U.S. patent number D775,542 [Application Number D/528,113] was granted by the patent office on 2017-01-03 for sensor module.
This patent grant is currently assigned to SAMSUNG ELECTRONICS CO., LTD.. The grantee listed for this patent is Samsung Electronics Co., Ltd.. Invention is credited to Lindsay Brown, Joseph J Kopp, Jr., Seulki Lee, Frank Nuovo, Sheldon George Phillips, Tom Torfs, Eva C. Wentink.
United States Patent |
D775,542 |
Phillips , et al. |
January 3, 2017 |
Sensor module
Claims
CLAIM The ornamental design for a sensor module, as shown and
described.
Inventors: |
Phillips; Sheldon George
(Glendale, CA), Nuovo; Frank (Los Angeles, CA), Kopp,
Jr.; Joseph J (Fairfield, CA), Torfs; Tom (Kraainem,
BE), Brown; Lindsay (Mierlo, NL), Lee;
Seulki (Eindhoven, NL), Wentink; Eva C.
(Eindhoven, NL) |
Applicant: |
Name |
City |
State |
Country |
Type |
Samsung Electronics Co., Ltd. |
Suwon-si |
N/A |
KR |
|
|
Assignee: |
SAMSUNG ELECTRONICS CO., LTD.
(Suwon-Si, KR)
|
Appl.
No.: |
D/528,113 |
Filed: |
May 26, 2015 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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29491648 |
May 22, 2014 |
D730219 |
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Current U.S.
Class: |
D10/103;
D11/3 |
Current International
Class: |
1004 |
Field of
Search: |
;D10/30-39,65,70,78,97,98,103 ;D11/3 ;D13/173-177
;D14/138R,203.5,247,338-340,344,346,347 ;D24/167,168 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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2013022911 |
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Feb 2013 |
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WO |
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2013148753 |
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Oct 2013 |
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WO |
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2014039567 |
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Mar 2014 |
|
WO |
|
Other References
Devices Worn on the Wrist, Vandrico Inc,
http://vandrico.com/device-categories/location/wrist (pp. 1-14)
(accessed Nov. 14, 2014). cited by applicant .
Devices Used for Lifestyle, Vandrico Inc.,
http://vandrico.com/device-categories/application/lifestyle (pp.
1-22) (accessed Nov. 14, 2014). cited by applicant .
Yoo, Jerald, et al., A 5.2 mW Self-Configured Wearable Body Sensor
Network Controller and a 12.mu.W Wirelessly Powered Sensor for a
Continuous Health Monitoring System, IEEE Journal of Solid-State
Circuits, vol. 45, No. 1, (pp. 178-188), Jan. 2010. cited by
applicant.
|
Primary Examiner: Davis; Antoine D
Attorney, Agent or Firm: McAndrews Held & Malloy,
Ltd.
Description
FIG. 1 is a top left front perspective view of a sensor module
showing our new design;
FIG. 2 is a rear elevation view thereof;
FIG. 3 is a front elevation view thereof;
FIG. 4 is a right side elevation view thereof;
FIG. 5 is a left side elevation view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a bottom right rear perspective view thereof.
The even length dashed broken lines illustrate portions of the
sensor module that form no part of the claimed design.
Any views of the sensor module that are not shown in the figures
form no part of the claimed design.
* * * * *
References