Heat insulating unit for substrate processing apparatus

Description

FIG. 1 is a front and top perspective view of a heat insulating unit for substrate processing apparatus showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view.

Claims

CLAIM We claim the ornamental design for a heat insulating unit for substrate processing apparatus, as shown (and described).

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Inventors:	Tateno; Hideto (Toyama, JP), Hara; Daisuke (Toyama, JP)
Applicant:	Name City State Country Type Hitachi Kokusai Electric Inc. Chiyoda-ku, Tokyo N/A JP
Assignee:	Hitachi Kokusai Electric Inc. (Tokyo, JP)
Appl. No.:	D/555,039
Filed:	February 18, 2016

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Foreign Application Priority Data

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Aug 21, 2015 [JP]			2015-018405

Current U.S. Class:	D13/129; D13/184
Current International Class:	1303
Field of Search:	;D13/118,129,182,179,133,154,184 ;D15/5,127,128,140 ;76/107.1

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References Cited [Referenced By]

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U.S. Patent Documents

D440138	April 2001	Campbell
D599386	September 2009	Moellering
D613245	April 2010	Honna
D654211	February 2012	Melzner
D670247	November 2012	Savill, Jr.
D703238	April 2014	Ueno
D709323	July 2014	Brown
9082694	July 2015	Saido
9134052	September 2015	Kuo
D758317	June 2016	Plassiard
D766833	September 2016	Plassiard

Primary Examiner: Bui; Daniel
Assistant Examiner: Kerr; Andrew
Attorney, Agent or Firm: Fitch, Even, Tabin & Flanney, LLP