U.S. patent number D700,896 [Application Number D/426,046] was granted by the patent office on 2014-03-11 for heat medium relay unit.
This patent grant is currently assigned to Mitsubishi Electric Corporation. The grantee listed for this patent is Koji Azuma, Takayoshi Honda, Osamu Morimoto, Yuji Motomura, Koji Nishioka, Daisuke Shimamoto. Invention is credited to Koji Azuma, Takayoshi Honda, Osamu Morimoto, Yuji Motomura, Koji Nishioka, Daisuke Shimamoto.
United States Patent |
D700,896 |
Shimamoto , et al. |
March 11, 2014 |
Heat medium relay unit
Claims
CLAIM The ornamental design for a heat medium relay unit, as shown
and described.
Inventors: |
Shimamoto; Daisuke (Chiyoda-ku,
JP), Morimoto; Osamu (Chiyoda-ku, JP),
Motomura; Yuji (Chiyoda-ku, JP), Honda; Takayoshi
(Chiyoda-ku, JP), Azuma; Koji (Chiyoda-ku,
JP), Nishioka; Koji (Chiyoda-ku, JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
Shimamoto; Daisuke
Morimoto; Osamu
Motomura; Yuji
Honda; Takayoshi
Azuma; Koji
Nishioka; Koji |
Chiyoda-ku
Chiyoda-ku
Chiyoda-ku
Chiyoda-ku
Chiyoda-ku
Chiyoda-ku |
N/A
N/A
N/A
N/A
N/A
N/A |
JP
JP
JP
JP
JP
JP |
|
|
Assignee: |
Mitsubishi Electric Corporation
(Tokyo, JP)
|
Appl.
No.: |
D/426,046 |
Filed: |
June 29, 2012 |
Foreign Application Priority Data
|
|
|
|
|
Jan 27, 2012 [JP] |
|
|
2012-001561 |
Jan 27, 2012 [JP] |
|
|
2012-001562 |
|
Current U.S.
Class: |
D13/159 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/146-147,154,184
;439/532,536,540.1,541.5,613,614,884,894,954,559 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Johannes; Thomas
Attorney, Agent or Firm: Sughrue Mion, PLLC
Description
FIG. 1 is a front, top and right side perspective view of a heat
medium relay unit, showing our new design;
FIG. 2 is a rear, top and left side perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a top plan view thereof; and,
FIG. 8 is a bottom plan view thereof.
* * * * *