Sensor module

Phillips , et al. May 12, 2

Patent Grant D729089

U.S. patent number D729,089 [Application Number D/491,668] was granted by the patent office on 2015-05-12 for sensor module. This patent grant is currently assigned to Samsung Electronics Co., Ltd.. The grantee listed for this patent is Samsung Electronics Co., Ltd.. Invention is credited to Lindsay Brown, Frank Nuovo, Sheldon George Phillips, Tom Torfs.


United States Patent D729,089
Phillips ,   et al. May 12, 2015

Sensor module

Claims

CLAIM The ornamental design for a sensor module, as shown and described.
Inventors: Phillips; Sheldon George (Glendale, CA), Nuovo; Frank (Los Angeles, CA), Torfs; Tom (Kraainem, BE), Brown; Lindsay (Mierlo, NL)
Applicant:
Name City State Country Type

Samsung Electronics Co., Ltd.

Suwon-si

N/A

KR
Assignee: Samsung Electronics Co., Ltd. (Suwon-si, Gyeonggi-do, KR)
Appl. No.: D/491,668
Filed: May 22, 2014

Current U.S. Class: D10/103; D11/3
Current International Class: 1004
Field of Search: ;D10/30-39,65,70,78,97,98,103 ;D11/3 ;D13/173-177 ;D14/138R,203.5,247,338-340,344,346,347 ;D24/167,168

References Cited [Referenced By]

U.S. Patent Documents
D299718 February 1989 Steer et al.
D305422 January 1990 Steer et al.
D331020 November 1992 Ishii et al.
D455093 April 2002 Fitzgerald
D528439 September 2006 Burton
D528928 September 2006 Burton
D536265 February 2007 Reynoso
D538687 March 2007 Komulainen
D549602 August 2007 Oberrieder et al.
D550105 September 2007 Oberrieder et al.
D560520 January 2008 Oberrieder et al.
D569282 May 2008 Daniel
D573905 July 2008 Poirier
D610476 February 2010 Daniel
D645360 September 2011 Kiser et al.
D670583 November 2012 Shaanan
D672667 December 2012 Mix
Primary Examiner: Davis; Antoine D
Attorney, Agent or Firm: McAndrews Held & Malloy, Ltd.

Description



This application makes reference to:

U.S. Design application Ser. No. 29/491,674 filed May 22, 2014.

The above referenced application, and all of the subject matter disclosed therein, is incorporated herein by reference in its entirety.

FIG. 1 is a top left front perspective view of a sensor module showing our new design;

FIG. 2 is a rear elevation view thereof;

FIG. 3 is a front elevation view thereof;

FIG. 4 is a right side elevation view thereof;

FIG. 5 is a left side elevation view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a bottom right rear perspective view thereof; and,

FIG. 9 is an enlarged view of the portion encircled in FIG. 1.

The dashed broken lines are for environmental purposes only and form no part of the claimed design.

The dashed broken lines in FIG. 1 labeled with the number "9" encircle a portion of the claimed design that is illustrated in an enlargement in FIG. 9.

Any views of the sensor module that are not shown in the figures form no part of the claimed design.

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