U.S. patent number D874,463 [Application Number D/646,730] was granted by the patent office on 2020-02-04 for wireless ic tag.
This patent grant is currently assigned to SECURITAG ASSEMBLY GROUP CO., LTD., TODA KOGYO CORP.. The grantee listed for this patent is SECURITAG ASSEMBLY GROUP CO., LTD., TODA KOGYO CORP.. Invention is credited to Mark Chang, Jun Koujima, Yoshiteru Kouno, Peter Yan.
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United States Patent |
D874,463 |
Koujima , et al. |
February 4, 2020 |
Wireless IC tag
Claims
CLAIM The ornamental design for a wireless IC tag, as shown and
described.
Inventors: |
Koujima; Jun (Hiroshima,
JP), Chang; Mark (Taichung, TW), Kouno;
Yoshiteru (Hiroshima, JP), Yan; Peter (Taichung,
TW) |
Applicant: |
Name |
City |
State |
Country |
Type |
TODA KOGYO CORP.
SECURITAG ASSEMBLY GROUP CO., LTD. |
Hiroshima
Taichung |
N/A
N/A |
JP
TW |
|
|
Assignee: |
TODA KOGYO CORP. (Hiroshima,
JP)
SECURITAG ASSEMBLY GROUP CO., LTD. (Taichung,
TW)
|
Appl.
No.: |
D/646,730 |
Filed: |
May 7, 2018 |
Foreign Application Priority Data
|
|
|
|
|
Nov 7, 2017 [JP] |
|
|
2017-024866 |
Nov 7, 2017 [JP] |
|
|
2017-024867 |
Nov 7, 2017 [JP] |
|
|
2017-024868 |
Nov 7, 2017 [JP] |
|
|
2017-024869 |
Nov 7, 2017 [JP] |
|
|
2017-024870 |
Nov 7, 2017 [JP] |
|
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2017-024871 |
Nov 7, 2017 [JP] |
|
|
2017-024872 |
Nov 7, 2017 [JP] |
|
|
2017-024873 |
|
Current U.S.
Class: |
D14/437 |
Current International
Class: |
1402 |
Field of
Search: |
;D16/202,203,214,215
;D10/70,97,103,104.1,104.2,106.1-106.95,108,121,123,124,125,126,132
;D14/435,437 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Kirschbaum; George D.
Assistant Examiner: Kukella; Joseph J
Attorney, Agent or Firm: Knobbe, Martens, Olson & Bear,
LLP
Description
FIG. 1 is a front elevational view of a first embodiment of a
wireless IC tag according to our new design. A rear elevational
view thereof is a mirror-image of the front elevational view.
FIG. 2 is a right side elevational view thereof.
FIG. 3 is a left side elevational view thereof.
FIG. 4 is a top plan view thereof.
FIG. 5 is a cross-sectional view thereof, taken in the direction of
line 5-5 in FIG. 4.
FIG. 6 is a bottom plan view thereof.
FIG. 7 is a perspective view thereof.
FIG. 8 is a front elevational view of a second embodiment of a
wireless IC tag according to our new design. A rear elevational
view thereof is a mirror-image of the front elevational view.
FIG. 9 is a right side elevational view thereof.
FIG. 10 is a left side elevational view thereof.
FIG. 11 is a top plan view thereof.
FIG. 12 is a cross-sectional view thereof, taken in the direction
of line 12-12 in FIG. 11.
FIG. 13 is a bottom plan view thereof; and,
FIG. 14 is a perspective view thereof.
The broken lines shown in FIG. 4, and FIG. 11 indicate planes upon
which the sectional views in FIG. 5, and FIG. 12, respectively, are
taken and form no part of the claimed design.
* * * * *