U.S. patent number D883,495 [Application Number D/669,223] was granted by the patent office on 2020-05-05 for linear array ultrasonic probe.
This patent grant is currently assigned to EDAN INSTRUMENTS, INC.. The grantee listed for this patent is EDAN INSTRUMENTS, INC.. Invention is credited to Jiudong Cheng, Richard Henderson, Hua Luo, Jianhua Mo, Bo Ouyang, Dan Zhou.
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United States Patent |
D883,495 |
Cheng , et al. |
May 5, 2020 |
Linear array ultrasonic probe
Claims
CLAIM The ornamental design for a linear array ultrasonic probe, as
shown and described.
Inventors: |
Cheng; Jiudong (Shenzhen,
CN), Mo; Jianhua (Palo Alto, CA), Henderson;
Richard (Sunnyvale, CA), Ouyang; Bo (Shenzhen,
CN), Luo; Hua (Shenzhen, CN), Zhou; Dan
(Shenzhen, CN) |
Applicant: |
Name |
City |
State |
Country |
Type |
EDAN INSTRUMENTS, INC. |
Shenzhen |
N/A |
CN |
|
|
Assignee: |
EDAN INSTRUMENTS, INC.
(Shenzhen, CN)
|
Appl.
No.: |
D/669,223 |
Filed: |
November 6, 2018 |
Foreign Application Priority Data
|
|
|
|
|
May 10, 2018 [CN] |
|
|
2018 3 0210984 |
|
Current U.S.
Class: |
D24/187 |
Current International
Class: |
2401 |
Field of
Search: |
;D24/133,137,158,186,187
;D10/78 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Doan; Anhdao
Attorney, Agent or Firm: Loza & Loza, LLP Fedrick;
Michael F.
Description
FIG. 1 is a perspective view of the linear array ultrasonic probe
of the present invention;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof; and,
FIG. 7 is a bottom view thereof.
* * * * *