U.S. patent number D784,341 [Application Number D/551,135] was granted by the patent office on 2017-04-18 for connection module.
This patent grant is currently assigned to Telit Communications S.p.A.. The grantee listed for this patent is Telit Communications S.P.A.. Invention is credited to SeongWhan Kim, Taehyoung Ko.
United States Patent |
D784,341 |
Kim , et al. |
April 18, 2017 |
Connection module
Claims
CLAIM The ornamental design for a connection module, as shown and
described.
Inventors: |
Kim; SeongWhan (Seoul,
KR), Ko; Taehyoung (Seoul, KR) |
Applicant: |
Name |
City |
State |
Country |
Type |
Telit Communications S.P.A. |
Sgonico (Trieste) |
N/A |
IT |
|
|
Assignee: |
Telit Communications S.p.A.
(Sgonico (Trieste), IT)
|
Appl.
No.: |
D/551,135 |
Filed: |
January 11, 2016 |
Current U.S.
Class: |
D14/433 |
Current International
Class: |
1402 |
Field of
Search: |
;D14/356,432-434,453,454,511,203.8,209.1,238.1,240,125
;439/638,928,105,502 ;710/303,304 ;361/679.41,679.55,679.56
;D13/110,133,146 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Murphy; Austin
Attorney, Agent or Firm: Pearl Cohen Zedek Latzer Baratz
LLP
Description
FIG. 1 is a top, front, left side perspective of the connection
module;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a front elevation view thereof;
FIG. 5 is a back elevation view thereof;
FIG. 6 is a right side elevation view thereof;
FIG. 7 is a left side elevation view thereof; and,
FIG. 8 is a bottom, front, right side perspective view thereof.
The broken lines that appear on the drawings form no part of the
claimed design and are included for illustrative purposes only.
* * * * *