U.S. patent number D803,171 [Application Number D/539,504] was granted by the patent office on 2017-11-21 for array of triangular semiconductor dies.
This patent grant is currently assigned to Soraa, Inc.. The grantee listed for this patent is SORAA, INC.. Invention is credited to Andrew Felker, William D. Houck, Rajat Sharma.
United States Patent |
D803,171 |
Sharma , et al. |
November 21, 2017 |
Array of triangular semiconductor dies
Claims
CLAIM The ornamental design for an array of triangular
semiconductor dies, as shown and described.
Inventors: |
Sharma; Rajat (Fremont, CA),
Felker; Andrew (Fremont, CA), Houck; William D.
(Fremont, CA) |
Applicant: |
Name |
City |
State |
Country |
Type |
SORAA, INC. |
Fremont |
CA |
US |
|
|
Assignee: |
Soraa, Inc. (Freemont,
CA)
|
Appl.
No.: |
D/539,504 |
Filed: |
September 15, 2015 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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29441116 |
Dec 31, 2012 |
D739363 |
|
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13357578 |
Jan 24, 2012 |
9450143 |
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13163482 |
Oct 23, 2012 |
8293551 |
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Current U.S.
Class: |
D13/182 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/110,182,184
;361/679.01,728,761,820,718,748,752,783 ;257/668,678,684
;324/71.5,252 ;29/825,829,830,831,832,846 ;174/68.1,250-261,268
;216/13 ;428/901 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Saul Ewing Arnstein & Lehr
LLP
Description
FIG 1 is a first embodiment of a top plan view of an array of
triangular semiconductor dies showing our new design;
FIG. 2 is a front perspective view thereof;
FIG. 3 is a rear perspective view thereof;
FIG. 4 is a second embodiment of a top plan view of an array of
triangular semiconductor dies showing our new design;
FIG. 5 is a front perspective view thereof;
FIG. 6 is a rear perspective view thereof;
FIG. 7 is a third embodiment of a top plan view of an array of
triangular semiconductor dies showing our new design;
FIG. 8 is a front perspective view thereof;
FIG. 9 is a rear perspective view thereof;
FIG. 10 is a fourth embodiment of a top plan view of an array of
triangular semiconductor dies showing our new design;
FIG. 11 is a front perspective view thereof;
FIG. 12 is a rear perspective view thereof;
FIG. 13 is a fifth embodiment of a top plan view of an array of
triangular semiconductor dies showing our new design;
FIG. 14 is a front perspective view thereof; and,
FIG. 15 is a rear perspective view thereof.
The broken lines in the figures represent unclaimed subject matter
and form no part of the claimed design. The separations between the
top and bottom layers of the triangle and the brackets around the
space indicate that no particular length is claimed.
* * * * *