Headphone

Shimizu May 13, 2

Patent Grant D704674

U.S. patent number D704,674 [Application Number D/395,887] was granted by the patent office on 2014-05-13 for headphone. This patent grant is currently assigned to Sony Corporation. The grantee listed for this patent is Yosuke Shimizu. Invention is credited to Yosuke Shimizu.


United States Patent D704,674
Shimizu May 13, 2014

Headphone

Claims

CLAIM The ornamental design for a headphone, as shown and described.
Inventors: Shimizu; Yosuke (Tokyo, JP)
Applicant:
Name City State Country Type

Shimizu; Yosuke

Tokyo

N/A

JP
Assignee: Sony Corporation (Tokyo, JP)
Family ID: 50636093
Appl. No.: D/395,887
Filed: April 18, 2012

Foreign Application Priority Data

Oct 19, 2011 [JP] 2011-023999
Current U.S. Class: D14/205
Current CPC Class: H04R1/1066 20130101
Current International Class: 1401
Field of Search: ;D14/205,206,223 ;181/129,130,135 ;379/430,431 ;381/380,381 ;D24/174 ;455/90.3,575.1

References Cited [Referenced By]

U.S. Patent Documents
3192321 June 1965 Nassimbene
D346802 May 1994 Sacherman et al.
D348066 June 1994 Lucey
5615273 March 1997 Lucey et al.
D409621 May 1999 Andrea
D465209 November 2002 Rath
D476645 July 2003 Padala et al.
D477821 July 2003 Bieltvedt et al.
D481709 November 2003 Solderits
D482348 November 2003 Villaverde et al.
D503705 April 2005 Boursiquot
D525235 July 2006 Koizumi
D587243 February 2009 Suzuki
D598901 August 2009 Lee et al.
Primary Examiner: Greene; Paula
Attorney, Agent or Firm: Rader, Fishman & Grauer PLLC

Description



FIG. 1 is a perspective view of a headphone showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The portions indicated in broken lines are for illustrative purposes only and form no part of the claimed design.

* * * * *


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