U.S. patent number D712,851 [Application Number D/456,955] was granted by the patent office on 2014-09-09 for light emitting diode package.
This patent grant is currently assigned to Lextar Electronics Corporation. The grantee listed for this patent is Lextar Electronics Corp.. Invention is credited to Pei-Song Cai, Shing-Kuo Chen, Chun-Wei Wang.
United States Patent |
D712,851 |
Cai , et al. |
September 9, 2014 |
Light emitting diode package
Claims
CLAIM The ornamental design for a light emitting diode package, as
shown and described.
Inventors: |
Cai; Pei-Song (Miao Li County,
TW), Chen; Shing-Kuo (Taipei, TW), Wang;
Chun-Wei (New Taipei, TW) |
Applicant: |
Name |
City |
State |
Country |
Type |
Lextar Electronics Corp. |
Hsinchu |
N/A |
TW |
|
|
Assignee: |
Lextar Electronics Corporation
(Hsinchu, TW)
|
Appl.
No.: |
D/456,955 |
Filed: |
June 5, 2013 |
Foreign Application Priority Data
|
|
|
|
|
Dec 27, 2012 [TW] |
|
|
101307819 |
|
Current U.S.
Class: |
D13/180 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/180 ;D26/1
;257/79,80,81,88,89,95,98,99,100,E33.058 ;313/483,498,500
;362/555,800 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Schmeiser, Olsen & Watts
LLP
Description
FIG. 1 is a front perspective view of a light emitting diode
package showing the new design;
FIG. 2 is another perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a top plan view thereof; and,
FIG. 8 is a bottom plan view thereof.
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