U.S. patent number D920,939 [Application Number D/687,685] was granted by the patent office on 2021-06-01 for electronic device housing.
This patent grant is currently assigned to ABB Power Grids Switzerland AG. The grantee listed for this patent is ABB Power Grids Switzerland AG. Invention is credited to Fredrik Alfredsson, Mikael Edoff.
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United States Patent |
D920,939 |
Alfredsson , et al. |
June 1, 2021 |
Electronic device housing
Claims
CLAIM The ornamental design for an electronic device housing, as
shown and described.
Inventors: |
Alfredsson; Fredrik (Vasteras,
SE), Edoff; Mikael (Saltsjo-Boo, SE) |
Applicant: |
Name |
City |
State |
Country |
Type |
ABB Power Grids Switzerland AG |
Baden |
N/A |
CH |
|
|
Assignee: |
ABB Power Grids Switzerland AG
(Baden, CH)
|
Appl.
No.: |
D/687,685 |
Filed: |
April 15, 2019 |
Foreign Application Priority Data
|
|
|
|
|
Oct 15, 2018 [EM] |
|
|
005798378 |
Apr 5, 2019 [EM] |
|
|
006370771 |
|
Current U.S.
Class: |
D13/184; D13/110;
D13/123 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/110,123,158,162,184,199 ;D14/301,439 |
References Cited
[Referenced By]
U.S. Patent Documents
Other References
ABB Launches new microgrid system to boost use of renewables; Oct.
10, 2016; 1 pg.;
https://www.windpowerengineering.com/abb-launches-new-microgrid-system-bo-
ost-use-renewables/. cited by examiner .
Rolls-Royce and ABB partner to develop micorgrid solution for
business; Apr. 2, 2019; 1 pg. ;
https://www.edie.net/news/8/Rolls-Royce-and-ABB-partner-to-develop-microg-
rid-solution-for-business/. cited by examiner.
|
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Slater Matsil, LLP
Description
FIG. 1 is a top, front isometric view of an electronic device
housing in accordance with the new design;
FIG. 2 is a right side elevational view of FIG. 1;
FIG. 3 is a left side elevational view of FIG. 1;
FIG. 4 is a front elevational view of FIG. 1;
FIG. 5 is a rear elevational view of FIG. 1;
FIG. 6 is a top plan view of FIG. 1; and,
FIG. 7 is a bottom plan view of FIG. 1.
* * * * *
References