LED chip

Edmond , et al. October 15, 2

Patent Grant D691569

U.S. patent number D691,569 [Application Number D/388,240] was granted by the patent office on 2013-10-15 for led chip. This patent grant is currently assigned to Cree, Inc.. The grantee listed for this patent is Michael J. Bergmann, Matthew Donofrio, John A. Edmond, Winston T. Parker. Invention is credited to Michael J. Bergmann, Matthew Donofrio, John A. Edmond, Winston T. Parker.


United States Patent D691,569
Edmond ,   et al. October 15, 2013

LED chip

Claims

CLAIM The ornamental design for a LED chip, as shown and described.
Inventors: Edmond; John A. (Durham, NC), Bergmann; Michael J. (Chapel Hill, NC), Donofrio; Matthew (Raleigh, NC), Parker; Winston T. (Cary, NC)
Applicant:
Name City State Country Type

Edmond; John A.
Bergmann; Michael J.
Donofrio; Matthew
Parker; Winston T.

Durham
Chapel Hill
Raleigh
Cary

NC
NC
NC
NC

US
US
US
US
Assignee: Cree, Inc. (Durham, NC)
Appl. No.: D/388,240
Filed: March 25, 2011

Current U.S. Class: D13/180
Current International Class: 1303
Field of Search: ;D13/180 ;D26/2 ;257/79,80,81,88,89,95,98,99,100 ;313/483,498,500 ;362/555,800

References Cited [Referenced By]

U.S. Patent Documents
6097040 August 2000 Morimoto et al.
6255129 July 2001 Lin
6383835 May 2002 Hata et al.
6498592 December 2002 Matthies
6518598 February 2003 Chen
6614056 September 2003 Tarsa et al.
6693306 February 2004 Chen et al.
6713868 March 2004 Ueno
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6870519 March 2005 Sundahl
D521952 May 2006 Yamada et al.
D522466 June 2006 Sumitani
7095061 August 2006 Steigerwald et al.
7289089 October 2007 Iwafuchi
D566056 April 2008 Edmond et al.
D566057 April 2008 Edmond et al.
D566665 April 2008 Liao et al.
7429755 September 2008 Hsu
D582865 December 2008 Edmond et al.
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D583338 December 2008 Edmond et al.
D599748 September 2009 Liu
D602450 October 2009 Edmond et al.
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D635525 April 2011 Edmond et al.
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Foreign Patent Documents
D1233259 Mar 2005 JP
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D109667 Mar 1993 TW
D112798 Aug 1994 TW

Other References

Image of "Lumileds LED" No. 4 (Oct. 2-4, 2002), 1 page. cited by applicant .
Image of OSRAM chip No. 3 (prior to Dec. 29, 2005), 1 page. cited by applicant .
Color Photos--Lumileds LEDs No. 2 (for exam purposes, date is assumed to be before Dec. 21, 2006), 1 page. cited by applicant .
SemiLEDS "Products", http://www.semileds.com/en.sub.--04product.asp (2006), 2 pages. cited by applicant .
Lumileds LED die; Philips/Lumileds Light from Silicon Valley "LED Die," pp. 1-2, http://www.lumileds.com/products/line.cm?lineID=16 (2006). cited by applicant .
Taiwanese Office Action and English Translation corresponding to Taiwanese Patent Application No. 097301339 dated Dec. 30, 2008. cited by applicant .
Non-Final Office Action for U.S. Appl. No. 29/335,819 dated Nov. 6, 2009. cited by applicant .
Notice of Allowance for U.S. Appl. No. 29/335,819 dated Dec. 6, 2010. cited by applicant.

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Jenkins, Wilson, Taylor & Hunt, P.A.

Description



FIG. 1 is a top perspective view of an LED chip showing our design;

FIG. 2 is a top view thereof;

FIG. 3 is a first side view thereof;

FIG. 4 is a bottom view thereof;

FIG. 5 is a different side view thereof;

FIG. 6 is an end view thereof;

FIG. 7 is an opposing end view thereof;

FIG. 8 is a top perspective view of the LED chip of FIG. 1 with the top surface removed;

FIG. 9 is a top view thereof;

FIG. 10 is a first side view thereof;

FIG. 11 is a bottom view thereof;

FIG. 12 is a different side view thereof;

FIG. 13 is an end view thereof; and,

FIG. 14 is an opposing end view thereof.

The broken lines are for illustrative purposes only and form no part of the claimed design.

* * * * *

References


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