Add-on sample buffer module

Oonuma , et al. November 11, 2

Patent Grant D717461

U.S. patent number D717,461 [Application Number D/467,208] was granted by the patent office on 2014-11-11 for add-on sample buffer module. This patent grant is currently assigned to Hitachi High-Technologies Corporation. The grantee listed for this patent is Hitachi High-Technologies Corporation. Invention is credited to Mitsuru Oonuma, Yoko Sato, Kazuma Tamura, Naoto Tsujimura.


United States Patent D717,461
Oonuma ,   et al. November 11, 2014

Add-on sample buffer module

Claims

CLAIM We claim the ornamental design for an add-on sample buffer module, as shown and described.
Inventors: Oonuma; Mitsuru (Tokyo, JP), Sato; Yoko (Fuchu, JP), Tsujimura; Naoto (Hitachinaka, JP), Tamura; Kazuma (Hitachinaka, JP)
Applicant:
Name City State Country Type

Hitachi High-Technologies Corporation

Tokyo

N/A

JP
Assignee: Hitachi High-Technologies Corporation (Tokyo, JP)
Appl. No.: D/467,208
Filed: September 17, 2013

Foreign Application Priority Data

Mar 21, 2013 [JP] 2013-006211
Current U.S. Class: D24/216
Current International Class: 2401
Field of Search: ;D24/216,217,219,223,231,232,233,107,169,186 ;D10/81 ;422/500,547,62-65,67 ;435/287.1,287.3 ;436/43,45,47

References Cited [Referenced By]

U.S. Patent Documents
D653766 February 2012 Oonuma et al.
D655422 March 2012 Oonuma et al.
D655823 March 2012 Oonuma et al.
2008/0019868 January 2008 Okumoto et al.
Foreign Patent Documents
D 1414663 May 2011 JP

Other References

JP Office Action Appln. No. D 2013-006211 dated Oct. 1, 2013 in the counterpart application with partial English translation. cited by applicant .
Prototype correspondent to the design of JP D 1470282 S; Prototype Exhibition Date:Oct. 11, 2012; Prototype Exhibited Country: Japan; Exhibitor Name: Hitachi High-Technologies Corporation with partial English translation. cited by applicant.

Primary Examiner: Doan; Anhdao
Attorney, Agent or Firm: Antonelli, Terry, Stout & Kraus, LLP.

Description



FIG. 1 is a front, top and right side perspective view of a first embodiment of an add-on sample buffer module showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a right side elevational view thereof shown in an opened position.

FIG. 9 is a front, top and right side perspective view of a second embodiment of an add-on sample buffer module showing our new design;

FIG. 10 is a front elevational view thereof;

FIG. 11 is a rear elevational view thereof;

FIG. 12 is a left side elevational view thereof;

FIG. 13 is a right side elevational view thereof;

FIG. 14 is a top plan view thereof;

FIG. 15 is a bottom plan view thereof; and,

FIG. 16 is a right side elevational view thereof shown in an opened position.

The broken lines shown are for illustrative purpose and form no part of the claimed design.

* * * * *


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