Flip cap package with chamfer

McMenamin , et al. Sept

Patent Grant D896632

U.S. patent number D896,632 [Application Number D/659,706] was granted by the patent office on 2020-09-22 for flip cap package with chamfer. This patent grant is currently assigned to Hollister Incorporated. The grantee listed for this patent is Hollister Incorporated. Invention is credited to Martin P. Creaven, Joseph N. Hanley, Martin McMenamin, Vincent Naughton, Daniel E. O'Brien, Scott J. Pupino.


United States Patent D896,632
McMenamin ,   et al. September 22, 2020

Flip cap package with chamfer

Claims

CLAIM The ornamental design for a flip cap package with chamfer, as shown and described.
Inventors: McMenamin; Martin (Lifford, IE), O'Brien; Daniel E. (Calry, IE), Naughton; Vincent (Sligo, IE), Creaven; Martin P. (Ballina, IE), Hanley; Joseph N. (Sligo, IE), Pupino; Scott J. (Oak Park, IL)
Applicant:
Name City State Country Type

Hollister Incorporated

Libertyville

IL

US
Assignee: Hollister Incorporated (Libertyville, IL)
Appl. No.: D/659,706
Filed: August 10, 2018

Current U.S. Class: D9/420; D3/203.1
Current International Class: 0903
Field of Search: ;D9/414,420-423,430,730,733 ;D3/203.1 ;D24/112

References Cited [Referenced By]

U.S. Patent Documents
5389415 February 1995 Kaufmann
5540343 July 1996 Schumacher
5727819 March 1998 Grosskopf
6321923 November 2001 Wood
6908113 June 2005 Chaduc et al.
7731042 June 2010 Blomdahl et al.
D705925 May 2014 Murray
D749420 February 2016 Kahlau
D828011 September 2018 O'Brien
D846380 April 2019 Giraud
D848832 May 2019 Blomberg
D856798 August 2019 Giraud
D859142 September 2019 Giraud
D863951 October 2019 Knobel
D881691 April 2020 Knobel
D882113 April 2020 Motadel
D882393 April 2020 Chong
2004/0150221 August 2004 Brown
2004/0158231 August 2004 Tanghoj
2013/0153574 June 2013 Ward
2013/0292286 November 2013 Van Groningen
2016/0167844 June 2016 Wu
2017/0107365 April 2017 Rycroft et al.
2017/0175428 June 2017 Quinn et al.
2019/0021531 January 2019 Sims
Foreign Patent Documents
1085924 May 2003 EP
1278679 Jun 2007 EP
WO 2017/024106 Feb 2017 WO
Primary Examiner: Calve; Lauren R
Attorney, Agent or Firm: Cook Alex Ltd.

Description



FIG. 1 is a top, front perspective view of a flip cap package with chamfer according to the present design.

FIG. 2 is a bottom, right side perspective view thereof.

FIG. 3 is a front elevation view thereof.

FIG. 4 is a rear elevation view thereof.

FIG. 5 is a right side elevation view thereof.

FIG. 6 is a left side elevation view thereof.

FIG. 7 is a top plan view thereof.

FIG. 8 is a bottom plan view thereof.

FIG. 9 is a rear elevation view of a second embodiment of a flip cap package with chamfer showing the same portions of the package as the first embodiment except for the hinge in broken lines.

FIG. 10 is a right side elevation view of the embodiment of FIG. 9; and,

FIG. 11 is a left side elevation view of the embodiment of FIG. 9.

The broken lines shown represent portions of the claim that form no part of the claimed design.

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Patent Diagrams and Documents

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