U.S. patent number D892,771 [Application Number D/696,187] was granted by the patent office on 2020-08-11 for earmuff for an in-ear headphone.
This patent grant is currently assigned to HUAWEI TECHNOLOGIES CO., LTD.. The grantee listed for this patent is HUAWEI TECHNOLOGIES CO., LTD.. Invention is credited to Shiyang Hong, En Pan, Xianchun Zhang, Zhifeng Zhao.
![](/patent/grant/D0892771/USD0892771-20200811-D00000.png)
![](/patent/grant/D0892771/USD0892771-20200811-D00001.png)
![](/patent/grant/D0892771/USD0892771-20200811-D00002.png)
![](/patent/grant/D0892771/USD0892771-20200811-D00003.png)
![](/patent/grant/D0892771/USD0892771-20200811-D00004.png)
![](/patent/grant/D0892771/USD0892771-20200811-D00005.png)
![](/patent/grant/D0892771/USD0892771-20200811-D00006.png)
![](/patent/grant/D0892771/USD0892771-20200811-D00007.png)
![](/patent/grant/D0892771/USD0892771-20200811-D00008.png)
![](/patent/grant/D0892771/USD0892771-20200811-D00009.png)
![](/patent/grant/D0892771/USD0892771-20200811-D00010.png)
United States Patent |
D892,771 |
Zhao , et al. |
August 11, 2020 |
Earmuff for an in-ear headphone
Claims
CLAIM The ornamental design of an earmuff for an in-ear headphone,
as shown and described.
Inventors: |
Zhao; Zhifeng (Shenzhen,
CN), Pan; En (Shenzhen, CN), Zhang;
Xianchun (Shenzhen, CN), Hong; Shiyang (Shenzhen,
CN) |
Applicant: |
Name |
City |
State |
Country |
Type |
HUAWEI TECHNOLOGIES CO., LTD. |
Shenzhen |
N/A |
CN |
|
|
Assignee: |
HUAWEI TECHNOLOGIES CO., LTD.
(Shenzhen, CN)
|
Appl.
No.: |
D/696,187 |
Filed: |
June 26, 2019 |
Foreign Application Priority Data
|
|
|
|
|
Dec 27, 2018 [CN] |
|
|
2018 3 0761451 |
|
Current U.S.
Class: |
D14/223;
D14/205 |
Current International
Class: |
1401 |
Field of
Search: |
;D14/223,205,206
;D24/174 ;128/864,865,866 ;181/129,130,135 ;379/430,431
;381/380,381,322-324,330 ;455/90.3,575,1,569.1 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Stofko; Katie Jane
Attorney, Agent or Firm: Kilpatrick Townsend & Stockton
LLP
Description
FIG. 1 is a front view of an earmuff for an in-ear headphone,
showing our new design;
FIG. 2 is a back view of the design thereof;
FIG. 3 is a top view of the design thereof;
FIG. 4 is a bottom view of the design thereof;
FIG. 5 is a left view of the design thereof;
FIG. 6 is a right view of the design thereof;
FIG. 7 is a front perspective view of the design thereof;
FIG. 8 is another front perspective view of the design thereof;
FIG. 9 is a back perspective view of the design thereof; and,
FIG. 10 is a front perspective view of the design thereof, shown in
an environment of use.
The claimed design includes only the earmuff and does not include
the headphone assembly of FIG. 10.
The broken lines form no part of the claimed design.
* * * * *