Linear array ultrasonic probe

Cheng , et al.

Patent Grant D883495

U.S. patent number D883,495 [Application Number D/669,223] was granted by the patent office on 2020-05-05 for linear array ultrasonic probe. This patent grant is currently assigned to EDAN INSTRUMENTS, INC.. The grantee listed for this patent is EDAN INSTRUMENTS, INC.. Invention is credited to Jiudong Cheng, Richard Henderson, Hua Luo, Jianhua Mo, Bo Ouyang, Dan Zhou.


United States Patent D883,495
Cheng ,   et al. May 5, 2020

Linear array ultrasonic probe

Claims

CLAIM The ornamental design for a linear array ultrasonic probe, as shown and described.
Inventors: Cheng; Jiudong (Shenzhen, CN), Mo; Jianhua (Palo Alto, CA), Henderson; Richard (Sunnyvale, CA), Ouyang; Bo (Shenzhen, CN), Luo; Hua (Shenzhen, CN), Zhou; Dan (Shenzhen, CN)
Applicant:
Name City State Country Type

EDAN INSTRUMENTS, INC.

Shenzhen

N/A

CN
Assignee: EDAN INSTRUMENTS, INC. (Shenzhen, CN)
Appl. No.: D/669,223
Filed: November 6, 2018

Foreign Application Priority Data

May 10, 2018 [CN] 2018 3 0210984
Current U.S. Class: D24/187
Current International Class: 2401
Field of Search: ;D24/133,137,158,186,187 ;D10/78

References Cited [Referenced By]

U.S. Patent Documents
D701965 April 2014 Matsumura
D703332 April 2014 Saeki
D703818 April 2014 Moon
D745972 December 2015 Kitayama
D749224 February 2016 Iritani
D831219 October 2018 Henderson
D861884 October 2019 Moon
D865973 November 2019 Chamberlain
Primary Examiner: Doan; Anhdao
Attorney, Agent or Firm: Loza & Loza, LLP Fedrick; Michael F.

Description



FIG. 1 is a perspective view of the linear array ultrasonic probe of the present invention;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

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Patent Diagrams and Documents

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