U.S. patent number D888,774 [Application Number D/678,183] was granted by the patent office on 2020-06-30 for fluid pressure cylinder.
This patent grant is currently assigned to SMC CORPORATION. The grantee listed for this patent is SMC Corporation. Invention is credited to Hiroyuki Asahara.
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United States Patent |
D888,774 |
Asahara |
June 30, 2020 |
Fluid pressure cylinder
Claims
CLAIM The ornamental design for a fluid pressure cylinder, as shown
and described.
Inventors: |
Asahara; Hiroyuki (Tsukuba,
JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
SMC Corporation |
Tsukubamirai-shi, Ibaraki |
N/A |
JP |
|
|
Assignee: |
SMC CORPORATION (Tokyo,
JP)
|
Appl.
No.: |
D/678,183 |
Filed: |
January 25, 2019 |
Foreign Application Priority Data
|
|
|
|
|
Aug 3, 2018 [JP] |
|
|
2018-017068 |
|
Current U.S.
Class: |
D15/7 |
Current International
Class: |
1502 |
Field of
Search: |
;D15/7-9
;D23/231,232,225 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
Primary Examiner: Siegel; Mitchell I.
Attorney, Agent or Firm: Birch, Stewart, Kolasch &
Birch, LLP
Description
FIG. 1 is a front, top and left side perspective view of a fluid
pressure cylinder showing my new design;
FIG. 2 is a rear, bottom and right side perspective view
thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a left side view thereof; and,
FIG. 8 is a right side view thereof.
The broken lines depict portions of the fluid pressure cylinder
that form no part of the claimed design.
* * * * *