Thin biscuit sandwich

Wang , et al. February 2, 2

Patent Grant D909006

U.S. patent number D909,006 [Application Number D/503,952] was granted by the patent office on 2021-02-02 for thin biscuit sandwich. This patent grant is currently assigned to Intercontinental Great Brands LLC. The grantee listed for this patent is Intercontinental Great Brands LLC. Invention is credited to Manhu Gu, Weibing Qian, Yong Shi, Dongxu Wang, Guoqiang Xue.


United States Patent D909,006
Wang ,   et al. February 2, 2021

Thin biscuit sandwich

Claims

CLAIM The ornamental design for a thin biscuit sandwich, as shown and described.
Inventors: Wang; Dongxu (Suzhou, CN), Shi; Yong (Suzhou, CN), Qian; Weibing (Suzhou, CN), Xue; Guoqiang (Suzhou, CN), Gu; Manhu (Suzhou, CN)
Applicant:
Name City State Country Type

Intercontinental Great Brands LLC

East Hanover

NJ

US
Assignee: Intercontinental Great Brands LLC (East Hanover, NJ)
Appl. No.: D/503,952
Filed: September 30, 2014

Foreign Application Priority Data

Mar 30, 2014 [CN] 2014 3 0070448
Current U.S. Class: D1/128; D1/130
Current International Class: 0101
Field of Search: ;D1/100-130,199 ;426/104,108,138,391,549,808,94,143,559,560 ;D11/12,24,40,43,79,86,95 ;D24/101-104 ;446/118,128 ;D21/484,499,503,335 ;D9/707,756

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Primary Examiner: Stofko; Katie Jane
Attorney, Agent or Firm: Fitch, Even, Tabin & Flannery LLP

Description



FIG. 1 is a front elevation view of a first embodiment of a thin biscuit sandwich, the left, right and rear elevation views being identical thereto;

FIG. 2 is a top perspective view of the thin biscuit sandwich of FIG. 1, the bottom perspective view being identical thereto;

FIG. 3 is a top plan view of the thin biscuit sandwich of FIG. 1;

FIG. 4 is a front elevation view of the thin biscuit sandwich of FIG. 1, but showing an open state;

FIG. 5 is a top plan view of the open state of the thin biscuit sandwich of FIG. 1;

FIG. 6 is a front elevation view of a second embodiment of a thin biscuit sandwich, the left, right and rear elevation views being identical thereto;

FIG. 7 is a top perspective view of the thin biscuit sandwich of FIG. 6, the bottom perspective view being identical thereto;

FIG. 8 is a top plan view of the thin biscuit sandwich of FIG. 6;

FIG. 9 is a front elevation view of the thin biscuit sandwich of FIG. 6, but showing an open state;

FIG. 10 is a top plan view of the open state of the thin biscuit sandwich of FIG. 6;

FIG. 11 is a front elevation view of a third embodiment of a thin biscuit sandwich, the left, right and rear elevation views being identical thereto;

FIG. 12 is a top perspective view of the thin biscuit sandwich of FIG. 11, the bottom perspective view being identical thereto;

FIG. 13 is a top plan view of the thin biscuit sandwich of FIG. 11;

FIG. 14 is a front elevation view of the thin biscuit sandwich of FIG. 11, but showing an open state;

FIG. 15 is a top plan view of the open state of the thin biscuit sandwich of FIG. 11;

FIG. 16 is a front elevation view of a fourth embodiment of a thin biscuit sandwich, the left, right and rear elevation views being identical thereto;

FIG. 17 is a top perspective view of the thin biscuit sandwich of FIG. 16, the bottom perspective view being identical thereto;

FIG. 18 is a top plan view of the thin biscuit sandwich of FIG. 16;

FIG. 19 is a front elevation view of the thin biscuit sandwich of FIG. 16, but showing an open state; and,

FIG. 20 is a top plan view of the open state of the thin biscuit sandwich of FIG. 16.

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References

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