Enclosure for main unit of voltage, current, or temperature sensor

Elrod , et al. May 1, 2

Patent Grant D816520

U.S. patent number D816,520 [Application Number D/597,622] was granted by the patent office on 2018-05-01 for enclosure for main unit of voltage, current, or temperature sensor. This patent grant is currently assigned to Fluke Electronics Corporation. The grantee listed for this patent is Fluke Electronics Corporation. Invention is credited to Jeffrey M. Elrod, Duncan N. Kearsley, Christopher W. Lagerberg.


United States Patent D816,520
Elrod ,   et al. May 1, 2018

Enclosure for main unit of voltage, current, or temperature sensor

Claims

CLAIM The ornamental design for an enclosure for a main unit of a voltage, current, or temperature sensor, as shown and described.
Inventors: Elrod; Jeffrey M. (Seattle, WA), Lagerberg; Christopher W. (Everett, WA), Kearsley; Duncan N. (Everett, WA)
Applicant:
Name City State Country Type

Fluke Electronics Corporation

Everett

WA

US
Assignee: Fluke Electronics Corporation (Everett, WA)
Appl. No.: D/597,622
Filed: March 17, 2017

Current U.S. Class: D10/52; D10/53
Current International Class: 1004
Field of Search: ;D10/49,50,52,53,55,56,60,104.1,106.6 ;D13/168,184 ;D14/218

References Cited [Referenced By]

U.S. Patent Documents
D527666 September 2006 Tal
D595262 June 2009 Nousiainen
D609221 February 2010 Kim
D674786 January 2013 Park
D686925 July 2013 Gerold
D712381 September 2014 Hwang
D717183 November 2014 Herzl
D731793 June 2015 Houghton
9046414 June 2015 Fadell
D766214 September 2016 Mackiewicz
D766749 September 2016 Fadell
D782354 March 2017 Lovin
D783423 April 2017 Srnec
9791839 October 2017 Matsuoka
2011/0005057 January 2011 Rosenblatt
2017/0016773 January 2017 Arai
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Seed IP Law Group LLP

Description



FIG. 1 is a top front right perspective view of an enclosure for a main unit of a voltage, current, or temperature sensor showing our new design.

FIG. 2 is a bottom rear left perspective view thereof.

FIG. 3 is a front elevation view thereof.

FIG. 4 is a right side elevation view thereof.

FIG. 5 is a left side elevation view thereof.

FIG. 6 is a top plan view thereof.

FIG. 7 is a bottom plan view thereof.

FIG. 8 is a rear elevation view thereof.

FIG. 9 is a top front right perspective view of another embodiment of an enclosure for a main unit of a voltage, current, or temperature sensor showing our new design.

FIG. 10 is a bottom rear left perspective view thereof.

FIG. 11 is a front elevation view thereof.

FIG. 12 is a right side elevation view thereof.

FIG. 13 is a left side elevation view thereof.

FIG. 14 is a top plan view thereof.

FIG. 15 is a bottom plan view thereof.

FIG. 16 is a rear elevation view thereof.

FIG. 17 is a top front right perspective view of another embodiment of an enclosure for a main unit of a voltage, current, or temperature sensor showing our new design.

FIG. 18 is a bottom rear left perspective view thereof.

FIG. 19 is a front elevation view thereof.

FIG. 20 is a right side elevation view thereof.

FIG. 21 is a left side elevation view thereof.

FIG. 22 is a top plan view thereof.

FIG. 23 is a bottom plan view thereof; and,

FIG. 24 is a rear elevation view thereof.

The broken lines in the figures illustrate environment only and form no part of the claimed design.

* * * * *


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