U.S. patent number D833,734 [Application Number D/618,649] was granted by the patent office on 2018-11-20 for package.
This patent grant is currently assigned to Smith & Nephew PLC. The grantee listed for this patent is Smith & Nephew PLC. Invention is credited to Ian Binder, John Cowan-Hughes, Beverly Love, Mark Russell, Peter Sleight, Philip Walsh.
United States Patent |
D833,734 |
Binder , et al. |
November 20, 2018 |
Package
Claims
CLAIM The ornamental design for a package, as shown and described.
Inventors: |
Binder; Ian (Chippenham,
GB), Cowan-Hughes; John (Bristol, GB),
Love; Beverly (Hessle, GB), Russell; Mark (Hull,
GB), Sleight; Peter (Cottingham, GB),
Walsh; Philip (Bristol, GB) |
Applicant: |
Name |
City |
State |
Country |
Type |
Smith & Nephew PLC |
London |
N/A |
GB |
|
|
Assignee: |
Smith & Nephew PLC (London,
GB)
|
Appl.
No.: |
D/618,649 |
Filed: |
September 22, 2017 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
|
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29584531 |
Nov 15, 2016 |
D798040 |
|
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|
29563987 |
Nov 29, 2016 |
D772559 |
|
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29492878 |
Jun 14, 2016 |
D758851 |
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Current U.S.
Class: |
D3/203.6;
D9/432 |
Current International
Class: |
0301 |
Field of
Search: |
;D9/414,420-423,432,456,721 ;D3/203.1,203.6,203.7,203.8 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
Other References
Packaging for Pico Single Use Negative Pressure Wound Therapy
System (2012) in 1 page. cited by applicant .
Protz, Kerstin: "Modern Wundauflagen unterstutzen Heilungsprozess",
Wundversorgung: Indikation und Anwendung, Geriatrie Journal 4/05,
pp. 3333-3339. cited by applicant .
Smith & Nephew, "PICO packaging reduction", Jun. 2014,
http://www.smith-nephew.com/news-and-media/case-studies/picosntm-packagin-
g-reduction/. cited by applicant.
|
Primary Examiner: Simmons; Ian
Assistant Examiner: Frank; Keith
Attorney, Agent or Firm: Knobbe, Martens, Olson & Bear,
LLP
Description
FIG. 1 is a top, front, and left side perspective view of a package
showing my new design in a closed configuration;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a rear elevation view thereof;
FIG. 4 is a right side elevation view thereof;
FIG. 5 is a left side elevation view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a top, front, and left side perspective view of the
package of FIG. 1 in a partially open configuration;
FIG. 9 is a front elevation view of the package of FIG. 1 in a
fully open configuration;
FIG. 10 is a rear elevation view thereof;
FIG. 11 is a right side elevation view thereof;
FIG. 12 is a left side elevation view of the package of FIG. 1 in a
fully open configuration.
FIG. 13 is a top plan view thereof; and,
FIG. 14 is a bottom plan view thereof.
The broken lines in the drawings depict unclaimed subject matter
and form no part of the claimed design.
* * * * *
References