Three dimensional faceted identification chip

Kim , et al. February 23, 2

Patent Grant D911331

U.S. patent number D911,331 [Application Number D/684,253] was granted by the patent office on 2021-02-23 for three dimensional faceted identification chip. This patent grant is currently assigned to LEXMARK INTERNATIONAL, INC.. The grantee listed for this patent is Lexmark International, Inc.. Invention is credited to Scott Richard Castle, Hyeob Kim, Robert Henry Muyskens, Brant Dennis Nystrom, Thomas Eugene Pangburn, Samuel Leo Rhodus.


United States Patent D911,331
Kim ,   et al. February 23, 2021

Three dimensional faceted identification chip

Claims

CLAIM The ornamental design for three dimensional faceted identification chip, as shown and described.
Inventors: Kim; Hyeob (Independence, KY), Pangburn; Thomas Eugene (Winchester, KY), Castle; Scott Richard (Lexington, KY), Muyskens; Robert Henry (Lexington, KY), Nystrom; Brant Dennis (Lexington, KY), Rhodus; Samuel Leo (Lexington, KY)
Applicant:
Name City State Country Type

Lexmark International, Inc.

Lexington

KY

US
Assignee: LEXMARK INTERNATIONAL, INC. (Lexington, KY)
Appl. No.: D/684,253
Filed: March 19, 2019

Current U.S. Class: D14/384
Current International Class: 1402
Field of Search: ;D14/356-358,383-385,420,426,427,432-439,447,453,454,217,253,299,307 ;D13/107,108,133,146,147,152,154,156,158,162,162.1,168,173,177,102 ;235/441,451,492,380,439,375 ;361/679.31,600,679.01,679.02

References Cited [Referenced By]

U.S. Patent Documents
1734979 November 1929 Persons
2538638 January 1951 Wilson
D207930 June 1967 Kotler
5329407 July 1994 Sasaki
D380402 July 1997 Binder, Sr.
D432939 October 2000 Hooglander
D670416 November 2012 Renshaw
D774687 December 2016 Dennis
D774688 December 2016 Dennis
D790520 June 2017 Kim
D790763 June 2017 Lai
D831261 October 2018 Ding
D851327 June 2019 Morelock
D852395 June 2019 Chen
10333200 June 2019 Moon
D857696 August 2019 Oh
D865765 November 2019 Min
Primary Examiner: Murphy; Austin

Description



FIG. 1 is a front, top, and right side perspective view of a three dimensional faceted identification chip showing our new design;

FIG. 2 is a rear, bottom, and left side perspective thereof;

FIG. 3 is front elevation thereof;

FIG. 4 is a right side elevation thereof;

FIG. 5 is a rear elevation thereof;

FIG. 6 is a left side elevation thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is a section view thereof, as identified in FIG. 3;

FIG. 10 is a section view thereof, as identified in FIG. 3; and,

FIG. 11 is a section view thereof, as identified in FIG. 3.

The features shown in broken lines depict environmental subject matter only and form no part of the claimed design.

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Patent Diagrams and Documents

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