U.S. patent number D731,412 [Application Number D/477,317] was granted by the patent office on 2015-06-09 for electronics module.
This patent grant is currently assigned to Eaton Corporation. The grantee listed for this patent is Eaton Manufacturing LP, Glasgow, Succursale De Morges. Invention is credited to Bin Gao, Chuangqing Qi, Cheng Su.
United States Patent |
D731,412 |
Gao , et al. |
June 9, 2015 |
Electronics module
Claims
CLAIM The ornamental design for an electronics module, as shown and
described.
Inventors: |
Gao; Bin (Shenzen,
CN), Qi; Chuangqing (Shenzhen, CN), Su;
Cheng (Shenzhin, CN) |
Applicant: |
Name |
City |
State |
Country |
Type |
Eaton Manufacturing LP, Glasgow, Succursale De Morges |
Morges |
N/A |
CH |
|
|
Assignee: |
Eaton Corporation (Cleveland,
OH)
|
Appl.
No.: |
D/477,317 |
Filed: |
December 20, 2013 |
Foreign Application Priority Data
|
|
|
|
|
Jun 21, 2013 [CN] |
|
|
2013 3 0271893 |
Jun 21, 2013 [CN] |
|
|
2013 3 0272421 |
|
Current U.S.
Class: |
D13/103 |
Current International
Class: |
1302 |
Field of
Search: |
;D13/102-104,110,118-121,184,199 ;429/96-100,163,176 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Tarcza; Rosemary K
Attorney, Agent or Firm: Myers Bigel Sibley & Sajovec,
PA
Description
FIG. 1 is a front perspective view of an electronics module
according to our design;
FIG. 2 is a front view thereof;
FIG. 3 is a back view thereof;
FIG. 4 is a side view thereof;
FIG. 5 is an opposing side view thereof;
FIG. 6 is top view thereof;
FIG. 7 is a front perspective view of another embodiment of an
electronics module according to our design;
FIG. 8 is a front view thereof;
FIG. 9 is a back view thereof;
FIG. 10 is a side view thereof;
FIG. 11 is an opposing side view thereof; and,
FIG. 12 is top view thereof.
The broken lines shown herein are for illustrative purposes only
and form no part of the claimed design. The bottom views are
disclaimed.
* * * * *