Cooling device for an electronic component heat sink
Anzai , et al. October 3, 2
U.S. patent number D798,831 [Application Number D/566,047] was granted by the patent office on 2017-10-03 for cooling device for an electronic component heat sink. This patent grant is currently assigned to NIPPON LIGHT METAL COMPANY, LTD. The grantee listed for this patent is NIPPON LIGHT METAL COMPANY, LTD.. Invention is credited to Eiji Anzai, Takumi Nakamura.
| United States Patent | D798,831 |
| Anzai , et al. | October 3, 2017 |
Cooling device for an electronic component heat sink
Claims
CLAIM The ornamental design for a cooling device for an electronic component heat sink, as shown and described.
| Inventors: | Anzai; Eiji (Shizuoka, JP), Nakamura; Takumi (Shizuoka, JP) | ||||||||||
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| Applicant: |
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| Assignee: | NIPPON LIGHT METAL COMPANY, LTD
(Tokyo, JP) |
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| Appl. No.: | D/566,047 | ||||||||||
| Filed: | May 26, 2016 |
Foreign Application Priority Data
| Dec 4, 2015 [JP] | 2015-027271 | |||
| Current U.S. Class: | D13/179 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/179,122,182 ;D23/415,330 |
References Cited [Referenced By]
U.S. Patent Documents
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| 2016/0341488 | November 2016 | Wan |
| 2017/0055370 | February 2017 | Tsai |
Assistant Examiner: Rivas; April
Attorney, Agent or Firm: Oliff PLC
Description
FIG. 1 is a front, bottom, left-side perspective view of a cooling device for an electronic component heat sink showing our new design, the front, top, left-side being a mirror image thereof;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a right-side elevational view thereof;
FIG. 5 is a left-side elevational view thereof;
FIG. 6 is an enlarged view of an area shown in a dashed line box labeled "6" in FIG. 2; and,
FIG. 7 is an enlarged view of an area shown in a dashed line box labeled "7" in FIG. 3.
The dashed line boxes identify areas that are enlarged, and form no part of the claimed design.
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