Light emitting diode package

Description

FIG. 1 is a front perspective view of a light emitting diode package showing the new design;

FIG. 2 is another perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

Claims

CLAIM The ornamental design for a light emitting diode package, as shown and described.

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Inventors:	Ko; Bo-Yu (New Taipei, TW), Wang; Chun-Wei (New Taipei, TW), Cai; Pei-Song (Miao Li County, TW)
Applicant:	Name City State Country Type Lextar Electronics Corp. Hsinchu N/A TW
Assignee:	Lextar Electronics Corporation (Hsinchu, TW)
Appl. No.:	D/438,204
Filed:	November 27, 2012

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Foreign Application Priority Data

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Jul 12, 2012 [TW]			101304060

Current U.S. Class:	D13/180
Current International Class:	1303
Field of Search:	;D13/180 ;D26/1 ;257/79,80,81,88,89,95,98,99,100,E33.058 ;313/483,498,500 ;362/555,800

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References Cited [Referenced By]

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U.S. Patent Documents

D505397	May 2005	Asakawa
D517025	March 2006	Asakawa
D520965	May 2006	Omata
D563333	March 2008	Kim et al.
D568261	May 2008	Lee et al.
D576573	September 2008	Kobayakawa
D592617	May 2009	Bando
D593967	June 2009	Fushimi
D619110	July 2010	Lin et al.
D624885	October 2010	Lin et al.
D662902	July 2012	Shieh et al.
D674361	January 2013	Lin et al.
2012/0104426	May 2012	Chan et al.

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Schmeiser, Olsen & Watts LLP