U.S. patent number D901,564 [Application Number D/699,539] was granted by the patent office on 2020-11-10 for gas inlet attachment for wafer processing apparatus.
This patent grant is currently assigned to KOKUSAI ELECTRIC CORPORATION. The grantee listed for this patent is KOKUSAI ELECTRIC CORPORATION. Invention is credited to Shinya Morita, Satoru Murata.
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United States Patent |
D901,564 |
Murata , et al. |
November 10, 2020 |
Gas inlet attachment for wafer processing apparatus
Claims
CLAIM The ornamental design for a gas inlet attachment for wafer
processing apparatus, as shown and described.
Inventors: |
Murata; Satoru (Toyama,
JP), Morita; Shinya (Toyama, JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
KOKUSAI ELECTRIC CORPORATION |
Tokyo |
N/A |
JP |
|
|
Assignee: |
KOKUSAI ELECTRIC CORPORATION
(Tokyo, JP)
|
Appl.
No.: |
D/699,539 |
Filed: |
July 26, 2019 |
Foreign Application Priority Data
|
|
|
|
|
Jan 28, 2019 [JP] |
|
|
2019-001458 |
|
Current U.S.
Class: |
D15/144.1 |
Current International
Class: |
1509 |
Field of
Search: |
;D13/182,184,199,122
;D15/144,144.1,144.2 ;D8/2,382 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Fitch, Even, Tabin & Flannery,
LLP
Description
FIG. 1 is a front, top and right side perspective view of a gas
inlet attachment for wafer processing apparatus showing our new
design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a cross sectional view taken along line 8-8 in FIG.
2.
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