Earphone case

Description

FIG. 1 is a top, front, and right perspective view of the earphone case showing our new design, shown in a closed configuration.

FIG. 2 is a bottom, rear, and left perspective view of the earphone case of FIG. 1, shown in the closed configuration.

FIG. 3 is a front view of the earphone case of FIG. 1, shown in the closed configuration.

FIG. 4 is a rear view of the earphone case of FIG. 1, shown in the closed configuration.

FIG. 5 is a left side view of the earphone case of FIG. 1, shown in the closed configuration.

FIG. 6 is a right side view of the earphone case of FIG. 1, shown in the closed configuration.

FIG. 7 is a top view of the earphone case of FIG. 1, shown in the closed configuration.

FIG. 8 is a bottom view of the earphone case of FIG. 1, shown in the closed configuration.

FIG. 9 is a top, front, and right perspective view of the earphone case of FIG. 1, shown in an open configuration.

FIG. 10 is a bottom, rear, and left perspective view of the earphone case of FIG. 1, shown in the open configuration.

FIG. 11 is a front view of the earphone case of FIG. 1, shown in the open configuration.

FIG. 12 is a rear view of the earphone case of FIG. 1, shown in the open configuration.

FIG. 13 is a left side view of the earphone case of FIG. 1, shown in the open configuration.

FIG. 14 is a right side view of the earphone case of FIG. 1, shown in the open configuration.

FIG. 15 is a top view of the earphone case of FIG. 1, shown in the open configuration; and,

FIG. 16 is a bottom view of the earphone case of FIG. 1, shown in the open configuration.

The ornamental design which is claimed is shown in solid lines in the drawings. The broken line showing in FIGS. 1-16 illustrates the environment, which forms no part of the claimed design. The shade lines in the figures show contour, not surface ornamentation and form no part of the claimed design.

Claims

CLAIM The ornamental design for an earphone case, as shown and described.

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Inventors:	Wu; Wei (Anhui, CN), Yu; Pengtao (Cupertino, CA)
Applicant:	Name City State Country Type Anhui Huami Information Technology Co., Ltd. Zepp, Inc. Hefei Cupertino N/A CA CN US
Assignee:	Anhui Huami Information Technology Co., Ltd. (Anhui, CN) Zepp, Inc. (Cupertino, CA)
Appl. No.:	D/734,819
Filed:	May 15, 2020

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Foreign Application Priority Data

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Nov 20, 2019 [CN]			201930639991.1

Current U.S. Class:	D3/294
Current International Class:	0301
Field of Search:	;D3/207,212,215,218,219,266,273,275,294,299,300,302,313

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References Cited [Referenced By]

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U.S. Patent Documents

D365483	December 1995	Van Dyk
D586557	February 2009	Jalet
D841580	February 2019	Bao
D841581	February 2019	Bonahoom
D881810	April 2020	Zhang

Foreign Patent Documents

	304454889		Jan 2018		CN
	304930201		Dec 2018		CN
	1636317		Jul 2019		JP
	1640958		Sep 2019		JP
	1640963		Sep 2019		JP
	1641799		Sep 2019		JP

Primary Examiner: Rudzinski; Kevin K
Assistant Examiner: Rabie; Amber J
Attorney, Agent or Firm: Young Basile Hanlon & MacFarlane, P.C.

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