Woven embellishment

Sappenfield-Chan October 28, 2

Patent Grant D716053

U.S. patent number D716,053 [Application Number D/466,791] was granted by the patent office on 2014-10-28 for woven embellishment. This patent grant is currently assigned to Market International Organization. The grantee listed for this patent is Market International Organization. Invention is credited to Kate Sappenfield-Chan.


United States Patent D716,053
Sappenfield-Chan October 28, 2014

Woven embellishment

Claims

CLAIM What is claimed is the ornamental design for a woven embellishment, as shown and described.
Inventors: Sappenfield-Chan; Kate (Coronado, CA)
Applicant:
Name City State Country Type

Market International Organization

Coronado

CA

US
Assignee: Market International Organization (Coronado, CA)
Appl. No.: D/466,791
Filed: September 11, 2013

Current U.S. Class: D3/322
Current International Class: 0301
Field of Search: ;D2/604,609 ;D3/10,207,234,271.8,277,318,322,325 ;D5/18,19,23,54,56,63 ;D11/1-3,6-8,43,44,54,79,81,84,86,89,130,184 ;63/1.11,1.16,18-20 ;150/100,103,104,107-110,114,118-119

References Cited [Referenced By]

U.S. Patent Documents
D249132 August 1978 Barr
D250939 January 1979 Barr
D414931 October 1999 Palmer
D507867 August 2005 Turner
D520898 May 2006 Sugama
D521894 May 2006 Sugama
D577629 September 2008 Chen

Other References

https://www.facebook.com/media/set/?set=a.289430097816770.66278.2265464807- 71799&type=3#!/photo.php?fbid=289430534483393&set=a.289430097816770.66278.- 226546480771799&type=3&theater; Kate Chan; May 14,2012. cited by examiner.

Primary Examiner: Johannes; Thomas
Assistant Examiner: Thurman; Holly E
Attorney, Agent or Firm: Dhand Law PC

Description



FIG. 1 is a perspective view of a woven embellishment showing my new design in environmental use;

FIG. 2 is another perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a bottom view thereof; and,

FIG. 5 is a top view thereof.

The broken lines depict unclaimed subject matter only, which form no part of the claimed design.

* * * * *

References


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