U.S. patent number D712,392 [Application Number D/461,075] was granted by the patent office on 2014-09-02 for electronic device shell with cover.
This patent grant is currently assigned to BlackBerry Limited. The grantee listed for this patent is Blackberry Limited. Invention is credited to Cortez Corley, Caitlin Curran-Blaney, Anders Fahrendorff, Ian James Murchison, Alison Phillips.
United States Patent |
D712,392 |
Corley , et al. |
September 2, 2014 |
Electronic device shell with cover
Claims
CLAIM The ornamental design for an electronic device shell with
cover, as shown and described.
Inventors: |
Corley; Cortez (Waterloo,
CA), Curran-Blaney; Caitlin (Toronto, CA),
Fahrendorff; Anders (Ottawa, CA), Phillips;
Alison (Toronto, CA), Murchison; Ian James
(Ottawa, CA) |
Applicant: |
Name |
City |
State |
Country |
Type |
Blackberry Limited |
Waterloo |
N/A |
CA |
|
|
Assignee: |
BlackBerry Limited (Waterloo,
Ontario, CA)
|
Appl.
No.: |
D/461,075 |
Filed: |
July 18, 2013 |
Current U.S.
Class: |
D14/250 |
Current International
Class: |
1403 |
Field of
Search: |
;D14/250-253,440,203.3-203.7,217,496,248,238.1,240,447,341-347,444
;D13/103,107-108,119 ;D3/201,218,247,269,273,301,303
;248/176.3,188.8,309.1,371,668
;361/220,379.01,679.01,679.02,679.09,679.21,679.25,679.3,679.4,679.56,679.57,759,807,816
;379/433.11,451,455 ;455/556.1,557,566,575.1,575.2,575.8
;206/37,45.2,305,320,216 ;320/108,115 ;429/96 ;220/4.02 ;150/165
;174/50 ;235/41,375,462 ;312/223.1 ;396/535 |
References Cited
[Referenced By]
U.S. Patent Documents
Other References
Review of Leather Flip Shell Case for the BlackBerry Q5, published
on Nov. 14, 2013,
<URL:http://nerdberry.net/2013/11/14/video-review-leather-fl-
ip-shell-case-for-the-blackberry-q5/>, retrieved from internet
on May 3, 2014. cited by examiner.
|
Primary Examiner: Wright; Carla Jobe
Description
FIG. 1 is a front perspective view of an electronic device shell
with cover;
FIG. 2 is a rear perspective view thereof;
FIG. 3 is a front elevation view thereof;
FIG. 4 is a rear elevation view thereof;
FIG. 5 is a right side elevation view thereof;
FIG. 6 is a left side elevation view thereof;
FIG. 7 is a top plan view thereof;
FIG. 8 is a bottom plan view thereof;
FIG. 9 is a front perspective view showing the electronic device
shell with cover in another configuration;
FIG. 10 is a rear perspective view thereof;
FIG. 11 is a front elevation view thereof;
FIG. 12 is a rear elevation view thereof;
FIG. 13 is a left side elevation view thereof;
FIG. 14 is a right side elevation view thereof;
FIG. 15 is a top plan view thereof; and,
FIG. 16 is a bottom plan view thereof.
Broken lines shown in the drawings depict stitching which is part
of the claimed design.
* * * * *
References