U.S. patent number D849,712 [Application Number D/599,052] was granted by the patent office on 2019-05-28 for headphone.
This patent grant is currently assigned to AKG Acoustics GmbH. The grantee listed for this patent is AKG Acoustics GmbH. Invention is credited to Patrice Billaudet, Tibor Pataky, Berthold Pavitsich.
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United States Patent |
D849,712 |
Billaudet , et al. |
May 28, 2019 |
Headphone
Claims
CLAIM The ornamental design for a headphone, as shown and
described.
Inventors: |
Billaudet; Patrice (Vienna,
AT), Pavitsich; Berthold (Mullendorf, AT),
Pataky; Tibor (Staatsburgerschaft, AT) |
Applicant: |
Name |
City |
State |
Country |
Type |
AKG Acoustics GmbH |
Vienna |
N/A |
AT |
|
|
Assignee: |
AKG Acoustics GmbH (Vienna,
AT)
|
Appl.
No.: |
D/599,052 |
Filed: |
March 30, 2017 |
Current U.S.
Class: |
D14/205 |
Current International
Class: |
1401 |
Field of
Search: |
;D14/205 ;D29/112 ;2/209
;181/129,130,135 ;379/430,431 ;381/380,381,374,74
;455/90.3,575.1,569.1 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Greene; Paula Allen
Attorney, Agent or Firm: Plumsea Law Group, LLC
Description
FIG. 1 is a perspective view of a headphone showing the new
design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a side elevational view of one side thereof;
FIG. 5 is a side elevational view of the opposite side thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a perspective view thereof, shown in a folded
configuration;
FIG. 9 is a perspective view of a second embodiment of a headphone
showing the new design;
FIG. 10 is a front elevational view thereof;
FIG. 11 is a rear elevational view thereof;
FIG. 12 is a side elevational view of one side thereof;
FIG. 13 is a side elevational view of the opposite side
thereof;
FIG. 14 is a top plan view thereof;
FIG. 15 is a bottom plan view thereof;
FIG. 16 is a perspective view thereof, shown in a folded
configuration;
FIG. 17 is a perspective view of a third embodiment of a headphone
showing the new design;
FIG. 18 is a front elevational view thereof;
FIG. 19 is a rear elevational view thereof;
FIG. 20 is a side elevational view of one side thereof;
FIG. 21 is a side elevational view of the opposite side
thereof;
FIG. 22 is a top plan view thereof;
FIG. 23 is a bottom plan view thereof; and,
FIG. 24 is a perspective view thereof, shown in a folded
configuration.
The broken lines and unshaded areas form no part of the claimed
design.
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