U.S. patent number D725,591 [Application Number D/457,928] was granted by the patent office on 2015-03-31 for mobile power pack for electronic device.
This patent grant is currently assigned to Chi Mei Communication Systems, Inc.. The grantee listed for this patent is Chi Mei Communication Systems, Inc.. Invention is credited to Ho-An Chen, Shih-Chieh Chien, Chia-Chia Huang, Tzu-Cheng Yu.
United States Patent |
D725,591 |
Chien , et al. |
March 31, 2015 |
Mobile power pack for electronic device
Claims
CLAIM The ornamental design for a mobile power pack for electronic
device, as shown and described.
Inventors: |
Chien; Shih-Chieh (New Taipei,
TW), Huang; Chia-Chia (New Taipei, TW),
Chen; Ho-An (New Taipei, TW), Yu; Tzu-Cheng
(Santa Clara, CA) |
Applicant: |
Name |
City |
State |
Country |
Type |
Chi Mei Communication Systems, Inc. |
New Taipei |
N/A |
TW |
|
|
Assignee: |
Chi Mei Communication Systems,
Inc. (New Taipei, TW)
|
Appl.
No.: |
D/457,928 |
Filed: |
June 14, 2013 |
Foreign Application Priority Data
|
|
|
|
|
May 10, 2013 [TW] |
|
|
102303362 A |
|
Current U.S.
Class: |
D13/108;
D13/103 |
Current International
Class: |
1302 |
Field of
Search: |
;D13/102-110,118-119,184,199 ;D14/356,432
;320/103,111-115,135-146 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Tarcza; Rosemary K
Attorney, Agent or Firm: Novak Druce Connolly Bove + Quigg
LLP
Description
FIG. 1 is a perspective view of a mobile power pack for electronic
device showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a perspective view thereof when in a use.
The broken lines of all the figures are for the purpose of
illustrating environment and forms no part of the claimed
design.
* * * * *