Electronics module

Description

FIG. 1 is a front perspective view of an electronics module according to our design;

FIG. 2 is a front view thereof;

FIG. 3 is a back view thereof;

FIG. 4 is a side view thereof;

FIG. 5 is an opposing side view thereof;

FIG. 6 is top view thereof;

FIG. 7 is a front perspective view of another embodiment of an electronics module according to our design;

FIG. 8 is a front view thereof;

FIG. 9 is a back view thereof;

FIG. 10 is a side view thereof;

FIG. 11 is an opposing side view thereof; and,

FIG. 12 is top view thereof.

The broken lines shown herein are for illustrative purposes only and form no part of the claimed design. The bottom views are disclaimed.

Claims

CLAIM The ornamental design for an electronics module, as shown and described.

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Inventors:	Gao; Bin (Shenzen, CN), Qi; Chuangqing (Shenzhen, CN), Su; Cheng (Shenzhin, CN)
Applicant:	Name City State Country Type Eaton Manufacturing LP, Glasgow, Succursale De Morges Morges N/A CH
Assignee:	Eaton Corporation (Cleveland, OH)
Appl. No.:	D/477,317
Filed:	December 20, 2013

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Foreign Application Priority Data

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Jun 21, 2013 [CN]			2013 3 0271893
Jun 21, 2013 [CN]			2013 3 0272421

Current U.S. Class:	D13/103
Current International Class:	1302
Field of Search:	;D13/102-104,110,118-121,184,199 ;429/96-100,163,176

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References Cited [Referenced By]

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U.S. Patent Documents

D281245	November 1985	Lewis
D307908	May 1990	Pushelberg
D380611	July 1997	Mancusi
D408796	April 1999	Georgopulos
D409582	May 1999	Falkenberg
D504399	April 2005	Peled et al.
D527390	August 2006	Millar et al.
D610539	February 2010	Dahan et al.
D616365	May 2010	Wang et al.
D699181	February 2014	Hung et al.

Primary Examiner: Tarcza; Rosemary K
Attorney, Agent or Firm: Myers Bigel Sibley & Sajovec, PA