U.S. patent number D717,461 [Application Number D/467,208] was granted by the patent office on 2014-11-11 for add-on sample buffer module.
This patent grant is currently assigned to Hitachi High-Technologies Corporation. The grantee listed for this patent is Hitachi High-Technologies Corporation. Invention is credited to Mitsuru Oonuma, Yoko Sato, Kazuma Tamura, Naoto Tsujimura.
United States Patent |
D717,461 |
Oonuma , et al. |
November 11, 2014 |
Add-on sample buffer module
Claims
CLAIM We claim the ornamental design for an add-on sample buffer
module, as shown and described.
Inventors: |
Oonuma; Mitsuru (Tokyo,
JP), Sato; Yoko (Fuchu, JP), Tsujimura;
Naoto (Hitachinaka, JP), Tamura; Kazuma
(Hitachinaka, JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
Hitachi High-Technologies Corporation |
Tokyo |
N/A |
JP |
|
|
Assignee: |
Hitachi High-Technologies
Corporation (Tokyo, JP)
|
Appl.
No.: |
D/467,208 |
Filed: |
September 17, 2013 |
Foreign Application Priority Data
|
|
|
|
|
Mar 21, 2013 [JP] |
|
|
2013-006211 |
|
Current U.S.
Class: |
D24/216 |
Current International
Class: |
2401 |
Field of
Search: |
;D24/216,217,219,223,231,232,233,107,169,186 ;D10/81
;422/500,547,62-65,67 ;435/287.1,287.3 ;436/43,45,47 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
Other References
JP Office Action Appln. No. D 2013-006211 dated Oct. 1, 2013 in the
counterpart application with partial English translation. cited by
applicant .
Prototype correspondent to the design of JP D 1470282 S; Prototype
Exhibition Date:Oct. 11, 2012; Prototype Exhibited Country: Japan;
Exhibitor Name: Hitachi High-Technologies Corporation with partial
English translation. cited by applicant.
|
Primary Examiner: Doan; Anhdao
Attorney, Agent or Firm: Antonelli, Terry, Stout &
Kraus, LLP.
Description
FIG. 1 is a front, top and right side perspective view of a first
embodiment of an add-on sample buffer module showing our new
design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a right side elevational view thereof shown in an opened
position.
FIG. 9 is a front, top and right side perspective view of a second
embodiment of an add-on sample buffer module showing our new
design;
FIG. 10 is a front elevational view thereof;
FIG. 11 is a rear elevational view thereof;
FIG. 12 is a left side elevational view thereof;
FIG. 13 is a right side elevational view thereof;
FIG. 14 is a top plan view thereof;
FIG. 15 is a bottom plan view thereof; and,
FIG. 16 is a right side elevational view thereof shown in an opened
position.
The broken lines shown are for illustrative purpose and form no
part of the claimed design.
* * * * *