Fill pouch assembly for encapsulation device

Description

FIG. 1 is a perspective view of the DFPA from above the DFPA looking down;

FIG. 2 is a perspective view of the DFPA illustrated in FIG. 1 from below the DFPA, looking up;

FIG. 3 is a top plan view of the DFPA illustrated in FIG. 1;

FIG. 4 is a bottom plan view of the DFPA illustrated in FIG. 1;

FIG. 5 is a left side elevation of the DFPA illustrated in FIG. 1;

FIG. 6 is a right side elevation of the DFPA illustrated in FIG. 1;

FIG. 7 is a back view of the DFPA illustrated in FIG. 1; and,

FIG. 8 is a front view of the DFPA illustrated in FIG. 1.

Claims

CLAIM The ornamental design for fill pouch assembly for encapsulation device, as shown and described.

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Inventors:	Olson; Erik (San Diego, CA), Scott; Michael (San Diego, CA), Koenig; Donald (San Diego, CA)
Applicant:	Name City State Country Type ViaCyte, Inc. San Diego CA US
Assignee:	VIACYTE, INC. (San Diego, CA)
Appl. No.:	D/488,217
Filed:	April 16, 2014

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Current U.S. Class:	D9/707
Current International Class:	0905
Field of Search:	;D9/702-714,761,731,414,418,430-432,520-521,438,695-699,416,737 ;D7/590,600.1 ;215/328 ;222/92,105,215,145.1,95,183,107 ;383/9,22,59-60,901,207,209 ;D24/118,108,207,104 ;128/114.1,DIG.24 ;D28/8.1

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References Cited [Referenced By]

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U.S. Patent Documents

D336034	June 1993	Rebilas
D400253	October 1998	Niedospial et al.
D439328	March 2001	Nielsen
D552235	October 2007	Inoue et al.
D555787	November 2007	Inoue et al.
D567940	April 2008	Inoue et al.
D598784	August 2009	Anderson et al.
D603957	November 2009	Sato et al.
D610918	March 2010	Ueda
D619907	July 2010	Ueda
D662833	July 2012	Sanfilippo et al.
D700066	February 2014	Berman

Primary Examiner: Veynar; Caron D
Assistant Examiner: Bahta; Abraham
Attorney, Agent or Firm: Mayer & Williams PC Wieczorek; Mark D.