U.S. patent number D953,176 [Application Number D/725,212] was granted by the patent office on 2022-05-31 for sensor housing assembly. This patent grant is currently assigned to Waymo LLC. The grantee listed for this patent is Waymo LLC. Invention is credited to Benjamin Chen, Thomas Southworth.
United States Patent | D953,176 |
Chen , et al. | May 31, 2022 |
Inventors: | Chen; Benjamin (San Francisco, CA), Southworth; Thomas (Royal Oak, CA) | ||||||||||
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Applicant: |
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Assignee: | Waymo LLC (Mountain View,
CA) |
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Appl. No.: | D/725,212 | ||||||||||
Filed: | February 24, 2020 |
Current U.S. Class: | D10/70 |
Current International Class: | 1004 |
Field of Search: | ;D14/138C,250,251 ;D12/167,174,400 ;D10/75,78 |
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