Headphone

Description

FIG. 1 is a front elevational view of a headphone showing our new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a first perspective view thereof; and,

FIG. 7 is a second perspective view thereof.

The left side elevational view is a mirror image of the right side shown in FIG. 3.

Claims

CLAIM The ornamental design for a headphone, as shown and described.

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Inventors:	Davies; John Simon (Kwai Chung, HK), Chang; Jack Yang (Kwai Chung, HK)
Applicant:	Name City State Country Type GP Acoustics International Limited Kwai Chung N/A HK
Assignee:	GP Acoustics International Limited (Hong Kong, HK)
Family ID:	50553224
Appl. No.:	D/449,663
Filed:	March 15, 2013

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Current U.S. Class:	D14/205
Current CPC Class:	H04S1/005 20130101
Current International Class:	1401
Field of Search:	;D14/205,206 ;D29/112 ;2/209 ;181/129,130,135 ;379/430,431 ;381/380,381,384 ;455/90.3,575.1

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References Cited [Referenced By]

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U.S. Patent Documents

5095382	March 1992	Abe
D351172	October 1994	Nakamura et al.
D358389	May 1995	Isono
D381336	July 1997	Bungardt et al.
D512708	December 2005	Harris et al.
D585871	February 2009	Lee
D617770	June 2010	Sanguinetti et al.
D660823	May 2012	Hardi et al.
D662080	June 2012	Carr et al.
D665775	August 2012	Katsumata
D669450	October 2012	Katsumata
D673136	December 2012	Kelly et al.
D693791	November 2013	Troy

Primary Examiner: Greene; Paula
Attorney, Agent or Firm: Nixon Peabody LLP Costellia; Jeffrey L.