U.S. patent number D704,674 [Application Number D/395,887] was granted by the patent office on 2014-05-13 for headphone.
This patent grant is currently assigned to Sony Corporation. The grantee listed for this patent is Yosuke Shimizu. Invention is credited to Yosuke Shimizu.
United States Patent |
D704,674 |
Shimizu |
May 13, 2014 |
Headphone
Claims
CLAIM The ornamental design for a headphone, as shown and
described.
Inventors: |
Shimizu; Yosuke (Tokyo,
JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
Shimizu; Yosuke |
Tokyo |
N/A |
JP |
|
|
Assignee: |
Sony Corporation (Tokyo,
JP)
|
Family
ID: |
50636093 |
Appl.
No.: |
D/395,887 |
Filed: |
April 18, 2012 |
Foreign Application Priority Data
|
|
|
|
|
Oct 19, 2011 [JP] |
|
|
2011-023999 |
|
Current U.S.
Class: |
D14/205 |
Current CPC
Class: |
H04R1/1066 20130101 |
Current International
Class: |
1401 |
Field of
Search: |
;D14/205,206,223
;181/129,130,135 ;379/430,431 ;381/380,381 ;D24/174
;455/90.3,575.1 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Greene; Paula
Attorney, Agent or Firm: Rader, Fishman & Grauer
PLLC
Description
FIG. 1 is a perspective view of a headphone showing my new
design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The portions indicated in broken lines are for illustrative
purposes only and form no part of the claimed design.
* * * * *