U.S. patent number D810,020 [Application Number D/533,606] was granted by the patent office on 2018-02-13 for molded coil. This patent grant is currently assigned to I & P CO., LTD., NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, SUMITOMO SEIKA CHEMICALS CO., LTD.. The grantee listed for this patent is I&P CO., LTD., NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, SUMITOMO SEIKA CHEMICALS CO., LTD.. Invention is credited to Takeo Ebina, Satomi Hattori, Noriyuki Hayashizaka, Takahiro Ishida, Daisuke Mishou, Tomoyuki Yamaguchi.
United States Patent | D810,020 |
Hayashizaka , et al. | February 13, 2018 |
Inventors: | Hayashizaka; Noriyuki (Hyogo, JP), Mishou; Daisuke (Hyogo, JP), Ebina; Takeo (Sendai, JP), Hattori; Satomi (Fukuroi, JP), Ishida; Takahiro (Fukuroi, JP), Yamaguchi; Tomoyuki (Higashimatsuyama, JP) | ||||||||||
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Applicant: |
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Assignee: | SUMITOMO SEIKA CHEMICALS CO.,
LTD. (Kako-gun, Hyogo, JP) NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (Tokyo, JP) I & P CO., LTD. (Higashimatsuyama-shi, Saitama, JP) |
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Appl. No.: | D/533,606 | ||||||||||
Filed: | July 20, 2015 |
Jan 21, 2015 [JP] | 2015-001014 | |||
Jan 21, 2015 [JP] | 2015-001015 | |||
Jan 21, 2015 [JP] | 2015-001016 | |||
Jan 21, 2015 [JP] | 2015-001017 | |||
Apr 16, 2015 [JP] | 2015-008668 | |||
Jun 8, 2015 [JP] | 2015-012650 | |||
Jun 8, 2015 [JP] | 2015-012651 | |||
Current U.S. Class: | D13/117 |
Current International Class: | 1302 |
Field of Search: | ;D13/113,117,122,118,182,183,199 ;242/160.1,160.4,360 ;335/13,134,136,213,282 ;336/15,69,70,139,174,198 |
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Communication dated Oct. 24, 2016 from the U.S. Patent and Trademark Office in U.S. Appl. No. 29/533,609. cited by applicant. |
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