Wafer support ring
Kirkland April 11, 2
U.S. patent number D783,922 [Application Number D/511,213] was granted by the patent office on 2017-04-11 for wafer support ring. This patent grant is currently assigned to Entegris, Inc.. The grantee listed for this patent is ENTEGRIS, INC.. Invention is credited to Eric A. Kirkland.
| United States Patent | D783,922 |
| Kirkland | April 11, 2017 |
Wafer support ring
Claims
CLAIM I claim the ornamental design for wafer support ring, as shown and described.
| Inventors: | Kirkland; Eric A. (Colorado Springs, CO) | ||||||||||
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| Applicant: |
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| Assignee: | Entegris, Inc. (Billerica,
MA) |
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| Appl. No.: | D/511,213 | ||||||||||
| Filed: | December 8, 2014 |
| Current U.S. Class: | D34/29 |
| Current International Class: | 1205 |
| Field of Search: | ;D34/28,29 ;198/851,853,825,890.1,370.1,370.04,782,722,771,866,367,790 ;193/35A,35C ;414/744.5,800 ;D23/269 |
References Cited [Referenced By]
U.S. Patent Documents
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| 8016542 | September 2011 | Cox |
| D646764 | October 2011 | Rusconi |
| D655401 | March 2012 | Muramatsu |
| D667601 | September 2012 | Fitzpatrick |
| D723239 | February 2015 | Raschke |
| D743513 | November 2015 | Yamagishi |
| D754308 | April 2016 | Nakagawa |
| D1184862 | Sep 2003 | JP | |||
| D1358895 | May 2009 | JP | |||
| D1362609 | Jun 2009 | JP | |||
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| D1397981 | Oct 2010 | JP | |||
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| D149672 | Oct 2012 | TW | |||
| D160525 | May 2014 | TW | |||
Attorney, Agent or Firm: Entegris, Inc.
Description
FIG. 1 is a top perspective view of a wafer support ring showing my new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a side view thereof; and,
FIG. 6 is a partial perspective cross-sectional view thereof.
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