Package for a writing instrument
Zavada , et al. October 9, 2
U.S. patent number D830,167 [Application Number D/554,490] was granted by the patent office on 2018-10-09 for package for a writing instrument. This patent grant is currently assigned to Sanford, L.P.. The grantee listed for this patent is Sanford, L.P.. Invention is credited to Daniel Debartolo, Ejung Kim, Stefaan Van Den Broecke, Mark Zavada.
| United States Patent | D830,167 |
| Zavada , et al. | October 9, 2018 |
Package for a writing instrument
Claims
CLAIM The ornamental design for a "package for a writing instrument," as shown and described.
| Inventors: | Zavada; Mark (Kalamazoo, MI), Van Den Broecke; Stefaan (Kalamazoo, MI), Kim; Ejung (Kalamazoo, MI), Debartolo; Daniel (Chicago, IL) | ||||||||||
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| Applicant: |
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| Assignee: | Sanford, L.P. (Atlanta,
GA) |
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| Appl. No.: | D/554,490 | ||||||||||
| Filed: | February 11, 2016 |
| Current U.S. Class: | D9/421 |
| Current International Class: | 0903 |
| Field of Search: | ;D9/421,414-418,423,761,424,721,425,435,456,431,432 ;D28/8.1 ;D3/276,273,274,282,905,206 ;D27/189 ;D24/121 ;206/427,461 |
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Attorney, Agent or Firm: Eversheds Sutherland (US) LLP
Description
FIG. 1 is a perspective view of a package for a writing instrument showing a new design;
FIG. 2 is a front view thereof;
FIG. 3 is a back view thereof;
FIG. 4 is a left view thereof;
FIG. 5 is a right view thereof;
FIG. 6 is a top view thereof; and,
FIG. 7 is a bottom view thereof.
In the drawings, the broken lines are for the purpose of illustrating environment only and form no part of the claimed design.
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