U.S. patent number RE36,760 [Application Number 09/108,325] was granted by the patent office on 2000-07-04 for method and apparatus for altering material using ion beams.
This patent grant is currently assigned to Sandia Corporation. Invention is credited to Douglas D. Bloomquist, Rudy Buchheit, John B. Greenly, Dale C. McIntyre, Eugene L. Neau, Regan W. Stinnett.
United States Patent |
RE36,760 |
Bloomquist , et al. |
July 4, 2000 |
Method and apparatus for altering material using ion beams
Abstract
A method and apparatus for treating material surfaces using a
repetitively pulsed ion beam. In particular, a method of treating
magnetic material surfaces in order to reduce surface defects, and
product amorphous fine grained magnetic material with properties
that can be tailored by adjusting treatment parameters of a pulsed
ion beam. In addition, to a method of surface treating materials
for wear and corrosion resistance using pulsed particle ion
beams.
Inventors: |
Bloomquist; Douglas D.
(Albuquerque, NM), Buchheit; Rudy (Columbus, OH),
Greenly; John B. (Lansing, NY), McIntyre; Dale C.
(Albuquerque, NM), Neau; Eugene L. (Albuquerque, NM),
Stinnett; Regan W. (Albuquerque, NM) |
Assignee: |
Sandia Corporation
(Albuquerque, NM)
|
Family
ID: |
26850340 |
Appl.
No.: |
09/108,325 |
Filed: |
July 1, 1998 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
|
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153248 |
Nov 16, 1993 |
5473165 |
|
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Reissue of: |
317948 |
Oct 4, 1994 |
05532495 |
Jul 2, 1996 |
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Current U.S.
Class: |
250/492.21;
250/492.1; 250/492.3 |
Current CPC
Class: |
B29C
59/16 (20130101); C08J 7/123 (20130101); C23C
14/48 (20130101); H01J 27/14 (20130101); C23C
8/36 (20130101); B29C 2035/0872 (20130101); H01J
2237/31701 (20130101); H01J 2237/08 (20130101) |
Current International
Class: |
B29C
59/00 (20060101); B29C 59/16 (20060101); C23C
14/48 (20060101); C23C 8/36 (20060101); C23C
8/06 (20060101); H01J 27/14 (20060101); H01J
27/02 (20060101); B29C 35/08 (20060101); G21K
005/04 () |
Field of
Search: |
;250/492.21,492.2,492.1,492.3 ;427/523 ;437/2,174 |
References Cited
[Referenced By]
U.S. Patent Documents
Other References
Harjes et al., "Status of the Repetitive High Energy Pulsed Power
Project" 8th IEEE International Pulsed Power Conference, pp.
543-548, Jun. 1991. .
Stinnet et al., "Surface Treatment With Pulsed Ion Beams", Division
of Plasma Physics, Seattle, WA, Nov. 1992. .
Greenly et al., "Plasma-Anode Ion Diode Research at Cornell" 8th
Intl. Conf. on High-Power Particle Beams, pp. 199-206, Jul.
1990..
|
Primary Examiner: Berman; Jack I.
Attorney, Agent or Firm: McDermott, Will & Emery
Government Interests
The United States Government has rights in this invention pursuant
to Contract No. DE-AC04-76DP00789.
Parent Case Text
This application is a Continuation-In-Part of U.S. patent
application Ser. No. 08/153,248 filed Nov. 16, 1993.[...].
.Iadd.now U.S. Pat. No. 5,473,165. .Iaddend.
Claims
We claim:
1. A process for uniformly altering a characteristic of a surface
of a material to a depth of<several hundred microns comprising
the step of irradiating a surface of the material with a
repetitively pulsed ion beam from an ion beam source .Iadd.having
an anode electrode and a cathode electrode, defining therebetween
an acceleration gap, and producing ions created by ionizing an
injected gas.Iaddend., wherein each pulse of the pulsed ion beam
has a duration of .ltoreq.1000 ns at .[.(an.]. .Iadd.said
.Iaddend.accelerating gap.[.) between an anode electrode means and
a cathode electrode means n the ion beam source.]., a total beam
energy delivered to the material of >1 Joule/pulse, an impedance
of <1000.OMEGA., a repetition rate of >1 Hz, an ion kinetic
energy of >50 keV, and an ion penetration depth of <50
microns.
2. The process of claim 1 wherein the depth of ion penetration is
controlled by controlling the kinetic energy of the ion beam.
3. The process of claim 1 wherein the depth of ion penetration is
controlled by controlling the atomic mass of the ions in the ion
beam.
4. The process of claim 1 wherein the depth of ion penetration is
controlled by controlling the atomic number of the ions in the ion
beam.
5. The process of claim 1 wherein the characteristic is surface
smoothness which is modified to a surface roughness of <0.5
microns.
6. The process of claim 5 wherein the material is a fine grain,
sintered material.
7. The process of claim 5 wherein the surface is a food preparation
surface.
8. The process of claim 7 wherein the food preparation surface is a
food cooking surface.
9. The process of claim 5 wherein the material is an amorphous
magnetic alloy.
10. The process of claim 9 wherein the alloy has the approximate
composition of Fe.sub.66 Co.sub.18 B.sub.15 S.sub.1.
11. The process of claim 1 wherein the surface characteristic is
the presence of an unwanted contaminant.
12. The process of claim 11 wherein the unwanted contaminant is a
machining lubricant.
13. The process of claim 11 wherein the unwanted contaminant is
solder flux.
14. The process of claim 11 wherein the unwanted contaminants is
biological contamination.
15. The process of claim 11 wherein the unwanted contaminants is a
surface coating.
16. The process of claim 1 wherein the total beam energy delivered
to the material per pulse is <10 Joules/pulse and the surface
characteristic to be altered is the presence of the top 1-2 microns
of the material which is removed by ablation.
17. The process of claim 1 wherein the total beam energy delivered
to the material per pulse is <20 Joules/pulse and the surface
characteristic is shock hardening.
18. The process of claim 16 wherein the ablation produces
vaporization of the surface of the material which redeposits upon
the surface of the material.
19. The process of claim 16 wherein the ablation produces
vaporization of the surface of the material which redeposits upon a
surface of a second material.
20. The process of claim 16 further including protection of certain
areas of the surface of the material by mask means which protect
the surface from the ablation.
21. The process of claim 1 wherein the surface characteristic to be
altered is hardness.
22. The process of claim 1 wherein the surface characteristic to be
altered is corrosion resistance.
23. The process of claim 22 wherein the material is steel.
24. The process of claim 22 wherein the material comprises
aluminum.
25. The process of claim 23 wherein the material is stainless steel
that has been heat treated to above 600.degree. C.
26. The process of claim 1 wherein the surface characteristic to be
altered is resistance of welds to stress cracking.
27. The process of claim 1 wherein the surface characteristic to be
altered is resistance of welds to corrosion.
28. The process of claim 1 wherein the surface characteristic to be
altered is the formation of non-equilibrium structures within the
surface.
29. The process of claim 28 wherein the non-equilibrium structures
are selected from the group consisting of amorphous structures,
disordered crystalline structures, and nanocrystalline structures
not present in the original material.
30. The process of claim 1 wherein the area of continuous and
uniform alteration of the characteristics is >5 cm.sup.2.
31. The process of claim 1 wherein the ion species are selected
from the group consisting of hydrogen, helium, oxygen, nitrogen
fluorine, neon, chlorine, argon, lithium, beryllium, boron, carbon,
sodium, magnesium, aluminum, silicon, phosphorous, sulfur,
potassium and the isotopes thereof.
32. The process of claim 1 wherein the material is selected from
the group consisting of intermetallic materials, amorphous
materials, crystalline materials, nano-crystalline materials,
dielectrics, polymers, semiconductors, ceramics and glasses.
.Iadd.
33. A method of smoothing a surface of a bulk material
comprising:
(a) generating an ion beam using a magnetically confined anode
plasma ion source comprising a vacuum chamber having an anode
assembly including an anode electrode and a fast driving coil and a
cathode assembly including a cathode electrode and a slow driving
coil, the anode electrode and cathode electrode defining there
between an acceleration gap said step of generating further
comprising:
(i) introducing a puff of gas into said vacuum chamber to produce a
localized volume of gas adjacent said fast driving coil but
insulated from said fast driving coil;
(ii) pre-ionizing said gas using said fast driving coil;
(iii) further ionizing said gas while moving said gas away from
said fast driving coil to create a thin, magnetically confined
plasma layer;
(iv) applying a pulsed power signal to said anode electrode to form
an ion beam from said plasma;
(v) extracting said ion beam with little or no rotation thereof;
and
(b) directing said beam at said surface to reduce the total surface
area. .Iaddend..Iadd.34. The method according to claim 33, wherein
said step of directing comprises melting a near surface layer of
said bulk material, and resolidifying said near surface layer
without melting said bulk material. .Iaddend..Iadd.35. The method
according to claim 34 further comprising controlling the duration
of exposure of said surface to said
ion beam to improve surface morphology. .Iaddend..Iadd.36. The
method according to claim 34, wherein said bulk material is a fine
grain sintered material. .Iaddend..Iadd.37. The method according to
claim 36, wherein said material includes ceramic materials and
powder metallurgy materials. .Iaddend..Iadd.38. The method
according to claim 36, wherein said steps of melting and
resolidifying produce a glassy surface. .Iaddend..Iadd.39. The
method according to claim 36, wherein said steps of melting and
resolidifying produce a alloy surface. .Iaddend..Iadd.40. The
method according to claim 38, wherein said surface comprises a
non-equilibrium form of the bulk material. .Iaddend..Iadd.41. The
method according to claim 39, wherein said surface comprises a
non-equilibrium form of the bulk material. .Iaddend..Iadd.42. The
method according to claim 34, wherein said method is repeated
whereby said surface is repeatedly melted, each time resulting in a
smoother surface. .Iaddend..Iadd.43. The method according to claim
34, further comprising the step of removing surface
defects. .Iaddend..Iadd.44. The method according to claim 43,
wherein said surface defects comprise machining marks from a
machining process. .Iaddend..Iadd.45. The method according to claim
44, wherein said post smoothing process surface is free of sharp or
abrupt features. .Iaddend..Iadd.46. The method according to claim
44, wherein the surface contour generated by the machining process
is unchanged by the smoothing process. .Iaddend..Iadd.47. The
method according to claim 34, wherein the surface to be smoothed is
a wear surface. .Iaddend..Iadd.48. The method according to claim
43, wherein said surface defect comprises a surface crack.
.Iaddend..Iadd.49. The method according to claim 43, wherein said
surface defects comprises potential corrosion sites and said method
results in a corrosion resistant surface. .Iaddend..Iadd.50. The
method according to claim 34, wherein said bulk material comprises
an amorphous magnetic material. .Iaddend..Iadd.51. The method
according to claim 34, wherein said bulk material comprises a
nanocrystalline material.
.Iaddend..Iadd.52. The method according to claim 51, wherein said
bulk material is formed in thin layers deposited on substrate
having a relatively high thermal conductivity and wherein said
method further comprises directing said ion beam onto said
substrate. .Iaddend..Iadd.53. The method according to claim 51,
wherein defects in the bulk material are removed by melting and
recrystallization. .Iaddend..Iadd.54. The method according to claim
33 further comprising the step of melting a near surface layer of
said bulk material followed by the step of rapid thermal quenching.
.Iaddend..Iadd.55. The method according to claim 54, wherein said
step of rapid thermal quenching comprises removing heat at a rate
greater than about 10.sup.8 k/sec. .Iaddend..Iadd.56. The method
according to claim 36, wherein the bulk material is a ceramic and a
glassy surface is formed. .Iaddend..Iadd.57. The method according
to claim 37, wherein the bulk material is a powder metallurgy
material and an alloy surface is formed. .Iaddend..Iadd.58. The
method according to claim 36, wherein a surface having reduced
surface porosity is formed. .Iaddend..Iadd.59. A method of
evaporation and ablation from a surface comprising the steps
of:
(a) generating ion beam using a magnetically confined anode plasma
ion source comprising a vacuum chamber having an anode assembly
including an anode electrode and a fast driving coil and a cathode
assembly including a cathode electrode and a slow driving coil, the
anode electrode and cathode electrode defining therebetween an
acceleration gap; said step of generating further comprising:
(i) introducing a puff of gas into said vacuum chamber to produce a
localized volume of gas adjacent said fast driving coil but
insulated from said fast driving coil;
(ii) pre-ionizing said gas using said fast driving coil;
(iii) further ionizing said gas while moving said gas away from
said fast driving coil to create a thin, magnetically confined
plasma layer;
(iv) applying a pulsed power signal to said anode electrode to form
an ion beam from said plasma;
(v) extracting said ion beam with little or no rotation thereof;
and
(b) directing said ion beam at said surface to evaporate a layer of
said
surface. .Iaddend..Iadd.60. The method according to claim 59,
wherein said surface comprises a layer and an underlying surface of
bulk material and further comprising the steps of removing at least
said layer. .Iaddend..Iadd.61. The method according to claim 60,
wherein said bulk
material is metal and said layer is an oxide layer.
.Iaddend..Iadd.62. The method according to claim 60, wherein said
bulk material is metal and said layer is a hydrocarbon.
.Iaddend..Iadd.63. The method according to claim 60, wherein said
layer is a contamination layer, said contamination having a boiling
point lower than that of said bulk material. .Iaddend..Iadd.64. The
method according to claim 60, wherein said layer is a passivation
layer and said bulk material is part of a substrate, said
passivation layer having a lower boiling point than said substrate;
and further comprising the step of removing said passivation layer
by super heating the surface of said substrate by said ion beam.
.Iaddend..Iadd.65. The method according to claim 60, wherein said
layer is an overlayer of an unwanted material having a higher
vaporization point than the bulk material, said method further
comprising ablating a surface layer of the bulk material beneath
said overlayer, thereby removing said unwanted material.
.Iaddend..Iadd.66. The method according to claim 60, wherein said
bulk material is a polymer substrate. .Iaddend..Iadd.67. The method
according to claim 59, wherein the step of directing further
comprises interposing a mask or compound to prevent said ion beam
from effecting selected portions of said surface.
.Iaddend..Iadd.68. The method according to claim 65, further
comprising the step of shock-hardening of the bulk
material to a depth greater than the melt depth. .Iaddend..Iadd.69.
The method according to claim 59, further comprising the step of
redepositing vaporized material onto said surface.
.Iaddend..Iadd.70. A method of producing non-equilibrium or near
equilibrium structures on the surface of a bulk material comprising
the steps of:
(a) generating an ion beam using a magnetically confined anode
plasma ion source comprising a vacuum chamber having an anode
assembly including an anode electrode and a fast driving coil and a
cathode assembly including a cathode electrode and a slow driving
coil, the anode electrode and cathode electrode defining
therebetween an acceleration gap, said method comprising the steps
of:
(i) introducing a puff of gas into said vacuum chamber to produce a
localized volume of gas adjacent said fast driving coil but
insulated from said fast driving coil;
(ii) pre-ionizing said gas using said fast driving coil;
(iii) further ionizing said gas while moving said gas away from
said fast driving coil to create a thin, magnetically confined
plasma layer;
(iv) applying a pulsed power signal to said anode electrode to form
an ion beam from said plasma;
(v) extracting said ion beam with little or no rotation
thereof;
(b) heating a bulk material having an initial structure to a
predetermined depth with said ion beam; and
(c) rapidly conducting the heat into said bulk material whereby a
surface having a structure different from said initial structure is
formed.
.Iaddend..Iadd.71. The method according to claim 70, wherein said
bulk material is a metal alloy. .Iaddend..Iadd.72. The method
according to claim 70, further comprising the step of depositing a
layer of material on the bulk material and whereby the step of
heating further comprises melting said layer of material and a
surface layer of said bulk material whereby said material is
dissolved into said melted bulk material. .Iaddend..Iadd.73. The
method according to claim 72, wherein said layer material comprises
carbon and said bulk material comprises steel. .Iaddend..Iadd.74.
The method according to claim 72, wherein said layer material
comprises a nitride and said bulk material comprises steel.
.Iaddend..Iadd.75. The method according to claim 72, wherein said
bulk material is selected from the group consistent of 304
stainless steel, 316 L stainless steel and 316 F stainless steel.
.Iaddend..Iadd.76. The method according to claim 72, wherein said
bulk material comprises an aluminum alloy. .Iaddend..Iadd.77. The
method according to claim 72, wherein said layer material is
chromium and said bulk material is carbon steel and wherein said
step of melting further comprises melting said chromium and
carbon steel. .Iaddend..Iadd.78. The method according to claim 72,
wherein the layer material and bulk material are immiscible when
solid and wherein the step of melting further comprises forming a
single phase liquid comprised of the layer material and bulk
material. .Iaddend..Iadd.79. The method according to claim 78,
wherein said step of rapidly conducting heat further comprises
quenching the molten material produced an amorphous alloy
consisting of said layer material and said bulk material.
.Iaddend..Iadd.80. The method according to claim 78 wherein said
step of rapidly conducting heat comprises quenching at a rate
whereby nanoscale precipitates are formed after quenching.
.Iaddend..Iadd.81. The method according to claim 72 further
comprising the step of rapid quenching whereby an alloy of said
bulk material and layer material is formed. .Iaddend..Iadd.82. The
method according to claim 81, wherein said alloy comprises a
metastable alloy on the surface of said bulk material.
.Iaddend..Iadd.83. The method according to claim 70, wherein said
bulk material is a fine-grain sintered material. .Iaddend..Iadd.84.
The method according to claim 83, wherein said bulk material is a
ceramic and a glossy surface is formed. .Iaddend..Iadd.85. The
method according to claim 83, wherein said bulk material is a
powdered metallurgy material and an alloy surface is formed.
.Iaddend.
Description
FIELD OF THE INVENTION
This invention relates generally to material modification, and more
specifically to a class of techniques whereby a thin layer of
material on the surface of a body can be rapidly heated, followed
by a rapid quench as the heat energy is conducted into the body.
The invention also relates to other types of surface treatment
using ion beams to convey energy to a near-surface region.
BACKGROUND
The mechanical and chemical properties of surfaces are an important
factor in almost all materials applications. Numerous techniques
have been developed to enhance these properties for particular
applications. These techniques range from widely used techniques
such as galvanizing and heat treatment of alloys to specialty
techniques such as ion implantation and laser glazing which are
expensive and not scaleable to common industrial use. The use of
surface treatments to improve properties such as surface hardness,
wear resistance, corrosion resistance, and fatigue lifetime add
significant value to a wide range of products in industries
including automobile manufacture, aerospace, microelectronics, tool
and die manufacture, power generation, and the production of steel,
aluminum, ceramics, and plastics.
Thermal treatment to alter the surface properties of materials has
been a standard industrial process since the early smiths developed
techniques for pack carburization of cast iron in their forges to
produce a material more suited to the fabrication of durable
swords. Such treatments, principally metallurgical in nature, have
thus formed a part of manufacturing technology for more than a
thousand years.
Two primary driving forces are available through the use of thermal
treatments. The first involves the use of high temperature to
overcome kinetic barriers which keep something from happening. The
second is based on the rapid quenching of hot material to preserve,
in some degree, the microstructure of the hot material or that of a
metastable structure encountered in the evolution toward the
quenched material.
The metallurgy of sword blades, although not understood at the time
and developed through empirical research, represents the pinnacle
of materials engineering during the Dark Ages. It also serves to
demonstrate various surface treatment modalities which are still of
primary importance.
In the Dark Ages, iron was generally produced as wrought iron,
i.e., as a matrix of nearly pure iron with a relatively high
density of slag inclusions. (Slag is the combination of impurities
and the flux used in the reduction of iron ore.) Wrought iron is
reasonably tough, but is very soft, and hence not well suited to
the production of weapons. It is possible to harden the material by
cold-working in the course of shaping, thus producing a
work-hardened material, but this material is brittle as well as
hard. Thus, a method that hardened only the surface layers would
produce a superior weapon, one which would both hold an edge and
take an impact without fracture.
The process most often used to this end was pack carburization. A
sword was forged (hammered) into shape, producing a hard but
brittle implement. The sword was then packed in a mixture of carbon
(charcoal or coke) and other organic materials. The pack was heated
to the carburizing temperature (about 950.degree. C.), whereupon
carbon was transferred to the steel by decomposition of carbon
monoxide at the iron surface. The carbon diffused into the iron,
forming a crude form of hypereuctectoid iron surrounding a wrought
iron core. This is a thermodynamically favorable process which
requires heating to yield significant diffusion in a reasonable
amount of time.
The sword was then heated to above the transformation temperature
(723.degree. C.). As a result, the iron core was left unchanged,
whereas the steel tegument transformed into a mixed phase of
austenite and cementite. (Austenite is the .gamma.-phase of iron
with dissolved some carbon, while cementite is Fe.sub.3 C, a hard
brittle substance.) The sword was then quenched abruptly to prevent
the austenite-cementite mixed phase of the tegument from
transforming back into the original material. (This step uses the
second of the primary thermal treatments, using rapid
quenching to preserve a high-temperature structure.) This quenching
was usually performed by plunging the hot sword into oil, but some
texts insisted that the finest swords resulted from quenching by
thrusting the hot sword through the body of a young boy or a virgin
maiden. The popularity of these latter practices is not
recorded.
The structure resulting from the above steps was a strong, tough
iron core surrounded by a thin (<1 mm) layer of fine-grain
high-carbon steel having high hardness but low toughness. The high
carbon-steel tegument of the sword can now be sharpened to a fine
edge, which will last through much use, while the soft iron core
will allow deformation on impact, thus avoiding brittle fracture of
the sword blade. The relative quality of local surface treatments
of wrought iron was an important factor in determining the outcome
of many early political disagreements.
Surface treatment of a wide range of materials is still extremely
important in modern manufacturing. Considering only steel for a
moment, carburizing is still widely used to produce a hard surface
on steels, but has been joined by a wide range of related
techniques including nitriding (including iron nitriding),
carbonitriding, cyaniding, and liquid carburizing. Thermal
treatment alone is also used to harden the surfaces of medium and
high-carbon steels, where there is already enough carbon to form
the austenite-cementite mixed phase using heating alone. However,
in these cases only the surface must be heated, leading to the
development of numerous techniques for heating only the surface of
a body, including pulsed inductive heating, where heat is generated
by induction of eddy currents, which are confined primarily to the
near-surface region in a conducting body, direct heating by a flame
followed by quenching quickly enough that the inner regions of the
body are not heated past the transformation temperature, and laser
hardening, in which a very thin layer of the surface is heated
quickly enough that quenching is accomplished by simple thermal
conduction into the body of the part being hardened. Laser
hardening is an early example of the type of process of interest in
the present application, i.e., a rapid heat-rapid quench process.
Finally, a work hardened surface can also be formed by heating a
thin surface layer sufficiently that it ablates from the bulk of
the material, creating shock waves which create dislocations in the
near-surface regions.
Other purposes than hardening can be served by surface treatment of
materials. For example, in steels, the chromizing process
(diffusing chromium from an external source) increases the
corrosion resistance of the material by turning the surface region
into a form of stainless steel which may or may not be harder than
the initial material, but will resist the action of oxidants and
other common sources of corrosion. However, many other materials,
including metals, alloys, semiconductors, ceramics, and other
nonmetals are subject to corrosive effects. These include galvanic
corrosion, in which a current is generated between two dissimilar
metals in electrical contact, resulting in a soluble species being
generated from one of the metals. Another form of corrosion is
pitting, in which a passivation (or protecting) layer is breached
in a small area (a pit). The material underneath, which is usually
protected by the passivation layer, is then exposed to the
corrosive environment, and dissolves inward from the position of
the pit. (Note that a passivation layer may be intrinsic, as in the
oxide layer on aluminium, or extrinsic, as in the surface layer of
zinc in galvanized steel.) Corrosion can also be stimulated by
tensile stress, biological organisms, and atmospheric
contamination. A side effect of corrosion mechanisms can be
hydrogen embrittlement, in which the hydrogen generated by a
corrosive process enters into a metal or alloy, reducing the
ductility of the material, which is then weakened, allowing surface
flaws to grow under a stress, thus increasing the susceptibility of
the material to further corrosion and eventual failure under
stress. Many methods exist to reduce the pernicious effects of
corrosion, but it is estimated that some 4% of the gross national
product is still lost to corrosive effects.
One type of surface treatment to improve corrosion resistance which
is consistent with the class of treatments under discussion here,
i.e., rapid heat-rapid quench techniques, is the formation of
surface alloy layers by forming a layer of a second material on the
object to be protected, and then melting the surface layers to form
a homogeneous liquid material. If the quenching is then rapid
enough, a solid solution results even if an equilibrium alloy
cannot be formed at a low temperature. The solid solution may be
amorphous nanocrystalline, microcrystalline, or actual precipitates
may form, depending on the rate of quenching. A small amount of
precipitation will still allow corrosion resistance to be improved,
and may increase the hardness of the treated surface layer.
Surface treatments are also important in the control of wear, which
constitutes the primary reason why the artifacts of society become
useless and have to be replaced. Wear is simply the removal of
material from a solid surface as a result of sliding action. Wear
is occasionally a useful process (e.g., writing with pencil and
paper), but more often is deleterious to both the structure and the
operation of mechanisms. There are four primary types of wear,
adhesive, abrasive, corrosive, and fatigue wear. Adhesive wear
arises from the formation, during sliding, of regions (called
junctions) of adhesive bonding on a microscopic scale. If the
junctions do not break along their original interfaces upon further
sliding, then a chunk from one of the surfaces will have been
transferred to the other surface. Such particles constitute wear in
their formation, and may also add to abrasive wear. Abrasive wear
is produced by a hard object being dragged along a softer one,
thereby digging out a groove. The abrasive agent may be one of the
surfaces, particles removed from the surfaces by other wear
mechanisms, or external particles, such as sand in a bearing.
Corrosive wear occurs when sliding action takes place in a
corrosive environment, the pieces are nominally protected by a
passivating layer, and the sliding action continuously removes the
passivating layer, thus exposing fresh surfaces to the action of
the corrosive. Fatigue wear occurs as cracks form and grow as the
result of fatigue, especially in rolling systems. A crack forms
below the surface, and grows to intersect the surface, thereby
lifting a large particle out of the surface.
The various forms of wear are often synergistic, resulting in a
form of degradation which is nearly universal in any mechanism or
device having moving parts. Adhesive wear is the most fundamental,
existing in any sliding or rotating contact in which two surfaces
touch. The primary line of defense against wear is the use of
lubricants, which act to prevent contact of surfaces in relative
motion, thus reducing wear by as much as a million times the dry
value. However, unless the relative velocities of the surfaces is
high enough that the surfaces `surf` on a continuous film of
lubricant, there will still be contact and adhesive wear will
occur.
The condition of the sliding surfaces helps to determine the rate
of wear. The friction between a pair of sliding surfaces having
large surface roughness will be approximately the same as that
between similar surfaces having smoother surfaces. The friction in
the first case is the work done in tearing apart a few large
junctions, whereas in the second case the friction results from
tearing apart many small junctions, but the total surface area of
the junctions (and hence the work required to tear them asunder) is
determined primarily by the amount of deformation of the surfaces
caused by the force normal to the surfaces, which is the same in
both cases.
From the point of view of the wear occurring during sliding,
however, the difference in surface roughness makes several
important contributions. Take .lambda. as a length characterizing
the surface roughness. (In some cases the appropriate length will
be the grain size rather than the surface roughness, but the
arguments below still hold.) It is clear that .lambda. will also
characterize the size of the particles torn off by adhesive wear.
That is, if .lambda. is 10 times larger, the size of the detached
particles will also be 10 times larger. Smaller particles will
contribute less to abrasive wear mechanisms.
The difference in size of the detached particles resulting from
differing degrees of surface roughness yields another advantage. A
simple scaling argument will illustrate this. Assume .lambda..sub.R
for the rough surface is 10 times larger than .lambda..sub.S for
the smoother surface. Under equal external loading, the areas of
contact will be the same. As each junction now has an area on the
order of .lambda..sup.2 there must be 100 times as many junctions
on the smooth surface as on the tough surface. Further assume, as
above, that the characteristic size of the detached particles is
.about..lambda.. The volume of material detached by adhesive wear
is then .about.N.lambda..sup.2, where N.about..lambda..sup.2 is the
number of particles formed by adhesive wear. The total volume of
material removed by adhesive wear in a given sliding process is
thus proportional to the size of the surface roughness. In summary,
smoother surfaces, despite producing the same friction, result in
less direct adhesive wear because of the square-cube scaling law
above, and also reduce the amount of self-abrasive wear by reducing
the size of the abrasive particles generated during adhesive wear.
Such surfaces can be fabricated by melting the surface layers of
the body and allowing the heat energy to dissipate into the body,
thus obtaining rapid quenching of the liquid.
Fatigue wear can also be affected by surface morphology, but not
primarily by the length scale of the surface roughness. More
important here is the presence of abrupt structures, such as
cracks, ledges, overhangs, etc., which offer sites for stress
concentration, and the earlier material failure accompanying such
concentration. Such stress concentration does not depend on the
length scale of the defect, but rather on its shape. This type of
wear will be reduced if the surface can be treated to have more
gradual changes in surface morphology. Again, surface morphology
can be altered to provide less opportunity for stress concentration
by rapidly melting the surface layers and quenching the heat energy
into the body of the material in question. Such smoother surfaces
will also serve to limit various mechanisms for corrosion.
The potential applications for rapidly heating (and perhaps
melting) a thin surface layer which is then self-quenched via
thermal conduction into the body of an object are very broad.
Beyond those described in detail above, one may alter the surface
layers of a material. This may be done in a number of ways, but the
main route toward such alterations is the ability of rapid
quenching to produce non-equilibrium structures, such as amorphous
or nanocrystalline surface layers. Metastable surface alloys can be
produced by rapid melting and quenching. This requires a material
system in which a thin layer of material A is formed on a substrate
B. The phase diagram of these materials is such that they are
immiscible when solid, but form a single-phase liquid when molten.
(Heating above the melting point may be required.) If this material
is then rapidly quenched, an amorphous alloy composed of the two
components will result. If the quenching process is somewhat
slower, nanoscale precipitates will form. The size of these
precipitates depends on the cooling rate. Note that these materials
need not be metals. A coating of gold on a germanium substrate
melted and rapidly quenched will form such as amorphous alloy.
Compounds including members of the metalloids are well known as
helpful in formation of amorphous material.
When the pulse energy is much greater than that required to melt
the heated surface layer, the surface layer will ablate. This can
have three desirable effects. One is to serve as a source of pure
material for an associated deposition process analogous to
sputtering, but providing greatly enhanced purity and smoothness of
the deposited material. It is also possible to obtain unique
surface structures, which have, for example, altered electron
emission characteristics, by ablating a surface layer from a
substrate. Some of the ablated material will redeposit on the
substrate, forming the aforementioned unique structures. Third, the
shock wave created in the substrate by such ablation produces
work-hardening effects far into the material (perhaps several
hundred microns) through formation of dislocation structures below
the heated surface layer.
Another application of a rapid heating-rapid quenching cycle is to
clean a surface without altering the properties of the surface in
any manner. This would be possible when the contaminant will desorb
from the surface at a temperature lower than the melting point of
the surface. Properly done, only a very thin (<<.mu.m) layer
of the surface would have to be heated to remove contaminants
compatible with this method without the use of solvents or other
chemicals. Such a process could replace many cleaning steps
presently required in machining and semiconductor manufacture, to
name only two possibilities. This is an important consideration in
these days of heightened ecological awareness and regulation.
The surfaces of porous and/or highly defective materials such as
ceramics can be smoothed and rendered resistant to crack nucleation
by forming a surface layer of glass using the same type of rapid
heat-rapid anneal treatment. A similar smoothing of surfaces was
described in the discussion of wear above. Further applications
include `polishing` of machined parts. Precision machined parts
will commonly retain machining marks on the order of 10 .mu.m in
size. Surface melting can allow the surface tension of the material
to induce material reflow, smoothing the surface. Such techniques
could also find application in the final polishing of
diamond-turned optics, thereby totally avoiding conventional
optical surface generation techniques. Finally, smooth surfaces
offer fewer flaws to initiate corrosive processes. This class of
surface finishing techniques will thus reduce the initial rate of
corrosion significantly, beyond any changes in surface chemistry
which may also be accomplished.
Having established that rapid-heat rapid-quench processes are
potentially of great industrial use, one must naturally ask why
they are not presently being applied in standard industrial
practice. There are numerous reasons why previous laboratory-scale
attempts to apply such processes failed to be accepted in the
market.
Consider the conditions required to melt a thin layer (1.about.1
.mu.m) of a steel surface. How much energy is required to melt the
surface assuming that no thermal conduction into the bulk of the
steel occurs? The melting point T.sub.m of steel is about
1530.degree. C., the density pis .about.7000 kg/m.sup.3, and the
specific heat c is .about.3Nk where N is the number of atoms per kg
(.about.1.07.times.10.sup.25), and Boltzmann's constant k is
1.38.times.10.sup.-23 J/.degree.K. The energy per m.sup.2 in a 1
.mu.m thick layer of molten steel is roughly .rho.cT.sub.m
.DELTA.1, or some 5600 joules per square meter. As the present
interest is in industrial-scale processes, treatment of a square
meter of material at a time is not unreasonable, at least for
discussion.
Now the time required for quenching of this energy into the bulk of
the steel must be estimated. The rate of power flow out of the
molten layer is roughly kT.sub.m /21 joules per square meter per
second. Combining this with the earlier result, and assuming that k
is not a function of temperature, ##EQU1## where .tau. us the
characteristic time for the heat energy to leave the molten layer
through conduction into the bulk of the steel. K is .about.100
watts per meter per .degree.K, so the characteristic time for this
situation is roughly 30 nanoseconds. Note that this estimate gives
a cooling rate of .about.5.times.10.sup.10 .degree.K per second, a
remarkably large value compared to .about.10.sup.6
.degree.K-sec.sup.-1 for techniques such as splat quenching or
planar flow casting techniques. Thicker surface layers will require
longer cooling periods: for example a 10 .mu.m melted layer on a
steel body will cool at .about.5.times.10.sup.8
.degree.K-sec.sup.-1, a value still associated with non-equilibrium
effects.
In the primary mode of operation, the energy of the thin molten
layer must be deposited in a period of time shorter than .tau. so
that the deposited energy efficiently heats only the desired
surface layer, and not the underlying material. Accordingly, the
deposited power P must be greater than the energy deposited divided
by the characteristic time period, or
A secondary mode of operation is also available, in which the beam
energy is deposited in a thin surface layer on a time scale much
longer than the
characteristic thermal diffusion time for the surface layer being
heated. This mode of operation is analogous to flame annealing.
Such a mode is useful for annealing the surface layer, to induce
grain growth or to produce a thin nanocrystalline surface layer on
an amorphous material. In this mode substantial temperature
increases will be experienced by much more of the material than the
surface layer being directly heated, an effect which must be
accounted for when carrying out the ion beam surface treatment. (A
worker skilled in the art can use the equations given in this
specification to predict thermal profiles (i.e., temperature
increase vs. depth vs. time) for a given set of production
conditions.)
Making this class of techniques even marginally practical (larger
molten thickness would be desirable in most cases) requires a
source unit that can deliver .about.10.sup.4 joules into the
surface of a body in a 30-3000 nanosecond pulse. Further, unless
rapid cycling (>>1 Hz) of the source is possible, the amount
of material that can be treated per source unit is too small to
have an impact on any but specialty items. High process efficiency
is also required, as otherwise removing the waste heat from the
source unit will become a difficult task, as will providing the
total power required.
Consider a more definite case. The source unit is to be a pulsed
laser. (The difficulties surrounding the problem of depth and
consistency of power absorption will be ignored for a moment.) To
get 10.sup.4 joules output, our 1% efficient laser will require
10.sup.6 joules input. To provide 10 pulses per second, a minimal
speed for practical applications of this technology, the source
unit must receive some 10 megawatts continuous input and have a
cooling system capable of removing and disposing of nearly that
much power continuously. The cost in wasted electricity alone is
about $10 million dollars per year of operation. The low power
efficiency of laser systems which provide short enough pulses of
sufficient energy to treat large areas of a surface is clearly a
problem.
Lasers present other problems when considered for this class of
applications. A pulsed laser system with the required level of
power has been developed for antiballistic missile systems, but the
physical size and capital cost of each system is enormous. In
addition, the lifetime of certain critical components is quite
short (<10.sup.3 pulses), requiring enormous downtime for
maintenance in an industrial situation. Further, the depth of power
deposition is limited to an optical skin depth. As this is much
less than a micron for any suitable laser system now available
acting on metals, one of two situations will develop. The total
energy will be delivered suddenly to one skin depth of surface,
which will then vaporize and ablate from the surface. Alternately,
the energy can be slowly fed into the surface through the
bottleneck presented by the requirement that the outer few
nanometers of the surface not vaporize, thus requiring longer
pulses with lower power. This option results in long heating
periods, and substantial heating of the material underlying the
desired surface heating region. Such a situation is non-optimal.
Finally, in order to use a laser as a source unit for this class of
manufacturing applications, the surface condition of the material
presented must be carefully controlled so that the power absorption
is uniform throughout the material being treated. Such control in a
general industrial manufacturing environment would prove
difficult.
Another possible source is an ion beam generator. Such generators
are able to deposit their energy with reasonable uniformity down to
depths of many microns, depending on the energy and species of the
ions used, offering some promise for application to the present
class of manufacturing processes.
It is important to note that the ion beam generator is not being
used for ion implantation in the usual sense. There is a great deal
of information on alteration of surface and near-surface regions by
ion implantation, in which a rapid thermal effect is not the
operative driver, but rather the gross changes in chemistry caused
by implantation of the ions or the localized lattice damage
resulting from slowing of individual ions. The point is that in
conventional ion implantation the rate of implantation (i.e., the
beam current per unit area) is of little importance as long as the
ions eventually are implanted. In the present applications, the
thermal effects caused by the extremely high current of ions
impacting the surface are primarily responsible for the favorable
surface modifications. In most cases the total dose of ions will be
small enough to leave the surface composition essentially
undisturbed. This point will be discussed in a more quantitative
manner below.
For the moment the problem of making a suitable ion beam generator
will be ignored, and attention placed on the characteristics such a
generator must have to function in the modalities described above.
Two problems present themselves. First, for given species of ion
and target, how much beam energy is required to penetrate a given
distance into the target, thus heating the target surface to that
depth? Second, what total dosage is required to melt the affected
area? The answers to these questions will determine the
characteristics required by an ion beam generator useful for
surface treatment in a manufacturing environment.
The rate as which energy is lost to electronic collisions (the
primary mode of energy loss in the relevant regime) by an ion of
mass M.sub.1 and atomic number Z.sub.1 while traversing an
amorphous (or polycrystalline) target consisting of atoms of mass
M.sub.2 and atomic number Z.sub.2 can be expressed in dimensionless
units for length (.rho.) and energy (.epsilon.) within the LSS
theory (Ion Implantation in Semiconductors, by J. W. Mayer et al.,
Academic Press, 1970, pgs 21-26) as ##EQU2##
The dimensionless parameters are given by
and
In the above equations, R is distance in microns, E is the ion
energy in megaelectron volts, and d is the density of the target
material in grams per cubic centimeter. The energy loss equation
can be solved for energy remaining after a given distance of travel
in the target by substituting .rho.=.eta..sup.2, and integrating to
find
where .epsilon..sub.o is the initial dimensionless energy of the
ion. Given this equation, the range of an ion in the target
material is found by setting .epsilon.(.rho.)=0, and solving the
resulting binomial equation for the total range .rho..sub.t to
give
Both theory and experiment agree that the energy of the ions is
distributed relatively uniformly throughout a volume starting at
the surface and proceeding .about..rho..sub.t inward.
To give a feel for the above equations, consider a specific
example. Carbon ions (Z=6, M=12) having an energy of 1 MeV are
incident on an iron (Z=26, M56) surface. The dimensionless energy
.epsilon. is equal to 50 E(MeV), the dimensionless range .rho. is
equal to 6.2 R/(.mu.m), and k=0.37. (All numerical values are
approximate.) By the above range equation, .rho..sub.t
=2.times.50.sup.1/2 /0.37=38.2. Solving for the actual distance
R.sub.t (.mu.m)=.rho./6.2=38.2/6.2=6.2 .mu.m range. The energy
distance relationship calculated here is by no means universal, but
serves to illustrate that when thermal heating of a surface layer
having a thickness of several microns is desired, the ion energy
required to likely to be on the order of 1 MeV.
The question of the total dosage required to melt a surface layer
can now be illustrated. Continuing with the above example, the
earlier estimate that 5600 J/m.sup.2 is required to melt a 1 .mu.m
layer of steel shows that some 3500 J/m.sup.2 is required to be
deposited to melt the 6.2 .mu.m surface layer heated by a 1 MeV
carbon beam. This amount of energy is also equal to
2.2.times.10.sup.17 MeV. The process of melting the 6.2 .mu.m
surface layer thus requires an addition of carbon ions amounting to
about 2% of a monolayer. The affected region is some 10.sup.4 S of
monolayers thick, so in this example the contamination of the
surface layers by carbon is on the order of 1 part in 10.sup.6, an
amount negligible to the chemistry of most surface modification
processes. This demonstrates that the effect of high energy pulsed
ion beams is due almost totally to thermal heating of the surface
layers, a process made very different from ion implantation by the
time scales involved.
Finally, the beam current required can be estimated. A pulse of 1
MeV carbon ions must consist of 2.2.times.10.sup.17 ions if a
square meter is to be treated in a single pulse. This amount of
ions must be transmitted in no more than a few hundred nanoseconds.
(The timescale is longer because of the increased thickness of the
melted zone.) The resulting rate is about 10.sup.25 ions/sec,
representing a current of about 1.6 megaamperes. The pulse must
therefore carry a power of some 1.6 terawatts per square meter of
surface treated. The size of this number explains why so few
experimental studies of surface modification using the thermal
effects of ion beam treatment have been made.
Given that the use of ion beam generators for surface modification
can be carried out as described above, why is there currently so
little penetration of commercial markets? The use of ion beams for
thermally altering the near surface characteristics of a material
has been fraught with substantial problems. Most notable of the
limitations with existing ion beam technologies have been: 1) high
costs per area treated; 2) the inability to generate a large number
of pulses without the costly replacement of ion beam generator
components; 3) low repetition rates; 4) low average power; and 5)
the inability to reliably produce a uniform ion beam of a single
selectable ion species.
Typical ion beam generators use dielectric surface arcing on an
anode as a source of ions and thereafter magnetically or
geometrically direct and focus the generated ion beam onto the
material of interest. This surface arcing (also called "flashover")
destroys the anode surface in less than 100 pulses, and produces a
mixed species of ions that cannot be adjusted. Other difficulties
arising from flashover include: production of large quantities of
neutral gas that makes high repetition rate difficult, generation
of debris which can contaminate surfaces being treated, and
non-uniformity and irreproducibility of the beam in some cases due
to the localized and difficult to control nature of flashover.
State-of-the-art ion beam generators are typically "one shot"
devices, i.e., they operate at low repetition rate (<<1 Hz).
Existing ion beam generators cannot be operated at high repetition
rates (<<1 Hz) for a number of reasons. First, existing
pulsed power supplies are no able to generate electrical pulses at
high repetition rates having the voltage, pulse width (i.e., normal
temporal duration), and power required to generate the ion beams
needed (i.e., consistent with the discussion above) for the various
beneficial applications described herein. This limitation renders
commercial exploitation impractical. Second, the design of existing
ion beam generators does not allow repetitive operation for an
extended number of operating cycles (<<10.sup.3) without
replacement of major components. This limitation would require a
maintenance time--manufacturing time ratio incompatible with
routine manufacturing operations. Fourth, existing ion beam
generators generally operate with electrical efficiencies<5%,
thus presenting major challenges to the pulsed power supply and the
cooling system of the generator. These limitations and others have
made it impossible to routinely utilize the ion beam technology
described above for surface treating materials.
The present invention generates high energy, repetitive ion beams
which overcome the limitations of existing ion beam generators and
provides a cost-effective processing technology for thermally
altering the near surface characteristics of materials.
SUMMARY OF THE INVENTION
The present invention provides a system for generating a high
energy, pulsed ion beam repetitively over an extended number of
operating cycles. In particular, the present invention provides an
ion beam generator capable of repetitive operation over an extended
operating cycle suitable for thermally treating large surface areas
of a material at low cost. This ion beam generator comprises a high
voltage, high current pulsed power system and a pulsed ion beam
source, both capable of high repetition rates and both having the
capability for an extended operating life.
This new technology enables the cost effective, commercial scale
use of ion beam surface treatment. High energy, repetitively pulsed
ions beams produced according to the present invention can produce
surface treatments ranging from high temperature anneals through
melting to ablation, followed by rapid thermal quenching to ambient
temperatures. The control variables for the ion beam treatment
include ion species, kinetic energy of the ions, temporal width of
the ion pulses, and total dose of ions (which total dose may be
delivered in a number of discrete pulses). Variation of these
parameters allows uniform heating, to a desired temperature, of a
surface region of any material whose thickness approximately
corresponds to the range of the ions used in the material being
heated.
The present invention enables a commercially practical method
allowing surface treatment of a material for numerous purposes
described herein using pulsed ion beams, comprising the steps of:
generating a repetitively pulsed ion beam; and irradiating a
surface of the material with the repetitively pulsed ion beam to
heat said surface to a predetermined degree to a predetermined
depth, wherein the pulsed ion beam has a duration less than about 1
.mu.s and beam energy greater than or equal to 0.05 MeV.
Further detail concerning the makeup of the present invention and
its scope of applicability will become apparent from the detailed
discussion of specific embodiments presented below. However, it
should be understood that the detailed description and specific
examples, while representing the class of embodiments of the
invention and its uses, are given by way of illustration only since
various changes and modifications within the spirit and scope of
the invention will be apparent to those skilled in the art from
this detailed description.
BRIEF DESCRIPTION OF THE DRAWINGS
The present invention will become more fully understood from the
detailed description given hereinbelow and the accompanying
drawings which are given by way of illustration only, and thus are
not limitative of the present invention, and wherein:
FIG. 1 schematically depicts the process of this invention by which
deposition of a pulse of ion beam energy into a near surface layer
almost instantly raises the local temperature above the melting
point with extremely rapid thermal diffusion of the heat into the
underlying substrate;
FIG. 2 graphically depicts the in-depth deposition of energy for a
900 keV proton beam;
FIG. 3 is a schematic of the pulsed power system of the present
invention;
FIG. 3A is a circuit diagram of a pulse compression system 15
utilized in the pulsed power system of FIG. 3;
FIG. 3B is a cross sectional view of a pulse forming line
element;
FIG. 3C is a cross sectional view of the Linear Inductive Voltage
Adder (LIVA);
FIG. 4 is a partial cross sectional view of an ion beam or a
magnetically-confined anode plasma (MAP) source 25 of the FIG. 3
system according to the principles of the present invention;
FIG. 4A is a modified version of FIG. 4 showing the magnetic field
lines produced by the fast and slow coils in the MAP source;
FIG. 4B is an expanded view of a portion of FIG. 4 showing the gas
inlet valve and the gas inlet channel;
FIG. 5A is a schematic diagram of a process by which material
ablated from
a first material surface is redeposited onto that surface; and
FIG. 5B is a schematic diagram of a process by which material
ablated from a first material surface is redeposited onto a second
material surface.
DETAILED DESCRIPTION OF THE INVENTION
The following discussion will begin with a description of the
system utilized to produce the ion beams. This system has two major
subsystems, the pulsed power source and the ion diode. The
discussion will then continue with descriptions of a number of
examples of ion beam treatments to various materials.
The present invention provides an ion beam generator capable of
high average power and repetitive operation over an extended number
of operating cycles for treating large surface areas of materials
at commercially attractive costs. In particular, the ion beam
generator of the present invention can produce high average power
(1 kW-4 MW) pulsed ion beams at 0.1-2.5 MeV energies and pulse
durations or lengths of from about 10 nanoseconds (ns)-2
microseconds (.mu.s) or longer as necessary for the particular
application. The ion beam generator can directly deposit energy in
the top 50 micrometers (.mu.m) of the surface of a material. The
depth of treatment can be controlled by varying the ion energy and
species as well as the pulse length.
FIG. 1 schematically illustrates irradiating a material with ion
beams in accordance with the principles of the present invention.
Although this process can be used to implant ions to the extent
that the chemical composition of the implanted region is altered,
normally the process will be utilized to deposit energy into the
top surface of the material and will not significantly change the
atomic composition of the material. As such the process will either
heat or ablate the near surface using typically 3.times.10.sup.13
ions/cm.sup.2 per pulse. Such a dose will represent only
approximately 10.sup.-5 -10.sup.-3 atomic percent of the sample
density. Deposition of ion beam energy 11 in a thin near surface
layer 13 causes melting of the layer with relatively small energies
(typically 1-10 J/cm.sup.2) and allows rapid cooling of the melted
layer by thermal diffusion into the underlying substrate 17 as
depicted in FIG. 1. FIG. 2 is a graph which represents the effects
whereby, when high energy ions come to rest in a material, the
energy is deposited preferentially near the end of the range of
penetration into the material. FIG. 2 is a graph showing the
so-called Bragg peak for a 0.9 MeV proton beam, plotting electron
volts per Angstrom as a function of depth in microns.
At higher energy intensities (.gtoreq.10-20 J/cm.sup.2), this
process can cause rapid ablation of the substrate. This in turn can
be used to deposit a polycrystalline or nanocrystalline layer onto
another substrate or to redeposit such a layer on the original
substrate. This is shown schematically in FIGS. 5A and 5B which
depict rapid ablation and redeposition onto the same material
specimen and rapid ablation from one material surface with
deposition onto a second material surface, respectively. FIG. 5A
shows a production process with the material 54 moving from left to
right as indicated by the arrow 55. Ions 50 from the ion beam
source 25 ablate the material 54 to form particles 52 which rise
above the material 54 and then redeposit back onto the material 54.
In FIG. 5B the high energy ions 50 from the ion beam source 25
ablate the first material 60 creating ablated particles 52 which
then fall onto the second material 62 which is moving in the
direction of the arrow 55. Of course, either ablation process could
also be conducted on stationary materials. These higher intensity
pulses can also be used to induce shock hardening of much deeper
regions of the irradiated substrate.
The relatively small energy densities needed for treatment together
with the high instantaneous powers available using the present
invention allow large surface areas (50 to more than 1000 cm.sup.2)
to be treated with a single ion beam pulse, greatly reducing or
eliminating the portions of the treated material which are subject
to edge effects at the transition between treated and untreated
areas. The relatively short ion beam pulse lengths, preferably
.ident.200 ns for use with metals, developed by the ion beam
generator limit the depth of thermal diffusion, thus allowing the
treated/melted region to be localized to a selected depth.
Typical cooling rates of the present invention (10.sup.8 -10.sup.10
K/sec) are sufficient to cause amorphous layer formation in some
materials, fine grain structures in some materials, the production
of non-equilibrium microstructures (nano-crystalline and metastable
phases), and the formation of new alloys by rapid quenching and/or
liquid phase mixing of layers of different materials. Such rapid
thermal quenching (>10.sup.8 K/sec) can significantly improve
smoothness, corrosion, wear and hardness properties of the treated
near surface layer. The ion beam generator of the present invention
is composed of two major components: a high energy, pulsed power
system (shown in FIG. 3) and an ion beam source 25 (shown in FIG.
4), both capable of high repetition rates and both having extended
operating lives.
The Pulsed Power Source
The first of these components is a compact, electrically efficient,
repetitively pulsed, magnetically switched, pulsed power system
capable of 10.sup.9 pulse operating cycles aof the type described
by H. C. Harjes, et al. Pro 8th IEEE Int. Pulsed Power Conference
(1991), and D. L. Johnson et al., "Results of Initial Testing of
the Four Stage RHEPP Accelator" pp. 437-440 and C. Harjes et al.,
"Characterization of the RHEPP 1 .mu.s Magnetic Pulse Compression
Module", pp. 787-790, both reprinted in the Digest of Technical
Papers of the Ninth IEEE International Pulsed Power Conference,
June, 1993, all of which is incorporated by reference herein. These
references in conjunction with the discussion herein below place
fabrication of such a pulsed power source within the skill of the
art.
A block diagram of a power system produced according to the
teachings of the present application is shown in FIG. 3. From the
prime power input, several stages of magnetic pulse compression and
voltage addition are used to deliver a pulsed power signal of up to
2.5 MV, 60 ns FWHM, 2.9 kJ pulses at a rate of 120 Hz to an ion
beam source for this particular system. The power system converts
AC power from the local power grid into a form that can be used by
an ion beam source 25.
Referring to FIG. 3, in one embodiment of the invention, the power
system comprises a motor 5 which drives an alternator 10. The
alternator 10 delivers a signal to a pulse compression system 15
which has two subsystems, a 1 .mu.s pulse compressor 12 and a pulse
forming line 14. The pulse compression system 15 provides pulses to
a linear inductive voltage adder (LIVA) 20 which delivers the
pulses to the ion beam source 25.
The alternator 10 according to one embodiment is a 600 kW, 120 Hz
alternator. In the unipolar mode, it provides 210 A rms at a
voltage of 3200 V rms with a power factor of 0.88 to the magnetic
switch pulse compressor system 15. The alternator is driven by a
motor connected to the local 480V power grid. The particular
alternator used herein was designed by Westinghouse Corporation and
fabricated at the Sandia National Laboratories in Albuquerque, N.M.
It is described in detail in a paper by R. M. Caifo et al., "Design
and Test of a Continuous Duty Pulsed AC Generator" in the
Proceedings of the 8th IEEE Pulsed Power Conference, pp. 715-718,
June, 1991, San Diego, Calif. This reference is incorporated herein
in its entirety. This particular power system was selected and
built because of its relative ease in adaptability to a variety of
loads. Other power sources may be used and may indeed be better
optimized to this particular use. For example, a power supply of
the type available for Magna-Amp, Inc. comprising a series of
step-up transformers connected to the local power grid feeding
through a suitably-sized rectifier could be used. The present
system however has been built and performs reasonably well.
In one embodiment, the pulse compression system 15 is separated
into two subsystems, one of which is a common magnetic pulse
compressor 12 composed of a plurality of stages of magnetic
switches (i.e., saturable reactors) the operation of which is well
known to those skilled in the art. This subsystem is shown in more
detail in FIG. 3A. The basic operation of each of the stages is to
compress the time width (transfer time) of and to increase the
amplitude of the voltage pulse received from the preceeding stage.
Since these are very low loss switches, relatively little of the
power is wasted as heat, and the energy in each pulse decreases
relatively little as it moves from stage to stage. The specific
subsystem used herein is described in detail by H. C. Harjes, et
al., "Characterization of the RHEPP 1 .mu.s Magnetic Pulse
Compression Module", 9th IEEE International Pulsed Power
Conference, pp. 787-790, Albuquerque, N.M., June, 1993. This paper
is incorporated by reference herein in its entirety. These stages
as developed for this system are quite large. In the interest of
conserving space, it would be possible to replace the first few
stages with appropriately designed silicon control rectifiers
(SCR's) to accomplish the same pulse compression result.
These stages 12 convert the output of the alternator 10 into a 1
.mu.s wide LC charge waveform which is then delivered to a second
subsystem 14 comprising a pulse forming line (PFL) element set up
in a voltage doubling Blumlein configuration. The PFL is a triaxial
water insulated line that converts the input LC charge waveform to
a flat-top trapezoidal pulse with a design 15 ns rise/fall time and
a 60 ns FWHM. The construction and operation of this element is
described in detail by D. L. Johnson et al. "Results of Initial
Testing of the Four Stage RHEPP Accelerator", 9th IEEE
International Pulsed Power Conference, pp. 427-440, Albuquerque,
N.M., June, 1993. This paper is also incorporated by reference in
its entirety. A cross sectional view of the PFL is shown in FIG.
3B.
The pulse compression system 15 can provide unipolar, 250 kV, 15 ns
rise time, 60 ns full width half maximum (FWHM), 4 kJ pulses, at a
rate of 120 Hz, to the linear inductive voltage adder (LIVA) (20).
In a preferred embodiment, the pulse compression system 15 should
desirably have an efficiency >80% and be compressed of high
reliability components with very long lifetimes (.about.10.sup.9
-10.sup.10 pulses). Magnetic switches are preferably used in all of
the pulse compression stages, MS1-MS5, because they can handle very
high peak powers (i.e., high voltages and currents), and because
they are basically solid state devices with a long service life.
The five compression stages used in this embodiment as well as the
PFL 14 are shown in FIG. 3A. The power is supplied to the pulse
compression system 15 from the alternator 10 and is passed through
the magnetic switches, MS1-MS5, to the PFL 14. The PFL is connected
to the linear induction voltage adder (LIVA) 20 described below.
The second and third magnetic switches, MS2 and MS3, are separated
by a step-up transformer T1 as shown. Switch MS6 is an inversion
switch for the PFL.
The pulse forming line (PLF) element 14 is shown in schematically
in FIG. 3A and in cross section in FIG. 3B. MS6 in FIG. 3A
corresponds to the inversion switch 302 shown in FIG. 3B located on
the input side of the tri-axial section 314 of the PFL. Output
switches 304 and charging cores 306 are also shown. The regions 310
are filled with deionized water as the dielectric. The interior
region 308 is filled with air and oil cooling lines, not shown, for
the output switches 304. The output of the PFL is fed in parallel
to each of the individual LIVA stages 20, with the positive
component flowing through conductors 316 and the shell 318 of the
PFL serving as ground. The positive conductors 316 are connected to
each of the LIVA stages.
The LIVA (20) is preferably liquid dielectric insulated. It is
connected to the output of the PFL and can be configured in
different numbers of stages to achieve the desired voltage for
delivery to the ion beam source. The LIVA 20 can deliver nominal
2.5 MV, 2.9 kJ, pulses at a rate of 120 Hz to the ion beam source
25 when configured with 10 stages of 250 kV each. For most of the
ion beam treatments, the LIVA was configured with four stages of
250 kV each, such that the LIVA delivered a total of 1.0 MV to the
ion beam source. However, this voltage can be increased or
decreased by changing the number of stages in the LIVA to match the
particular material processing need. This nominal output pulse of
the LIVA 20 is the same as the provided to it by the PFL, namely,
trapezoidal with 15 ns rise and fall times and 60 ns FWHM. FIG. 3C
shows a cross section of the four stage LIVA. The four stages, 320,
322, 324, and 326, are stacked as shown and fed the positive pulses
from the PFL via the cables 321, 323, 325, and 327. The stages are
separated by gaps 330 and surrounded by transformer oil for
cooling. The output from each of the LIVA stages adds to deliver a
single total pulse to the ion beam source shown here schematically
as 25 which is located within a vacuum chamber 332, shown in
partial view. As with the PFL, the outside shell of the LIVA is
connected to ground.
The power system P (FIG. 3) as described, can operate continuously
at a pulse repetition rate of 120 Hz delivering up to 2.5 kJ of
energy per pulse in 60 ns pulses. The specific power system
described here can deliver pulsed power signals of about 20-1000 ns
duration with ion beam energies of 0.25.2.5 MeV. The power system
can operate at 50% electrical efficiency from the wall plug to
energy delivered to a matched load. The power system P uses low
loss pulse compression stages incorporating, for example, low loss
magnetic material and solid state components, to convert AC power
to short, high voltage pulses.
The ability to produce voltages from 250 kV to several MV by
stacking voltage using a plurality of inductive address
incorporating low loss magnetic material is a principle feature
when high voltages are needed, although it is also possible to use
a single stage pulse supply, eliminating the need for the
adder.
The power system can operate at relatively low impedances
(<100.OMEGA.) which also sets it apart from many other
repetitive, power supply technologies, such as transformer-based
systems. This feature allows high treatment rates and the treatment
of large areas (5 to more than 1000 cm.sup.2) with a single pulse
so as to reduce edge effects occurring at the transition between
treated and untreated areas.
The Ion Diode
The second component of the present invention is an ion beam source
25 (shown in FIG. 4). The ion beam source is capable of operating
repetitively and efficiently to utilize the pulsed power signal
from the power system efficiently to turn gas phase molecules into
a high energy pulsed ion beam. A precursor of the ion beam source
is an ion diode described generally by J. B. Greenly et al, "Plasma
Anode Ion Diode Research at Cornell: Repetitive Pulse and 0.1 TW
Single Pulse Experiments", Proceedings of 8th Intl. Conf. on High
Power Particle Beams (1990) all of which is incorporated by
reference herein. Although this reference ion diode differs
significantly from the ion diode utilized in the present system,
the background discussion in this reference is of interest.
An ion beam source 25, according to the principles of the present
invention, is shown in FIG. 4. The ion beam source 25 is preferably
a magnetically-confined anode plasma (MAP) source. FIG. 4 is a
partially cross-sectional view of one symmetric side of the ion
beam or MAP source 25. The ion beam or MAP source 25 produces an
annular ion beam K which can be brought to a broad focus symmetric
about the axis X--X 400 shown. In the cathode electrode assembly 30
slow (1 ms rise time) magnetic field coils 414 produce magnetic
flux S (as shown in FIG. 4A) which provides the magnetic insulation
of the accelerating gap between the cathodes 412 and the anodes
410. The anode electrodes 410 also act as magnetic flux shapes. The
slow coils 414 are cooled by adjacent water lines, not shown,
incorporated into the structure supporting the cathodes 412 and the
slow coils 414. The main portion of the MAP structure shown in this
Figure is about 18 cm high and wide.
The ion beam or MAP source 25 operates in the following fashion: a
fast gas valve assembly 404 located in the anode assembly 35
produces a rapid (200 .[.ms.]. .Iadd..mu.s.Iaddend.) gas puff which
is delivered through a supersonic nozzle 406 to produce a highly
localized volume of gas directly in front of the surface of a fast
driving coil 408 located in an insulating structure 420. After
pre-ionizing the gas with a 1 .[.ms.]. .Iadd..mu.s .Iaddend.induced
electric field, the fast driving coil 408 is fully energized,
inducing a loop voltage of 20 kV on the gas volume,
driving a breakdown to full ionization, and moving the resulting
plasma toward the flux filled shaping anode electrodes 410 in about
1.5 .[.ms.]. .Iadd..mu.s .Iaddend.to form a thin
magnetically-confined plasma layer. The pre-ionization step is a
departure from the earlier MAP reference which showed a separate
conductor located on the face of a surface corresponding to the
insulating structure 420 herein. Since this conductor was exposed
to the plasma, it broke down frequently. One of the inventors
herein discovered that the separate pre-ionizing structure was
unnecessary. The gas can be effectively pre-ionized by placing a
small ringing capacitor in parallel with the fast coil. The field
oscillators produced by this ringing circuit pre-ionize the gas in
front of the anode fast coil.
We have also discovered that, prior to provision of the main pulse
to the fast coil, it is beneficial to have the ability to adjust
the configuration of the magnetic field in the gap between the fast
coil and the anode to adjust the initial position of plasma
formation in the puffed gas pulse prior to the pre-ionization step.
This is accomplished by the provision of a slow bias capacitor and
a protection circuit both being installed in parallel with the fast
coil and isolated therefrom by a controllable switch. A slow bias
field is thus created prior to pre-ionization of the gas by the
fast coil.
After pre-ionization the fast coil is then fully energized as
described above to completely breakdown the gas into the plasma.
After this pulse the field collapses back into the fast coil which
is connected to a resistive load which is in turn connected to a
heat sink, not shown. In this manner heat build up in the fast coil
is avoided.
The fast coils 408 have been redesigned from the reference fast
coils in several ways as well as the heat sinking mentioned above.
The gap between the fast coil and the anode electrodes 410 has been
reduced with the result that the amount of necessary magnetic
energy has been decreased by over 50%. The lower energy requirement
permits repetitive use at higher frequencies and reduces the
complexity of the feed system voltages for the fast coils. The
design of the new flux-shaping anode electrode assembly has also
contributed to these beneficial results.
The pulsed power signal from the power system is then applied to
the anode assembly 35, accelerating ions from the plasma to form an
ion beam K. The slow (S) and fast (F) magnetic flux structures, at
the time of ion beam extraction, are shown in FIG. 4A. The definite
separation between the flux from the fast coil from the flux from
the slow coil is shown therein. This is accomplished by the
flux-shaping effects of the anodes 410 and also by the absence of a
slow coil located in the insulating structure 420 as was taught in
the earlier MAP reference paper. The slow coils in the present
system are located only in the cathode area of the MAP. This anode
flux shaping in conjunction with the location of slow coils in the
cathode assembly is different from that shown in the MAP reference
paper and permits the high repetition rate, sustained operation of
the MAP diode disclosed herein. This design allows the B=0 point
(the separatrix) to be positioned near the anode surface, resulting
in an extracted ion beam with minimal rotation. This minimal
rotation is necessary for effective delivery of the beam to the
material to be treated.
FIG. 4B is a detailed view of the gas valve assembly 404 and the
passage 425 which conducts the gas from the valve 404 to the area
in front of the fast coil 408. The passage 425 has been carefully
designed to deposit the gas in the localized area of the fast coil
with a minimum of blow-by past this region. The gas valve flapper
426 is operated by a small magnetic coil 428 which opens and closes
the flapper 426 upon actuation from the MAP control system. The
flapper valve is pivoted on the bottom end 427 of the flapper. The
coil 428 is mounted in a high thermal conductivity ceramic support
structure 429 which is in turn heat sinked to other structure, not
shown. This heat sinking is necessary for the sustained operating
capability of the MAP. The gas is delivered to the valve from a
plenum 431 behind the base of the flapper. The vacuum in the nozzle
406 rapidly draws the gas into the MAP once the flapper 426 is
opened. The function of the nozzle is to produce a directed flow of
gas only in the direction of flow and not transverse to it. Such
transverse flow would direct gas into the gap between the anode and
the cathode which would produce detrimental arcing and other
effects. The reduction of the fast coil-anode gap discussed above
makes the design of the nozzle very important to the successful
operation of the MAP. Fortunately, gas flow design tools are
available and were used to develop a nozzle with improved gas flow
(higher mach number) and minimal boundary effects. This improved
nozzle has an enlarged opening into the gas between the fast coil
and the near edge of the anode which tapers from 9 to 15 mm instead
of the straight walled 6 mm conduit in the reference MAP. The
operating pressure of the gas in the puff valve has been increased
from the range of 5-25 psig to the range of 35-40 psig. Experiments
have confirmed much improved MAP operation as a result of this new
design.
The ion diode of this invention is distinguished from prior art ion
diodes in several ways. Due to its low gas load per pulse, the
vacuum recovery within the MAP allows sustained operation up to and
above 100 Hz. As discussed above, the magnetic geometric is
fundamentally different from previous ion diodes. Prior diodes
produced rotating beams that were intended for applications in
which the ion beam propagates in a strong axial magnetic field
after being generated in the diode. The present system requires
that the ion beam be extracted from the diode to propagate in
field-free space a minimum distance of 20-30 cm to a material
surface. The magnetic configurations of previous ion diodes are
incapable of this type of operation because those ion beams were
forced by the geometries of those diodes to cross net magnetic flux
and thus rotate. Such beams would rapidly disperse and be useless
for the present purposes. By moving the slow coils (the diode
insulating magnetic field coils) to the cathode side of the diode
gap eliminated the magnetic field crossing for the beam but
required a total redesign of the magnetic system for the anode
plasma source. The modifications to the fast coil discussed above
result in an energy requirement that is 5-10 times less than
previous configurations. The modifications include: the elimination
of a slow coil on the anode side of the diode and its associated
feeds, better control over the magnetic field shaping and contact
of the anode plasma to the anode electrode structure through the
use of the partially field-penetrable electrodes, the elimination
of the separate pre-ionizer coil from the prior ion diodes, the
circuit associated with the fast coil to provide "bias" current to
adjust the magnetic field to place the anode plasma surface on the
correct flux surface to eliminate beam rotation and allow optimal
propagation and focusing of the beam, and the redesign of the gas
nozzle to better localize the gas puff which enable the fast coil
to be located close to the diode gap which in turn reduces the
energy requirements and complexity of the fast coil driver.
The plasma can be formed using a variety of gas phase molecules.
The system can use any gas (including hydrogen, helium, oxygen,
nitrogen fluorine, neon, chlorine and argon) or vaporizable liquid
or metal (including lithium, beryllium, boron, carbon, sodium,
magnesium, aluminum, silicon, phosphorous, sulfur, and potassium)
to produce a pure source of ions without consuming or damaging any
component other than the gas supplied to the source. The ion beam K
propagates 20-30 cm in vacuum (.about.10.sup.-3) to a broad focal
area (up to 1000 cm.sup.2) at the target plane, not shown, where
material samples are placed for treatment and can thermally alter
areas from 5 cm.sup.2 to over 1000 cm.sup.2.
The ion beam or MAP source 25 is capable of operating at repetitive
pulse rates of 100 Hz continuously with long component lifetimes
>10.sup.6. The ion beam or MAP source 25, according to the
principles of the present invention, draws ions from a plasma anode
rather than a solid dielectric surface flashover anode used in
present single pulse ion beam sources. Use of a flashover anode
typically introduces a variety of contaminants to the surface of
the material, often with detrimental results. One of the
significant advantages of the using the improved MAP source
disclosed herein is that one has precise control over the
components in the ion beam by controlling the composition of the
gas source.
The present invention combines the pulsed power supply P and the
MAP ion source 25 to obtain a system for repetitively generating
pulsed high voltage ion beams in a manner that allows the use of
this technology for the efficient treatment of surfaces in
commercial applications. In particular, the ion voltage is in the
range 0.1-2.5 MeV per ion, the energy per pulse is as large as 2.5
kJ, and the ion source impedance is significantly less than
100.OMEGA., allowing the pulse width to be as small as 30 ns. These
numbers are characteristic of the present embodiment, and may be
superseded by design changes obvious to worker in the art.
The detailed description of the new class of ion beam generators
having been completed, attention now turns to the many applications
made possible and practical in an industrial sense by said
generators.
There are three broad classes of surface effects upon which the
aforementioned applications depend. These are: a) Surface
Smoothing; b) Evaporation and Ablation from a Surface, and; c)
Generation and Quenching of Non-Equilibrium Surface Structure.
Other types of effects exist, and are not intended to be removed
from the scope of the claims, but the effects listed above
illustrate the enormous breadth of the present invention.
Surface Smoothing has a sphere of influence far wider than the
innocuous name would suggest. Every surface has an energy (or
surface tension) raising the energy of the atoms which make up to
the surface above the energy they would have if located in the bulk
of the material. Accordingly, given the opportunity any surface
structure which increases the surface area (thereby increasing the
number of surface atoms) will adjust by moving material around to
reduce the total surface area. As described in the Background
section, Surface Smoothing is driven by the surface tension of the
molten surface following surface heating by the ion beam, but
before sufficient heat has conducted into the body of the material
to allow the near-surface regions to resolidify. During this time,
the surface morphology will become less jagged and smoother, the
improvement limited primarily by the duration of surface
melting.
Another effect which can add to the smoothing of the surfaces of
fine-grain sintered materials, such as ceramics or materials
resulting from powder metallurgy, via ion beam surface melting. In
these cases, when proper process parameters are used, a glass or
alloy surface may be formed, thereby eliminating the grain
structure from the surface in favor of a smooth glassy surface.
Note further that the glass or alloy need not be equilibrium forms
of the material, as the rapid quenching will preserve many forms of
molecular solid solutions which do not exist in the relevant
equilibrium phase diagram.
The process conditions for Surface Smoothing are not onerous, so
long as the near-surface region of the material does melt to some
depth. In contrast to some of the techniques to be described later.
Surface Smoothing can often be carried out in a number of smaller
ion pulses, each one melting the surface, thereby allowing said
surface to become a little smoother.
Having described how to smooth a surface using ion beam surface
heating, the range of applications of Surface Smoothing must be
described. Again, these examples are simply for illustration, and
there is no intent to limit the present invention to a scope
inferior to that of the attached claims.
The simple process of smoothing a surface, e.g., to remove surface
defects resulting from etching or machining, is straightforward.
Example 1 describes the removal of etching defects on a copper
surface using the Surface Smoothing process. The surface initially
consisted of canyons and mountains some 3-5 .mu.m in height having
sharp edges and points. Following Surface Smoothing, the surface
exhibited surface roughness only on a size scale of less than 0.5
.mu.m.
Example 2 described the polishing of machining marks from a
machinable titanium alloy. The marks were originally some 5 .mu.m,
the remnants of a precision machining operation. The process of
Surface Smoothing reduced the surface roughness to less than 0.1
.mu.m, again removing the sharp, abrupt initial features and
leaving only a gently rolling surface. This polishing of machining
marks will also be useful in polishing of diamond-turned optics,
allowing such polishing to be executed without danger of changing
the carefully controlled surface generated by the machining
process, thus greatly reducing the cost of such optical elements.
Another application will be in the treatment of machine tool
surfaces, so that a minimum of machine marks may be made in the
first place.
Example 3 describes the smoothing of an Al.sub.2 O.sub.3 ceramic
surface by conversion of the surface to a glassy layer. Such a
process should be useful on a wide range of ceramics and other
materials having a pronounced grainy structure. There are certain
materials, such as most stainless steels, which do not form glassy
layers. They can, however, be melted to form a solid layer of metal
in these circumstances, said layer of metal having a
very-fine-grained structure.
Surface Smoothing makes two primary alterations in surface
morphology, it reduced the average surface roughness and it reduces
the surface area of the body treated. Both of these effects have
clear applications. The phenomenon of adhesion between two
materials is now well-understood. However, it is clear that the
more surface area upon which two materials meet, the more adhesive
force will exist between them. In fact, the function of many
adhesives is not only to stick to the surfaces of both bodies being
glued together, but also to maximize the area of contact by flowing
into small grooves and crevasses before hardening. The increase in
surface area which occurs in this process is enormous, and also
increases with time, explaining why fast-curing epoxies are
generally not as strong as their slower-curing cousins.
If one produces a surface which is (approximately) maximally smooth
using Surface Smoothing, the result will be a surface which will
experience minimal adhesive forces to another body in contact. In
other words, Surface Smoothing is another approach to non-stick
surfaces. Note that a non-stick surface need not be a low-friction
surface, as the one refers to the force required to start the body
into motion and the other to the force needed to keep it in motion
some moving.
Another general result of the Surface Smoothing process, resulting
directly from reduction in surface roughness, is reduction of wear
between two elements in contact and in relative motion. As
discusses in the Background section, the amount of material lost in
a given time to adhesive wear should be a linear function of the
surface roughness of the two elements. Although that estimate is
oversimplified, it is clear that less wear will result from the
mechanical interaction of two surfaces after Surface Smoothing has
been performed, beyond any surface hardening which might also have
taken place.
Related to the above is the fact that a smooth surface can increase
the working toughness of a material, although the actual
micro-properties of that material are not altered. The materials
used for mechanical applications are rarely, if ever, completely
homogeneous. Among other defects, incipient surface cracks provide
sites for failure of the element under stress. If the surface of
such a body is essentially smoothed, all incipient cracks are
located below the surface, and thus have two closed ends rather
than one. Such cracks are nearly twice as resistant to growth as is
a crack which intersects the surface. Thus, a smooth surface gives
a tougher part.
Corrosion resistance can also be increased through the use of
Surface Smoothing. Increased surface area, cracks, and other
defects associated with rough surfaces increase the rate of
corrosive processes, including in particular pitting, stress
corrosion, and attack by microbiological organisms. A number of
processes exist which directly attack the chemistry of corrosion,
such as formation of a layer of corrosive-resistant surface alloy,
but all such techniques work better if the surface is also
smooth
and relatively free of cracks. This is the role of Surface
Smoothing in preventing corrosion. Several examples have been
investigated, which will be discussed in the section on
Non-Equilibrium Surface Structures.
An application of Surface Smoothing closely related to the above is
that of passivation or protection of welds against corrosion.
Exposed welds, particularly between dissimilar materials, offer
fertile ground for corrosive processes. The reason is at least
two-fold. Generally, the region of the weld is rather heterogeneous
in composition and structure. Any corrosive process is thus likely
to act with different rates in different regions, resulting in a
surface of increasing micro-roughness as corrosion continues. Also,
the initial surface of a weld is usually very rough, having many
flaws and cracks on a small size scale. The effect of Surface
Smoothing following the welding process thus acts to ameliorate
both effects, resulting in a more corrosion-resistant weld.
A final illustration of the use of Surface Smoothing is in
application to amorphous magnetic materials. When a thin layer of a
magnetic material is considered, the surface roughness can have a
significant effect of magnetic properties, including coercive field
and dc hysteresis losses. An example of great industrial
significance is METGLAS.TM., a class of magnetic alloys produced by
shooting a jet of the molten alloy at a spinning metal wheel which
cools the alloy into a ribbon quickly enough that the resulting
structure is amorphous. One negative aspect of this means of
production is that the side of the ribbon opposite the wheel has a
very rough surface. This roughness also limits the thickness of
material that can be commercially produced, limiting the high
frequency range of METGLAS.TM. applications. Surface cracking of
the METGLAS.TM. ribbon also limits the thickness of material that
can be produced commercially, increasing the cost of METGLAS.TM.
cores for power distribution and related applications. As a result,
although the potential of METGLAS.TM. in power handling devices is
enormous, it has not yet realized that potential. Surface Smoothing
is a technique capable of smoothing and even forming METGLAS.TM.,
with the hoped-for improvement in magnetic properties, as described
in Example 4. The technique of Surface Smoothing can, of course, be
applied to any amorphous or fine-grained material, with beam
kinetic energy and ion species tailored to obtain the proper
cooling rate. Due to the extremely rapid quench rate, Surface
Smoothing can also be used to produce or modify new magnetic
materials not accessible using existing techniques.
A related technique can be applied to thin layers of amorphous or
nanocrystailine material, given only that these layers are
deposited on a substrate having high thermal conductivity (roughly
speaking, metals and ceramics rather than polymers and insulators).
The physics behind the design of a smoothing treatment is the same
as above, except that the heat from the ion pulse is conducted into
the substrate instead of into the bulk of a thick sample. Examples
of such processes include smoothing e.g., plasma spray deposited
films, filling in pinhole defects in the amorphous film, and
precisely controlling the grain size of fine-grain films by melting
and recrystallization.
Having described a number of applications for the process of
Surface Smoothing as made possible by the present invention,
attention is now focused on Evaporation and Ablation from a Surface
(EAS for short). One of the most important applications of EAS is
the simple task of cleaning surfaces. Simple, that is, except that
one wants to consistently clean a surface to an
environmentally-limited amount of contamination, without the use of
EPA- of OSHA-regulated solvents, preferably immediately before
using the clean surface (e.g., in welding, flux-free soldering,
vacuum deposition, and the like). If cleaning is also extended to
the removal of, for example, oxide layers from a metal surface, it
becomes clear that cleaning can be an essential and difficult part
of the manufacturing process. The process of EAS has many uses in
this domain.
A conventional form of cleaning is degreasing parts prior to some
assembly step, such as welding, soldering, gluing, etc. As will be
shown in Example 5 below, a 100 nm thick layer of conventional
lubricating oil is easily removed from a stainless steel surface
using a single pulse of about 1-2 J/cm.sup.2, a very small dosage
for the present class of ion beam generators. Note that no attempt
is made to restrict the beam to the contaminant layer alone, as an
extremely low beam energy would be required, owing to the low
density and small thickness of the contaminant. Rather, the ion
species and the energy of the beam is adjusted to superheat a thin
layer of the metal surface, which then vaporizes the hydrocarbon
contaminant before the bulk of the steel can cool the surface.
A further extension of cleaning a surface is the rapid and thorough
sterilization of surfaces subjected to appropriate EAS treatment.
Such techniques are likely to have impact in the manufacture of the
pre-sterilized medical implements.
The technique described above is quite general, and may be used on
any form of contamination that has a significantly lower boiling
point than the substrate material. In fact, in cases where a
natural passivating layer, e.g., a surface oxide, must be removed
before soldering, for example, can take place, and the relative
characteristics of the bulk material and the surface passivating
layer are as outlined above, the passivating layer can be removed
by superheating the underlying material.
In most cases, however, the materials encountered in both natural
and artificial surface layers have higher vaporization points than
do the materials they protect. In such cases, the EAS technique can
still be used to remove the surface layer provided only that loss
of a few microns of the underlying material is acceptable. This is
accomplished by ablating the surface layers of the underlying
material, taking along the unwanted overlayer. The total energy
required for ablation is generally quite high (>10 J/cm.sup.2),
and should be restricted to as thin a layer of material as is
reasonable (perhaps 0.5-1.0 .mu.m).
These numbers, like all specific numbers appearing in the
specification, depend to some extent on the ion species used and
the type of bulk material being processed. Note particularly the
difference caused by attempting to treat a polymer substrate, whose
thermal conductivity is perhaps 1000-10000 times smaller than that
of a metal alloy. The ablation temperature will be about the same,
and the energy contained in a given layer is perhaps 10-20% that of
an equivalent metal layer, owing to the lower density of the
polymer. As a result, the characteristic time to remove energy from
a heated surface layer will be on the order of 10 times that for a
typical metal. In addition, the range of ions in the polymer is
much greater for a given beam kinetic energy than in normal
structural metals. The net effect is that a much greater thickness
(say, .times. times the distance in the metal, for example) will be
heated by a beam of given kinetic energy. As the characteristic
time depends quadratically on this thickness and inversely on the
thermal conductivity, the characteristic time in polymer heating
will be .about.(10.sup.2 -10.sup.3).times..sup.2 longer than that
in a metal. Extremely rapid quenching thus cannot be produced on a
polymer surface by the techniques of the present invention. The
time required for heating, however, is limited only by the maximum
peak power of the ion beam generator. The EAS techniques therefore
apply to polymers, whereas most of the Surface Smoothing and
Non-Equilibrium processes do not.
If an patterned ion-absorbing mask or compound is used to prevent
the ion pulse from affecting certain areas of the element being
treated, a surface having a pattern of varying surface properties
can be generated. Such a pattern can range from removing an oxide
layer in certain areas to obtain patterned etching of a surface by
chemical action to direct etching of ablated patterns in large
scale solar cells to manufacture of patterned printed circuit
boards. The EAS process offers the advantage of limiting the use of
solvents and powerful acids in such procedures.
When a higher level of pulse power (>>10J/cm.sup.2), is
deposited in a thin surface layer (.about..mu.m in thickness),
violent ablation occurs. The expanding gases accelerate the
evaporated layer outward from the body of the material at extreme
velocity, generating as a result of momentum conservation a strong
pressure wave in the material. As most materials exhibit a
nonlinear stress-strain relationship, the pressure wave rapidly
sharpens into a shock wave. As this shock wave propagates inward
through the material, it generates dislocations, twinning planes,
and complex systems of these structure defects, thereby dissipating
its power and eventually (within perhaps 100 .mu.m or more) ceases
to exist as a cohesive entity. This damaged region, however, has
undergone a phenomenon known as shock-hardening, an extreme form of
work-hardening. Even though the direct heating action of the ion
beam may be limited to the first few .mu.m, the shock hardening
effect penetrates much deeper, offering a surface treatment which
cannot be directly obtained using the present invention.
EAS uses the pulsed ion beam generators of the present invention to
rapidly vaporize material from the surface of a body. This
vaporized material can be used as a source material for vapor
deposition processes, having the advantage that chemical
compositions will not be charged by segmentation effects due to the
phase diagram of the alloy system or chemical reactions with a
resistive heating element, as is often used in vapor phase
deposition. In addition, the vapor deposition will take place in a
very short period of time (<1 .mu.s). As a result the heat of
adsorption will rapidly conduct away into the bulk of the
substrate, and one will again obtain a rapidly quenched material,
given only that the substrate has large thermal conductivity. The
large surface area that the ion beam generators of the present
invention can vaporize makes this approach available to large-scale
manufacturing efforts.
Another effect associated with EAS used in this mode has been
observed. A layer of material a few .mu.m thick is vaporized within
the period of a few tens of nanoseconds. This converts a metal
layer having a given density into a plasma which initially has very
nearly the same density, as it has not yet had time to expand away
from the bulk of the material. The energy distribution of this
layer follows a Boltzmann distribution, meaning that a significant
percentage of the vaporized material has kinetic temperatures
significantly less than the average temperature of the plasma.
Because of this, and because the plasma is so close to a relatively
cool conducting surface, a small amount of the vaporized material
redeposits on the surface from which it came. In doing so, that
surface acquires a structure which is extremely rough on a
nanoscale, particularly having numerous protuberances much smaller
than a .mu.m in size, possessing unique properties.
EAS processes can be used for many other manufacturing purposes,
and presentation of these examples is not intended to limit the
scope of the invention beyond the limitations outlined in the
attached claims.
The final major class of processes made practical for large-scale
manufacturing by the new category of pulsed ion beam generators
made possible by the current invention is the production of
non-equilibrium surface structures (NESS for short). The name is a
bit misleading, as some near-equilibrium applications also come
under this title, but the general concept is that one heats a
surface having an initial structure rapidly to some depth with a
pulsed ion beam, the heat is rapidly lost to conduction into the
material, and the result is a product surface having a structure
with different properties than those of the initial structure. As
the structure of many of the product surfaces is non-equilibrium,
that term is used herein to describe the whole family of
processes.
A good example of the production and retention of high-temperature
structures is offered by Example 6, in which an NESS-type process
is applied to the surface of a tool steel component. (Such a
process is not limited to the hardening of steel.) The hardness of
the surface roughly tripled, but the important point is how this
increase in hardness came about. X-ray and electron microscope
analysis of the untreated surface shows the simple co-ferrite phase
with a significant density of cementite precipitates. However, the
treated surface showed the presence of small crystallites of
austenite, the possible presence of martensite, and no carbide
precipitates. This is significant in that austenite is stable only
at high temperatures, and that the equilibrium structure at room
temperature is a mixture of ferrite and cementite (Fe.sub.3 C
precipitates). At high temperature, the carbon dissolves into the
matrix, producing austenite in the process. The NESS process has
thus quenched a high-temperature phase structure so that it exists
at room temperature. Conventionally hardened tool steels are
composed either of a very fine grain pearlite or of tempered
martensite. The structure obtained from the NESS treatment differs
from these, thus providing another surface microstructure useful
for hardening steel alloys. Other precipitates than carbon, of
course, can be dissolved and retained in a non-equilibrium solid
solution using the NESS technique, and other materials than steel
can be successfully treated.
Another approach toward hardening the surface of steel (or other
alloys) is to add elements, usually carbon and/or nitrogen, which
encourages the formation of high-hardness carbides and nitrides in
the near-surface region. The NESS process offers an alternate
approach to the usual process of addition, which involves long
periods of diffusion in hot environments. For carburization, it is
possible to start by depositing a glassy layer of carbon on the
surface to be treated (this deposition may use an EAS process, but
need not). The layer of carbon and a suitable thickness of the
underlying metal would then be melted by the pulse of an ion beam,
whereupon the carbon would dissolve into the steel. Further heat
treatment may be necessary to obtain optimal surface conditions,
depending on the starting alloys. A similar technique which may
work for nitriding would require deposition of a layer of a
high-temperature nitride, such as titanium or vanadium nitride.
(The titanium or vanadium also improve the properties of the
resulting steel. However, this hardening process is not limited to
these two elements, but may use any nitride which can withstand the
high process temperatures without volatilizing.) The remainder of
the process is carried out as for carbon above, save that further
thermal treatment are generally not useful in nitridization. Other
elements can be introduced into the surface layers of a compatible
body using this type of NESS technique.
The beneficial effects of Surface Smoothing on corrosion resistance
was discussed earlier. Additional phenomena more closely related to
the NESS processes are also of value in holding back corrosion.
This is illustrated in Example 7, in which a stainless steel
surface is treated with a mixed carbon-hydrogen ion beam pulse from
an early device utilizing a flashover ion source. Although this
technology is primitive compared to that offered by the current
invention, in particular not allowing industrial scale-up, it did
prove adequate to demonstrate the increase of corrosion
resistance.
When 304 stainless steel is annealed at high temperatures as
described in the Example, chromium-depleted regions form near the
grain boundaries of the metal. The chromium precipitates out in
large chromium carbide particles in the interiors of the grains.
The chromium-depleted regions are intrinsically more susceptible to
corrosion, and the chromium carbide particles present intergranular
surfaces which are also particularly susceptible to corrosion. As a
result, 304 stainless steel, when subjected to the described heat
treatment, becomes extremely susceptible to corrosion, primarily
preferential grain boundary corrosion. When the heat-treated
surface is subjected to a 0.3 MeV. .about.300 ns pulse of mixed
ions with a total energy of 2-3 J/cm.sup.2, the rapid melting and
recrystallization removed the chromium-depleted grain boundaries
and caused the chromium carbide particles to redissolve in the
metal. This treatment was observed to increase corrosion resistance
essentially back to the pre-heat treatment level. Similar work
aimed at studies of pitting susceptibility of 316L and 316F
stainless steels has also been undertaken with similar results.
Aluminum alloys have also been subjected to NESS processes to
increase their corrosion resistance. Again, the pulsed ion beam
used was a mix of carbon and hydrogen ions accelerated to 0.7 MeV.
The pulses were .about.100 ns wide, and the total energy of each
pulse was .about.2-3 J/cm.sup.2. Exposure testing for the alloys
used was conducted in a
saturated salt fog environment. The alloys treated have included
2024-T3, 6061-T6, and 7075-T6. In all cases the NESS treatment
increased the corrosion resistance of the samples. This should be
true for all structural aluminum alloys.
Another approach to increasing corrosion resistance through NESS
treatment can be illustrated best by considering a carbon steel
(i.e., low chromium content). Such steels are extremely susceptible
to corrosion, rusting in moist air, disintegrating over time in
saline environments, and failing even more quickly in more hostile
conditions. The addition of chromium to such steels produces
stainless steels, which do not share this extreme sensitivity to
environment. However, stainless steel is expensive, especially
considering that the mechanical properties of stainless steels are
suboptimal, and that the property of being "stainless" need only
exist at the surface of the element. NESS treatment can help to
solve this problem by mixing a surface-deposited layer of chromium
with the near-surface regions of the steel element. The result will
be an element having the superior mechanical properties of carbon
steel combined with an outer layer of stainless steel perhaps 5-20
.mu.m thick (depending on conditions) which is both smooth and
uniform, thus providing excellent corrosion resistance. This sort
of technique is extendible to many metal alloy systems, including
welds, the scope of which are well-known to practitioners in the
metallurgical arts.
The Examples referred to above will now be described in detail.
These Examples are not intended to limit the scope of the claims
appended in any manner, but rather to illustrate their application
in specific instances.
EXAMPLE 1
A sample of nominally pure Cu was etched in 1 molar nitric acid for
one minute. Scanning electron microscopy (SEM) analysis of the
resulting surface showed a roughened surface with hillocks and
"sharp" features approximately 3-5 .mu.m in height. These samples
were treated using a single pulse of an ion beam generated using a
RHEPP prototype power source and a flashover ion source. (In a
flashover ion source an electrical discharge volatilizes the
surface of a polymer, resulting in the generation of mixed carbon
and hydrogen ions.) The beam kinetic energy was 1.0 MeV, the pulse
width was approximately 60 ms, and the total pulse energy density
at the treated surface was .about.3J/cm.sup.3.
Post-treatment SEM analysis revealed a smoother surface with more
gradual changes in surface configuration and an average surface
roughness of .about.0.5 .mu.m. In this example the Cu surface was
molten for .about.500 ns. The driving force of surface tension
during this period was clearly sufficient to produce nearly
complete removal of the original surface morphology.
EXAMPLE 2
A piece of Ti-6Al-4V alloy (a common machinable titanium alloy) was
machined using conventional precision machining techniques, leaving
a nominally flat surface with machining marks producing a surface
roughness of .about.5 .mu.m. This surface was treated by exposure
to four pulses, each pulse having a beam kinetic energy of
.about.3.0-0.4 MeV, a duration of .about.400 ns, and a total pulse
energy density of .about.7 J/cm.sup.2. SEM analysis of the treated
surface revealed surface roughness had been reduced to .about.0.1
.mu.m. The time the metal surface was liquid was again some 250-500
ns, suggesting that the effect of multiple pulses in the smoothing
process is additive, i.e., that more pulses give a smoother
surface.
EXAMPLE 3
One side of an alumina (Al.sub.2 O.sub.3 ceramic) sample was
polished using submicron abrasive grit suspensions. Following
characterization of the surface with an SEM, the polished surface
was subjected to a single ion pulse having a beam kinetic energy of
.about.1.0 MeV, a beam duration of .about.60 ns, and a total pulse
energy density of .about.10 J/cm.sup.2. Post-treatment analysis
showed evidence for melting and resolidification resulting in
reduction of surface porosity. There remained, however, some
microcracking on a 0.1 .mu.m size scale. It is considered likely
that further treatment would yield a uniformly smooth surface.
EXAMPLE 4
Because of its unique magnetic properties, various amorphous
magnetic alloys known by the registered trademark (Allied-Signal,
Inc.) METGLAS.TM. are desirable in high frequency applications,
including pulsed power supplies and control. These materials are
made by spraying the molten alloy on a cooled rotating wheel,
thereby quenching the material at .about.10.sup.6 .degree.K/sec and
forming an amorphous ribbon having thicknesses in the range of
15-50 .mu.m. Due to hydrodynamic instabilities during the cooling
process, one side of such ribbons has significant ripples in
thickness having a period similar to the thickness of the ribbon.
This non-uniformity is important for two reasons. First, the
magnetic properties at high frequencies are a function of the
thickness of the ribbon; hence the variation in thickness limits
the performance of devices constructed of non-uniform ribbon.
Second, the size scale of the surface roughness is sufficient that
when the ribbon is formed into a coil, or similar structure, the
layer of insulation between alternate layers of ribbon must be very
thick to prevent formation of short-circuits. The thick insulation
reduced the density of magnetic material in a given construct,
lowering performance and increasing the physical dimensions of the
ultimate device.
An experiment was performed to discover if Surface Smoothing with
ion beam pulses could even out the non-uniformities of a
METGLAS.TM. surface while retaining the unique magnetic properties
which result from the amorphous structure. METGLAS.TM. 2605CO
material was chosen for the test, as it is perhaps most widely used
in commercial applications at this time. The nominal composition of
METGLAS.TM. 2605CO is Fe.sub.56 Co.sub.18 B.sub.15 Si.sub.1, and it
is produced using the wheel-quenching technique described above. A
sample was selected, and subjected to a single 2 J/cm.sup.2 pulse
of mixed carbon and hydrogen ions from a flashover source. The beam
kinetic energy was .about.0.6 MeV, and the pulse width was
.about.60 ns. The resulting surface was virtually flat.
A second concern, of course, was that the nanostructure which helps
to give METGLAS.TM. 2605CO its unique properties might be damaged
by remelting and quenching at a rate different than encountered in
the original manufacture. Tests have shown that the amorphous
structure of the original METGLAS.TM. is unchanged by the ion pulse
treatment.
EXAMPLE 5
A 0.1 .mu.m layer of machining fluid (a hydrocarbon mixture) was
applied to the surface of a sample of 304 stainless steel. The
surface was examined using x-ray photo-emission spectroscopy (XPS)
to verify the thickness of the hydrocarbon layer. The sample was
then exposed to three ion pulses, each having a total energy
density of 2-3 J/cm.sup.2, a beam kinetic energy of 0.5-0.75 MeV,
and a pulse duration of .about.50 ns. Following treatment, XPS was
again performed, and showed only that amount of hydrocarbon
expected from atmospheric contamination (about a monolayer). The
surface cleaning was thus totally successful.
EXAMPLE 6
A sample of 0-1 tool steel was subjected to ion pulses to determine
if the surface could be hardened thereby. The sample was subjected
to a single pulse having a beam kinetic energy of .about.1 MeV, a
duration of .about.40 ns, and a surface energy density of .about.5
J/cm.sup.2. On recovery, the top few microns of the sample showed
only fine grains on the order of 20 nm in size, compared to the
initial material which had grain size on the order of 1 .mu.m in
size. The initial material had a significant density of iron
carbide precipitates, whereas the surface layers did not, having
apparently redissolved the carbon into the iron matrix.
Hardness testing on the samples was done using micro-indentation
techniques. A Knoop indentor tip was pressed into the samples with
a 25 gram load, producing indentations about 5 .mu.m in thickness.
A direct reduction of this data showed that the untreated surface
had a Knoop hardness of 330, while the treated surface has a Knoop
hardness of 900, roughly three times higher. Further, indentation
hardness tests are influenced by the hardness of the material out
to a distance of perhaps 10 time the size of the indentations.
Since the treated layer is only .about.7 .mu.m thick, this means
that it is actually much harder than the indentation testing
revealed.
.theta.-2.theta. x-ray diffraction measurements were taken of the
treated and untreated surfaces. The untreated surface shows only a
sharp peak corresponding to large ferrite grains (the Fe.sub.3 C
precipitates would not diffract at the angles examined). The
treated surface, however, showed three interesting differences from
the untreated surface. First, austenite peaks appeared, showing
that high-temperature species had been successfully recovered in
the rapid quench. Second, the diffraction peaks were all quite
broad, in agreement with the observation that the grain size in the
treated material was very small. Finally, the ferrite peak in the
treated sample is asymmetric, suggesting the existence of lattice
strains consistent with the presence of martensite. It is likely
that all of these effects combine to increase the hardness of the
surface of the treated sample.
EXAMPLE 7
Four flat samples of 304 stainless steel were prepared to determine
if ion beam pulses could eliminate preferential grain boundary
corrosion due to heat treatment. All samples were held at
1100.degree. C. for 24 hours, and then quenched in cold water. Two
of the samples were sensitized to corrosive action by heating them
at 600.degree. C. for 100 hours, followed by cooling in air. This
second anneal produces precipitation of chromium carbide particles,
formed through depletion of the grain boundaries of the metal of
their chromium, a well-known problem in the application of
stainless steels having too much carbon.
All samples were polished to a mirror finish. Two of the samples,
one from each group of annealing conditions, were subjected to four
pulses each having a surface energy density of .about.3 J/cm.sup.2,
a beam kinetic energy of .about.0.3 MeV, and a duration of
.about.300 ns. Each pulse was a combination of carbon and hydrogen
ions, the ions source using flashover technology.
The degree of sensitization was determined using potentiokinetic
reactivation in a 0.5M H.sub.2 SO.sub.4 plus 0.01M KSCN solution
held at 30.degree. C. The charge per unit area Q/A required for
reactivation is a measure of the susceptibility of the surface of
the corrosive effects of this solution. The sample exposed only to
the 1100.degree. C. anneal had a Q/A value of 0.018
Coulombs/cm.sup.2. The sample having the same heat treatment but
also exposed to the ion beam pulse had a Q/A value of 0.057 and
0.084 Coulombs/cm.sup.2 (on separate measurements), suggesting that
the beam treated surface was somewhat more susceptible to
corrosion.
The more important results, however, are on the samples which had
undergone both annealing cycles. The sample which only received
both annealing cycles had a Q/A value of 0.825 and 0.817
Coulombs/cm.sup.2 (again two measurements were made), an enormous
increase from the value of 0.018 for the sample which only received
the high-temperature anneal. This huge difference in corrosive
sensitivity explains why temperatures in the 600.degree. C. range
are avoided in application of most stainless steels. However, when
such a sample is treated with the above described ion beam pulse
schedule, the Q/A value dropped to 0.027 and 0.028
Coulombs/cm.sup.2, a value nearly as low as the original
material.
One example of why this result is important lies in the problem of
welding stainless steel for applications in which corrosive
environments are to be encountered. In welding there will clearly
be a zone of material which will slowly cool from a temperature in
the sensitization range (roughly 400.degree.-800.degree. C.). This
zone will be somewhat sensitized to corrosion, although not to the
extreme of the experimental sample described above. Unless the
entire assembly can be subjected to high-temperature annealing when
complete, most stainless steels will not be practical choices for
corrosive environments. When stainless steels must be welded now, a
steel is chosen having so little carbon that the grain boundary
sensitization process cannot occur, thus solving the corrosion
problem. However, low-carbon steels are generally soft and weak by
comparison to other possibilities, so this choice is a compromise.
The ion beam pulse surface modification technology described herein
will reduce the number of design compromises required, in this
problem and in many others.
The capacity of the present invention for producing high energy,
high average power pulsed ion beams results in a new, low cost,
compact surface treatment technology capable of high volume
commercial applications and new treatment techniques not possible
with existing systems. Having thus described the present invention
with the aid of specific examples, those skilled in the art will
appreciate that other similar combinations of the capabilities of
this technology are also possible without departing from the scope
of the claims attached herewith.
* * * * *