U.S. patent number D684,129 [Application Number D/422,054] was granted by the patent office on 2013-06-11 for electronics enclosure.
This patent grant is currently assigned to GE Intelligent Platforms, Inc. The grantee listed for this patent is Kenneth Wayne Crawford, Vinson R. Epperson, Laith Anthony Vincent. Invention is credited to Kenneth Wayne Crawford, Vinson R. Epperson, Laith Anthony Vincent.
United States Patent |
D684,129 |
Vincent , et al. |
June 11, 2013 |
Electronics enclosure
Claims
CLAIM The ornamental design for an electronics enclosure, as shown
and described.
Inventors: |
Vincent; Laith Anthony
(Charlottesville, VA), Crawford; Kenneth Wayne
(Charlottesville, VA), Epperson; Vinson R. (Ruckersville,
VA) |
Applicant: |
Name |
City |
State |
Country |
Type |
Vincent; Laith Anthony
Crawford; Kenneth Wayne
Epperson; Vinson R. |
Charlottesville
Charlottesville
Ruckersville |
VA
VA
VA |
US
US
US |
|
|
Assignee: |
GE Intelligent Platforms, Inc
(Charlottesville, VA)
|
Appl.
No.: |
D/422,054 |
Filed: |
May 16, 2012 |
Current U.S.
Class: |
D13/184 |
Current International
Class: |
1303 |
Field of
Search: |
;D14/300,301,308,314,348,349-356,358 ;D13/162,184,199
;312/223.1-223.2 ;360/99.01-99.12 ;369/34.01,36.01
;361/679.01,679.6,679.22 ;345/173 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Nunn; Freda S
Attorney, Agent or Firm: Global Patent Operation Conklin;
Mark A.
Description
FIG. 1 is a perspective view of our design;
FIG. 2 is a top plan view of the embodiment of FIG. 1;
FIG. 3 is a side elevational view of the embodiment of FIG. 1, the
opposite side being a mirror image thereof;
FIG. 4 is a front elevational view of the embodiment of FIG. 1;
FIG. 5 is a back view of the embodiment of FIG. 1;
FIG. 6 is a perspective view of a second embodiment of our
design;
FIG. 7 is a top plan view of the embodiment of FIG. 6;
FIG. 8 is a side elevational view of the embodiment of FIG. 6, the
opposite side being a mirror image thereof;
FIG. 9 is a front view of the embodiment of FIG. 6;
FIG. 10 is a back view of the embodiment of FIG. 6;
FIG. 11 is a perspective view of a third embodiment of our
design;
FIG. 12 is a top plan view of the embodiment of FIG. 11;
FIG. 13 is a side elevational view of the embodiment of FIG. 11,
the opposite side being a mirror image thereof;
FIG. 14 is a front view of the embodiment of FIG. 11;
FIG. 15 is a back view of the embodiment of FIG. 11; and,
FIG. 16 is a bottom view of the embodiment of FIG. 11.
Broken lines shown in the drawings illustrate portions of the
electronics enclosure, and form no part of the claimed design.
* * * * *