crystal growth
temperature, or a growth temperature preferably of
1000-1200.degree. C., e.g., 1150.degree. C., the single-crystal
undoped GaN underlayer 3 is grown on the buffer layer 2 by using
H.sub.2 and N.sub.2 as carrier gas and ammonia and trimethylgallium
(TMG) as material gas.
Then with the substrate 1 held at a single crystal growth
temperature, or a growth temperature preferably of
1000-1200.degree. C., e.g., 1150.degree. C., the single-crystal
Si-doped n-type GaN contact layer 4 is grown on the underlayer 3 by
using H.sub.2 and N.sub.2 as carrier gas, ammonia and
trimethylgallium (TMG) as material gas, and SiH.sub.4 as dopant
gas.
Next, with the substrate 1 held at a single crystal growth
temperature, or preferably at a growth temperature of
700-950.degree. C., e.g., at 860.degree. C., the single-crystal Si-
and Zn-doped InGaN active layer 5 is grown on the n-type contact
layer 4 by a1) using H.sub.2 and N.sub.2 as carrier gas, ammonia,
triethylgallium (TEG) and trimethylindium (TMI) as material gas,
and SiH.sub.4 and diethylzinc (DEZ) as dopant gas.
Subsequently, with the substrate 1 held at a temperature equal to
or lower than the growth temperature for the active layer 5, or at
860.degree. C. in this embodiment, the single-crystal undoped GaN
cap layer 6 is grown on the InGaN active layer 5 continuously
following the growth of the active layer 5 by using H.sub.2 and
N.sub.2 as carrier gas, and ammonia and trimethylgallium (TMG) as
material gas. Triethylgallium (TEG) may be used in place of
trimethylgallium (TMG).
Then with the substrate 1 held at a single crystal growth
temperature, i.e., preferably at a growth temperature of
1000-1200.degree. C., e.g.. at 1150.degree. C., the single-crystal
Mg-doped p-type AlGaN cladding layer 7 is grown on the GaN cap
layer 6 by using H.sub.2 and N.sub.2 as carrier gas, ammonia,
trimethylgallium (TMG) and trimethylaluminum (TMA) as material gas,
and Cp.sub.2Mg (cyclopentadienylmagnesium) as dopant gas.
Next, with the substrate 1 held at a single crystal growth
temperature, i.e., preferably at a growth temperature of
1000-1200.degree. C., e.g., at 1150.degree. C., the single-crystal
Mg-doped p-type GaN contact layer 8 is grown on the p-type cladding
layer 7 by using H.sub.2 and N.sub.2 as carrier gas, ammonia and
trimethylgallium (TMG) as material gas, and Cp.sub.2Mg
(cyclopentadienylmagnesium) as dopant gas.
After the crystal growth, the substrate 1 is taken out from the
apparatus and the part from the p-type contact layer 8 to the
midway in the n-type contact layer 4 is removed by reactive ion
beam etching (RIE) to form the n electrode formation region in
which the n-type contact layer 4 is exposed.
Then a heat treatment is performed at 750-800.degree. C. for 30-60
minutes in an atmosphere of nitrogen to activate the dopants in the
p-type contact layer 8 and the p-type cladding layer 7 to obtain
high carrier concentration and to correct crystal deterioration in
the n-type contact layer 4 caused by the etching.
Then the p electrode 9 composed of Au is formed by evaporation, or
the like, on the p-type contact layer 8 and the n electrode 10
composed of Al is formed by evaporation or the like on the n
electrode formation region of the n-type contact layer 4. A heat
treatment at 500.degree. C. is then applied to cause the p
electrode 9 and the n electrode 10 to come into ohmic contact with
the p-type contact layer 8 and the n-type contact layer 4,
respectively, to form the light emitting diode shown in FIG. 1.
This light emitting diode, having the undoped GaN cap layer 6 in
close contact with the InGaN active layer 5, prevents elimination
of constituent elements such as In from the InGaN active layer 5 in
or after formation of the active layer 5. This reduces the number
of crystal defects in the active layer 5, suppressing deterioration
of the crystallinity.
Furthermore, it is thought that undesirable impurity diffusion into
the active layer 5 is suppressed since it has a less number of
crystal defects.
Moreover, since the GaN cap layer 6 of this embodiment is a
so-called undoped layer formed without intentional use of dopant,
undesirable impurity diffusion into the InGaN active layer 5 is
sufficiently suppressed.
As discussed above, in this embodiment, the effect of suppressing
impurity diffusion into the active layer 5 is produced because the
number of crystal defects in the active layer 5 is reduced by
suppressing elimination of constituent elements from the active
layer 5 and the effect of suppressing impurity diffusion into the
active layer 5 is produced because the cap layer 6 is an undoped
layer which remarkably suppresses undesirable impurity diffusion
into the active layer 5.
Accordingly, while light emitting diodes having the same structure
as this embodiment except that they have no cap layer 6 suffer from
large variations in light emission wavelength, no light emission or
low light emission, the light emitting diode of this embodiment
achieves small variations in the light emission wavelength and
considerably increased luminous intensity.
Particularly, when manufacturing the light emitting diode of this
embodiment, the undoped GaN cap layer 6 is grown right on the
entire surface of the InGaN active layer 5 at a temperature not
higher than the growth temperature for the InGaN active layer 5.
This not only prevents elimination -7 constituent elements of the
InGaN active layer 5 when forming the cap layer 6 but also prevents
elimination of constituent elements from the InGaN active layer 5
after formation of the cap layer 6. Accordingly, the manufacturing
method of this embodiment is desirable.
Especially, in this embodiment, continuously growing the InGaN
active layer 5 and the GaN cap layer 6 at approximately equal
growth temperatures sufficiently suppresses elimination of
constituent elements from the InGaN active layer 5 and mass
productivity is improved.
With the aforementioned structure, the luminous intensity was 340
(arbitrary unit) with a 200-.ANG.-thick GaN cap layer 6. With a
100-.ANG.-thick GaN cap layer 6, the luminous intensity was 36
(arbitrary unit). This is larger than that of a structure having no
cap layer 6, but is about one-tenth that of the 200-.ANG.-thick cap
layer 6. With a 300-.ANG.-thick GaN cap layer 6, the luminous
intensity was 1.4 times that of the 200-.ANG.-thick one, and with a
400-.ANG.-thick GaN cap layer 6, it was 0.8 times that of the
200-.ANG.-thick one.
This suggests that a preferable effect is obtained when the GaN cap
layer 6 has a thickness between 200-400 .ANG., or that it is
preferable that the GaN cap layer 6 has a thickness large enough to
cause almost no quantum effect.
In this embodiment, the non-single-crystal AlGaN buffer layer 2 is
formed on the substrate 1 and then the undoped GaN single-crystal
underlayer 3 is formed under single crystal growth conditions. This
easily provides the underlayer 3 with remarkably improved surface
conditions, which suppresses leakage current of the device and
increases manufacturing yield of the devices.
When a GaN layer is used as the non-single-crystal buffer layer 2,
it is likely to suffer from pits in the surface, which may lead to
through defects. It is therefore undesirable to use a GaN layer as
the buffer layer 2 from the point of view of the manufacturing
yield. As a non-single crystal buffer layer 2 used in combination
with the undoped single-crystal underlayer 3, use of an AlN layer
is preferable in the point of view of the manufacturing yield, and
the use of an AlGaN layer is the most desirable.
The surface conditions and FWHM (Full Width Half Maximum) of X-ray
diffraction spectrum were measured with AlGaN layers having various
Al composition ratios. Table 2 below shows the measurements.
TABLE-US-00002 TABLE 2 Al composition Surface conditions X-ray FWHM
(arcsec) 1.0 good 550 0.8 good 504 0.6 good 451 0.4 good 390 0.2
many pits 428 0 many pits unknown
The results in Table 2 show that it is desirable that the AlGaN
layer has an Al composition ratio of 0.4 or greater, and smaller
than 1, and more desirably, not smaller than 0.4 nor larger than
0.6.
As the undoped single-crystal underlayer 3, an AlGaN layer may be
used in place of the GaN layer, but an AlN layer is not preferable
because it is likely to suffer from cracking on the surface.
Next, a light emitting diode formed of III-V group nitride system
semiconductors in a second embodiment of the present invention will
be described.
This embodiment differs from the first embodiment in that it uses a
200-.ANG.-thick undoped Al.sub.uGa.sub.1-uN layer as the cap layer
6 in place of the undoped GaN layer. The value of u is
approximately 0.1 and 0.2. This Al.sub.uGa.sub.1-uN layer, too, is
formed by MOCVD at the same temperature as the growth temperature
for the active layer 5, at 860.degree. C. in this embodiment.
H.sub.2 and N.sub.2 are used as carrier gas and ammonia,
trimethylgallium (TMG) and trimethylaluminum (TMA) are used as
material gas. Triethylgallium (TEG) may be used instead of
trimethylgallium (TMG).
It was seen that the light emitting diode of this embodiment also
provides remarkably larger luminous intensity than a light emitting
diode having no cap layer 6.
However, as compared with the 200-.ANG.-thick undoped GaN cap layer
6 in the first embodiment regarded as providing a luminous
intensity of 450 (arbitrary unit), an undoped Al.sub.uGa.sub.1-uN
cap layer 6 with an Al composition ratio u of about 0.1 in the
second embodiment provided a luminous intensity smaller than half
thereof, 190 (arbitrary unit).
With an undoped Al.sub.uGa.sub.1-uN cap layer 6 having an Al
composition ratio u of about 0.2, the luminous intensity was
one-third that for the Al composition ratio u of 0.1.
This shows that it is the most preferable to use a GaN layer as the
cap layer 6 and that when using an Al.sub.uGa.sub.1-uN layer, a
small Al composition ratio u as 0.1 is preferable. The larger an Al
composition ratio is, the larger the bandgap of an AlGaN is. The Al
composition ratio of the p-type cladding layer 7 is 0.2 as
described in the first embodiment. When the Al composition ratio of
the cap layer 6 is 0.1, the bandgap of the cap layer 6 is smaller
than that of the p-type cladding layer 7. From this, it is
understood that it is preferable that the cap layer 6 has a bandgap
between that of the active a layer 5 and that of the p-type
cladding layer 7.
Next, a light emitting diode composed of III-V group nitride system
semiconductors in a third embodiment of the invention will be
described referring to FIG. 2.
This embodiment differs from the first embodiment in that it uses
no GaN underlayer 3, whose manufacturing method is the same as that
in the first embodiment except that it excludes the process step
for forming the GaN underlayer 3.
While the light emitting diode of this embodiment provides lower
yield than the light emitting diode of the first embodiment, it
achieves larger luminous intensity than a light emitting diode
having no cap layer 6.
Although the light emitting diodes of the above-described
embodiments have the active layer 5 on the n-type contact layer 4,
an n-type AlGaN cladding layer may be provided between the n-type
contact layer 4 and the active layer 5. An n-type AlGaN cladding
layer and an n-type InGaN layer may be provided between the n-type
contact layer 4 and the active layer 5.
The aforementioned embodiments use an active layer with a
non-quantum-well structure as the active layer 5, rather than a
quantum-well structure. However, needless to say, an active layer
with a single-quantum-well structure or a multi-quantum-well
structure may be used. For example, the active layer may have a
single-quantum-well structure formed of an In.sub.zGa.sub.1-zN
(1>s>0) quantum well layer, or a multi-quantum-well structure
formed of an In.sub.zGa.sub.1-zN (1>s>0) quantum well layer
and an In.sub.rGa.sub.1-rN (1>s>r.gtoreq.0) quantum barrier
layer.
When using a multi-quantum-well structure formed of an
In.sub.sGa.sub.1-sN (1>s>0) quantum well layer and a GaN
quantum barrier layer, it is preferable to form the GaN quantum
barrier layer at a growth temperature not lower than 700.degree. C.
nor higher than 950.degree. C., and it is also preferable to grow
the quantum well layer and the quantum barrier layer at
approximately equal growth temperatures.
Although the light emitting diodes of the embodiments use an Si-
and Zn-doped active layer 5, an undoped active layer may be
used.
Next, an index guided semiconductor laser device in a fourth
embodiment of the present invention will be explained referring to
FIG. 3. This semiconductor laser device is a self-aligned
semiconductor laser device.
In FIG. 3, formed in order on a sapphire insulating substrate 11
are an undoped AlGaN buffer layer 12 with a thickness of about
100-200 .ANG., an undoped GaN underlayer 13 with a thickness of 0.4
.mu.m, an n-type GaN contact layer 14 with a thickness of 4 .mu.m,
and an n-type AlGaN cladding layer 15 with a thickness of 0.1-0.5
.mu.m. Formed in order on the n-type AlGaN cladding layer 15 are an
InGaN active layer 16, an undoped GaN cap layer 17 with a thickness
of 200-400 .ANG., and a p-type AlGaN cladding layer 18 with a
thickness of 0.1-0.5 .mu.m.
An n-type GaN or n-type AlGaN current blocking layer 19 with a
thickness of 0.2-0.3 .mu.m having a stripe-like opening in the
center part is formed on the p-type AlGaN cladding layer 18. A
p-type GaN contact layer 20 having a thickness of 0.1-0.5 .mu.m is
formed on the top surface and in the stripe-like opening of the
n-type current blocking layer 19.
A p electrode 21 is formed on the p-type GaN contact layer 20 and
an n electrode 22 is formed on the n-type GaN contact layer 14.
As the active layer 16, a non-quantum-well structure layer may be
used, or a single-quantum-well structure layer or a
multi-quantum-well layer may be used. In the case of a
non-quantum-well structure layer, the thickness is set to about 0.1
to 0.3 .mu.m. In the case of a single-quantum-well structure layer,
the thickness of the quantum well layer is set to 10-50 .ANG., and
in the case of a multi-quantum-well structure layer, the thickness
of the quantum well layer is set to 10-50 .ANG. and the thickness
of the quantum barrier layer is set to about 10-100 .ANG.,
This semiconductor laser device is manufactured by performing
crystal growth once by using chemical vapor deposition, such as
MOCVD. When manufacturing, the undoped AlGaN buffer layer 12 is
formed at a growth temperature or 600.degree. C., the undoped GaN
underlayer 13, the n-type GaN contact layer 14 and the n-type AlGaN
cladding layer 15 are formed at a growth temperature of
1150.degree. C., the InGaN active layer 16 and the GaN cap layer 17
are formed at a growth temperature of 700-950.degree. C., and the
p-type AlGaN cladding layer 18, the n-type current blocking layer
19 and the p-type GaN contact layer 20 are formed at a growth
temperature of 1150.degree. C.
The semiconductor laser device of this embodiment also provides
larger luminous intensity than a semiconductor laser device having
no cap layer 17.
Next, an index guided semiconductor laser device according to a
fifth embodiment of the invention will be explained referring to
FIG. 4. This semiconductor laser device is a ridge-buried type
semiconductor laser device.
In FIG. 4, formed in order on a sapphire insulating substrate 31
are an undoped AlGaN buffer layer 32 with a thickness of 100-200
.ANG., an undoped GaN underlayer 33 with a thickness of 0.4 .mu.m,
an n-type GaN contact layer 34 with a thickness of 4 .mu.m, and an
n-type AlGaN cladding layer 35 with a thickness of 0.1-0.5 82 m.
Formed in order on the n-type AlGaN cladding layer 35 are an InGaN
active layer 36, an undoped GaN cap layer 37 with a thickness of
200-400 .ANG., and a p-type AlGaN cladding layer 38 with a
thickness of 0.1-0.5 .mu.m. The InGaN active layer 36 has the same
structure and thickness as the InGaN active layer 16 in the fourth
embodiment.
The p-type AlGaN cladding layer 38 has a flat region and a ridge
region formed in the center of the flat region. A p-type GaN cap
layer 39 having a thickness of 0.1 .mu.m is formed on the ridge
region of the p-type AlGaN cladding layer 38. An n-type GaN or
n-type AlGaN current blocking layer 40 having a thickness of
0.2-0.3 .mu.m is formed on the upper surface of the flat region and
the side surfaces of the ridge region of the p-type AlGaN cladding
layer 38 and on the side surfaces of the p-type cap layer 39. A
p-type GaN contact layer 41 having a thickness of 0.1-0.5 .mu.m is
formed on the p-type cap layer 39 and the n-type current blocking
layer 40.
A p electrode 42 is formed on the p-type GaN contact layer 41 and
an n electrode 43 is formed on the n-type GaN contact layer 34.
This semiconductor laser device is manufactured by performing
crystal growth three times by using chemical vapor deposition such
as MOCVD. When manufacturing, the undoped AlGaN buffer layer 32 is
formed at a growth temperature of 600.degree. C., the undoped GaN
underlayer 33, the n-type GaN contact layer 34 and the n-type AlGaN
cladding layer 35 are formed at a growth temperature of
1150.degree. C., the InGaN active layer 36 and the undoped GaN cap
layer 37 are formed at a growth temperature of 700-950.degree. C.,
and the n-type AlGaN cladding layer 38, the p-type cap layer 39,
the n-type current blocking layer 40 and the p-type GaN contact
layer 41 are formed at a growth temperature of 1150.degree. C.
The semiconductor laser device of this embodiment also provides
larger luminous intensity than a semiconductor laser device having
no cap layer 37.
Next, a gain guided semiconductor laser device according to a sixth
embodiment of the invention will be described referring to FIG.
5.
In FIG. 5, formed in order on a sapphire insulating substrate 51
are an undoped AlGaN buffer layer 52 having a thickness of 100-200
.ANG., an undoped GaN underlayer 53 having a thickness of 0.4
.mu.m, an n-type GaN contact layer 54 having a thickness of 4
.mu.m, and an n-type AlGaN cladding layer 55 having a thickness of
0.1-0.5 .mu.m.
Formed in order on the n-type AlGaN cladding layer 55 are an InGaN
active layer 56, an undoped GaN cap layer 57 having a thickness of
200-400 .ANG., a p-type AlGaN cladding layer 58 having a thickness
of 0.1-0.5 .mu.m, and a p-type GaN contact layer 59 having a
thickness of 0.1-0.5 .mu.m. The InGaN active layer 56 has the same
structure and thickness as the InGaN active layer 16 in the fourth
embodiment.
An SiO.sub.2, SiN, or n-type GaN current blocking layer 60 having a
stripe-like opening in the center is formed on the p-type GaN
contact layer 59. A p electrode 61 is formed on the p-type GaN
contact layer 59 and an n electrode 62 is formed on the n-type GaN
contact layer 54.
The semiconductor laser device of this embodiment is formed by
performing crystal growth once by using chemical vapor deposition
such as MOCVD. When manufacturing, the undoped AlGaN buffer layer
52 is formed at a growth temperature of 600.degree. C., the undoped
GaN underlayer 53, the n-type GaN contact layer 54 and the n-type
AlGaN cladding layer 55 are formed at a growth temperature of
1150.degree. C., the InGaN active layer 56 and the undoped GaN cap
layer 57 are formed at a growth temperature of 700-950.degree. C.,
and the p-type AlGaN cladding layer 58 and the p-type GaN contact
layer 59 are formed at a growth temperature of 1150.degree. C.
The semiconductor laser device of this embodiment, too, provides
larger luminous intensity than a semiconductor laser device having
no cap layer 57.
Although the first to sixth embodiments have shown light emitting
devices having semiconductor layers on an insulating substrate, the
present invention can be similarly applied to light emitting
devices having semiconductor layers on a conductive substrate such
as an SiC substrate and electrodes on the top surface of the
uppermost layer of the semiconductor layers and on the lower
surface of the substrate.
Although an active layer, a cap layer and a p-type cladding layer
are formed in this order on an n-type cladding layer in the
structures explained above, an active layer, a cap layer and an
n-type cladding layer may be formed in this order on a p-type
cladding layer. That is to say, the individual layers in the first
to sixth embodiments may have the opposite conductivity types.
The first to sixth embodiments have described applications of this
invention to light emitting devices such as light emitting diodes
and semiconductor laser devices, but the present invention is also
applicable to semiconductor devices having a compound semiconductor
laser containing In such as field effect transistors.
With the structure shown in FIG. 6, for example, an n-type AlGaN
layer 72 and an InGaN layer 73 are formed in order on an n-type GaN
layer 71 and a p-type SiC layer 75 is formed above the InGaN layer
73 with an undoped GaN cap layer 74 therebetween. In this case, the
InGaN layer 73 and the GaN cap layer 74 are formed at a growth
temperature of 700-950.degree. C. and the p-type SiC layer 75 is
formed at a growth temperature of 1300-1500.degree. C. In this
example, as well, formation of the undoped GaN cap layer 74 on the
InGaN layer 73 suppresses elimination of constituent elements such
as In from the InGaN layer 73.
In the structure of FIG. 7, an InGaN layer 82 is formed on an
n-type SiC layer 81 and a p-type SiC layer 84 is formed above the
InGaN layer 82 with an undoped GaN cap layer 83 therebetween. In
this case, as well, the InGaN layer 82 and the undoped GaN cap
layer 83 are formed at a growth temperature of 700-950.degree. C.
and the p-type SiC layer 84 is formed at a growth temperature of
1300-1500.degree. C. In this example, as well, formation of the
undoped GaN cap layer 83 on the InGaN layer 82 suppresses
elimination of constituent elements such as In from the InGaN layer
82.
The light emitting diodes of the first to third embodiments can be
applied to light sources for use in optical fiber communication
systems, light sources for use in photocouplers, monochromatic or
polychromatic pilot lamps, light sources for use in display devices
such as digital displays, level meters and displays, light sources
for use in facsimile devices, printer heads, signal lamps, lamps
for use in automobiles such as high-beam lamps, liquid-crystal
televisions, back-light sources for use in liquid-crystal displays,
amusement systems, and so on.
The semiconductor laser devices of the fourth to sixth embodiments
can be applied to laser surgical knives, light sources for use in
optical communication systems, light sources for use in optical
pick-up devices in disk systems for DVD (Digital Video Disk) and
the like, light sources for use in color laser beam printers, light
sources for use in laser processing devices, light sources for
laser holographies, light sources for laser displays, light sources
for amusement systems, and so on.
While the invention has been described in detail, the foregoing
description is in all aspects illustrative and not restrictive. It
is understood that numerous other modifications and variations can
be devised without departing from the scope of the invention.
* * * * *