Array of triangular semiconductor dies

Sharma , et al. November 21, 2

Patent Grant D803171

U.S. patent number D803,171 [Application Number D/539,504] was granted by the patent office on 2017-11-21 for array of triangular semiconductor dies. This patent grant is currently assigned to Soraa, Inc.. The grantee listed for this patent is SORAA, INC.. Invention is credited to Andrew Felker, William D. Houck, Rajat Sharma.


United States Patent D803,171
Sharma ,   et al. November 21, 2017

Array of triangular semiconductor dies

Claims

CLAIM The ornamental design for an array of triangular semiconductor dies, as shown and described.
Inventors: Sharma; Rajat (Fremont, CA), Felker; Andrew (Fremont, CA), Houck; William D. (Fremont, CA)
Applicant:
Name City State Country Type

SORAA, INC.

Fremont

CA

US
Assignee: Soraa, Inc. (Freemont, CA)
Appl. No.: D/539,504
Filed: September 15, 2015

Related U.S. Patent Documents

Application Number Filing Date Patent Number Issue Date
29441116 Dec 31, 2012 D739363
13357578 Jan 24, 2012 9450143
13163482 Oct 23, 2012 8293551

Current U.S. Class: D13/182
Current International Class: 1303
Field of Search: ;D13/110,182,184 ;361/679.01,728,761,820,718,748,752,783 ;257/668,678,684 ;324/71.5,252 ;29/825,829,830,831,832,846 ;174/68.1,250-261,268 ;216/13 ;428/901

References Cited [Referenced By]

U.S. Patent Documents
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3035657 May 1962 Lemon
3482760 December 1969 Boehm
4537001 August 1985 Uppstrom
4555114 November 1985 Dozier
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5105906 April 1992 Wegner
D353642 December 1994 Callaghan
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D416442 November 1999 Gilchrist
D421967 March 2000 Oba
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D478622 August 2003 Grayson
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D562385 February 2008 Camillo
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D570410 June 2008 Moro
D574339 August 2008 Honjo
D580566 November 2008 Mukai
D586454 February 2009 Nishio
D591172 April 2009 Keberlein
D591618 May 2009 Keberlein
D598429 August 2009 Nakatani
D599077 September 2009 Garcia Aleman
D617554 June 2010 Raile
D618415 June 2010 Greseth
D622256 August 2010 Lockenwitz
D628218 November 2010 Tommassini
D635622 April 2011 Martin
D638683 May 2011 Igeta
D681421 May 2013 Bucci
D683214 May 2013 McAdam
D684546 June 2013 Kuzuoka
D698927 February 2014 Caprio
D739363 September 2015 Sharma
2006/0246268 November 2006 Honjo
Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Saul Ewing Arnstein & Lehr LLP

Description



FIG 1 is a first embodiment of a top plan view of an array of triangular semiconductor dies showing our new design;

FIG. 2 is a front perspective view thereof;

FIG. 3 is a rear perspective view thereof;

FIG. 4 is a second embodiment of a top plan view of an array of triangular semiconductor dies showing our new design;

FIG. 5 is a front perspective view thereof;

FIG. 6 is a rear perspective view thereof;

FIG. 7 is a third embodiment of a top plan view of an array of triangular semiconductor dies showing our new design;

FIG. 8 is a front perspective view thereof;

FIG. 9 is a rear perspective view thereof;

FIG. 10 is a fourth embodiment of a top plan view of an array of triangular semiconductor dies showing our new design;

FIG. 11 is a front perspective view thereof;

FIG. 12 is a rear perspective view thereof;

FIG. 13 is a fifth embodiment of a top plan view of an array of triangular semiconductor dies showing our new design;

FIG. 14 is a front perspective view thereof; and,

FIG. 15 is a rear perspective view thereof.

The broken lines in the figures represent unclaimed subject matter and form no part of the claimed design. The separations between the top and bottom layers of the triangle and the brackets around the space indicate that no particular length is claimed.

* * * * *


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