Earbud assembly

Morris , et al. March 21, 2

Patent Grant D781822

U.S. patent number D781,822 [Application Number D/550,138] was granted by the patent office on 2017-03-21 for earbud assembly. This patent grant is currently assigned to Oculus VR, LLC. The grantee listed for this patent is Oculus VR, LLC. Invention is credited to Mark Shintaro Ando, Peter Wesley Bristol, Quintin Morris, David Tao, James Stocker Webb.


United States Patent D781,822
Morris ,   et al. March 21, 2017

Earbud assembly

Claims

CLAIM The ornamental design for a earbud assembly, as shown and described.
Inventors: Morris; Quintin (Issaquah, WA), Webb; James Stocker (Seattle, WA), Ando; Mark Shintaro (Seattle, WA), Bristol; Peter Wesley (Seattle, WA), Tao; David (Santa Clara, CA)
Applicant:
Name City State Country Type

Oculus VR, LLC

Menlo Park

CA

US
Assignee: Oculus VR, LLC (Menlo Park, CA)
Appl. No.: D/550,138
Filed: December 30, 2015

Current U.S. Class: D14/223
Current International Class: 1401
Field of Search: ;D14/223,205 ;D24/174 ;D29/112 ;2/209 ;181/129,130,135 ;379/430,431,452,421 ;381/380,381,330,322,315,324,328,312,338

References Cited [Referenced By]

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Other References

US. Appl. No. 29/550,170 by Bristol, P., et al., filed Dec. 30, 2015. cited by applicant .
Examiner's Report in Canadian Patent Application No. 166908, mailing date May 14, 2016, 2 pages. cited by applicant .
Examiner's Report in Canadian Patent Application No. 166908, mailing date Sep. 15, 2016, 2 pages. cited by applicant .
First Examination Report in Indian Patent Application No. 281598, mailing date Jun. 28, 2016, 45 pages. cited by applicant .
First Examination Report in Israeli Patent Application No. 58463, mailing date Aug. 11, 2016, 2 pages. cited by applicant .
U.S. Appl. No. 29/550,149 by Morris, Q., et al., filed Dec. 30, 2015. cited by applicant .
U.S. Appl. No. 29/550,158 by Bristol, P., et al., filed Dec. 30, 2015. cited by applicant.

Primary Examiner: Greene; Paula
Attorney, Agent or Firm: Perkins Coie LLP

Description



FIG. 1 is a front isometric view of a left earbud assembly showing our new design;

FIG. 2 is a front elevation view thereof.

FIG. 3 is a rear elevation view thereof.

FIG. 4 is a left side elevation view thereof.

FIG. 5 is a right side elevation view thereof.

FIG. 6 is a top plan view thereof.

FIG. 7 is a bottom plan view thereof.

FIG. 8 is a front isometric view of a right earbud assembly showing our new design;

FIG. 9 is a front elevation view thereof.

FIG. 10 is a rear elevation view thereof.

FIG. 11 is a left side elevation view thereof.

FIG. 12 is a right side elevation view thereof.

FIG. 13 is a top plan view thereof; and,

FIG. 14 is a bottom plan view thereof.

* * * * *


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