U.S. patent number D895,076 [Application Number 35/506,451] was granted by the patent office on 2020-09-01 for composite seal member for semiconductor production apparatus.
This patent grant is currently assigned to Valqua, Ltd.. The grantee listed for this patent is Valqua, Ltd.. Invention is credited to Sangho Kim, Michi Kuroda.
United States Patent |
D895,076 |
Kuroda , et al. |
September 1, 2020 |
Composite seal member for semiconductor production apparatus
Claims
CLAIM The ornamental design for a composite seal member for
semiconductor production apparatus, as shown and described.
Inventors: |
Kuroda; Michi (Gojo,
JP), Kim; Sangho (Gojo, JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
Valqua, Ltd. |
Tokyo |
N/A |
JP |
|
|
Assignee: |
Valqua, Ltd. (Tokyo,
JP)
|
Appl.
No.: |
35/506,451 |
Filed: |
August 3, 2018 |
International Registration
Int'l Reg. No. |
Int'l Reg. Date |
Int'l Reg.
Publication Date |
Hague Int'l
Filing Date |
DM/102525 |
Aug 3, 2018 |
Feb 8, 2019 |
Aug 3, 2018 |
Foreign Application Priority Data
|
|
|
|
|
Feb 8, 2018 [JP] |
|
|
2018-002526 |
|
Current U.S.
Class: |
D23/269 |
Current International
Class: |
2301 |
Field of
Search: |
;D23/269 ;D8/382 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
|
|
|
|
|
|
|
D1612684 |
|
Sep 2017 |
|
JP |
|
D1589474 |
|
Oct 2017 |
|
JP |
|
D150427 |
|
Nov 2012 |
|
TW |
|
D163769 |
|
Oct 2014 |
|
TW |
|
D183446 |
|
Jun 2017 |
|
TW |
|
Primary Examiner: Pratt; Michael A.
Attorney, Agent or Firm: The Webb Law Firm
Description
1. Composite seal member for semiconductor production apparatus
1.1 : Perspective
1.2 : Front
1.3 : Back
1.4 : Left
1.5 : Right
1.6 : Top
1.7 : Bottom
1.8 : Cross-sectional
1.9 : Partial enlargement of cross-sectional view 1.8
1.10 : Reference
The present article is a composite seal member for semiconductor
production apparatuses, such as chemical vapor deposition
apparatuses and dry etching apparatuses; as illustrated in the
reproduction 1.10, the article is composed of a first component
formed of rubber occupying a major part of the article and a second
component formed of a synthetic resin, and is to be inserted into
the groove of a semiconductor production apparatus; the
semiconductor production apparatus itself forms no part of the
claimed design; the reproduction 1.8 shows a transverse
cross-sectional front view taken along the horizontal center of the
reproduction 1.6; and the reproduction 1.9 is an enlarged view
showing a left end portion of the cross-sectional view 1.8.
The broken lines shown in Reproduction 1.10 are for the purposes of
illustrating environmental structure and form no part of the
claimed design.
* * * * *