Sensor module

Phillips , et al. January 3, 2

Patent Grant D775542

U.S. patent number D775,542 [Application Number D/528,113] was granted by the patent office on 2017-01-03 for sensor module. This patent grant is currently assigned to SAMSUNG ELECTRONICS CO., LTD.. The grantee listed for this patent is Samsung Electronics Co., Ltd.. Invention is credited to Lindsay Brown, Joseph J Kopp, Jr., Seulki Lee, Frank Nuovo, Sheldon George Phillips, Tom Torfs, Eva C. Wentink.


United States Patent D775,542
Phillips ,   et al. January 3, 2017

Sensor module

Claims

CLAIM The ornamental design for a sensor module, as shown and described.
Inventors: Phillips; Sheldon George (Glendale, CA), Nuovo; Frank (Los Angeles, CA), Kopp, Jr.; Joseph J (Fairfield, CA), Torfs; Tom (Kraainem, BE), Brown; Lindsay (Mierlo, NL), Lee; Seulki (Eindhoven, NL), Wentink; Eva C. (Eindhoven, NL)
Applicant:
Name City State Country Type

Samsung Electronics Co., Ltd.

Suwon-si

N/A

KR
Assignee: SAMSUNG ELECTRONICS CO., LTD. (Suwon-Si, KR)
Appl. No.: D/528,113
Filed: May 26, 2015

Related U.S. Patent Documents

Application Number Filing Date Patent Number Issue Date
29491648 May 22, 2014 D730219

Current U.S. Class: D10/103; D11/3
Current International Class: 1004
Field of Search: ;D10/30-39,65,70,78,97,98,103 ;D11/3 ;D13/173-177 ;D14/138R,203.5,247,338-340,344,346,347 ;D24/167,168

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Other References

Devices Worn on the Wrist, Vandrico Inc, http://vandrico.com/device-categories/location/wrist (pp. 1-14) (accessed Nov. 14, 2014). cited by applicant .
Devices Used for Lifestyle, Vandrico Inc., http://vandrico.com/device-categories/application/lifestyle (pp. 1-22) (accessed Nov. 14, 2014). cited by applicant .
Yoo, Jerald, et al., A 5.2 mW Self-Configured Wearable Body Sensor Network Controller and a 12.mu.W Wirelessly Powered Sensor for a Continuous Health Monitoring System, IEEE Journal of Solid-State Circuits, vol. 45, No. 1, (pp. 178-188), Jan. 2010. cited by applicant.

Primary Examiner: Davis; Antoine D
Attorney, Agent or Firm: McAndrews Held & Malloy, Ltd.

Description



FIG. 1 is a top left front perspective view of a sensor module showing our new design;

FIG. 2 is a rear elevation view thereof;

FIG. 3 is a front elevation view thereof;

FIG. 4 is a right side elevation view thereof;

FIG. 5 is a left side elevation view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a bottom right rear perspective view thereof.

The even length dashed broken lines illustrate portions of the sensor module that form no part of the claimed design.

Any views of the sensor module that are not shown in the figures form no part of the claimed design.

* * * * *

References


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